JP4995788B2 - 部品実装システム、部品実装方法、印刷条件データ作成装置および印刷機 - Google Patents

部品実装システム、部品実装方法、印刷条件データ作成装置および印刷機 Download PDF

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Publication number
JP4995788B2
JP4995788B2 JP2008216829A JP2008216829A JP4995788B2 JP 4995788 B2 JP4995788 B2 JP 4995788B2 JP 2008216829 A JP2008216829 A JP 2008216829A JP 2008216829 A JP2008216829 A JP 2008216829A JP 4995788 B2 JP4995788 B2 JP 4995788B2
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jig
printing
fpc
component mounting
substrates
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Japanese (ja)
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JP2010056141A (ja
JP2010056141A5 (enrdf_load_stackoverflow
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章至 藤
直文 田中
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Yamaha Motor Co Ltd
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Yamaha Motor Co Ltd
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2008216829A 2008-08-26 2008-08-26 部品実装システム、部品実装方法、印刷条件データ作成装置および印刷機 Active JP4995788B2 (ja)

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JP2008216829A JP4995788B2 (ja) 2008-08-26 2008-08-26 部品実装システム、部品実装方法、印刷条件データ作成装置および印刷機

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JP2008216829A JP4995788B2 (ja) 2008-08-26 2008-08-26 部品実装システム、部品実装方法、印刷条件データ作成装置および印刷機

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JP2010056141A JP2010056141A (ja) 2010-03-11
JP2010056141A5 JP2010056141A5 (enrdf_load_stackoverflow) 2011-06-16
JP4995788B2 true JP4995788B2 (ja) 2012-08-08

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102140645B1 (ko) 2013-04-22 2020-08-04 삼성디스플레이 주식회사 디스플레이 제조 장치
CN106304658B (zh) * 2016-11-11 2018-09-14 伟时电子股份有限公司 Fpc贴附机构
CN112074085B (zh) * 2020-08-08 2025-08-19 广州裕申电子科技有限公司 带有信息跟踪系统的全自动智能生产线
CN113747668B (zh) * 2021-09-01 2023-01-24 西玛特易联（苏州）科技有限公司 一种pcb板对位装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000021541A (ja) * 1998-07-03 2000-01-21 Nippon Avionics Co Ltd 半田バンプ形成装置及び半田バンプ形成方法
JP4597435B2 (ja) * 2000-08-29 2010-12-15 パナソニック株式会社 部品実装方法および部品実装装置
JP4798888B2 (ja) * 2001-08-06 2011-10-19 パナソニック株式会社 オフセット測定方法
JP4363093B2 (ja) * 2003-06-25 2009-11-11 株式会社日立プラントテクノロジー スクリーン印刷機
JP4619896B2 (ja) * 2004-08-20 2011-01-26 パナソニック株式会社 基準位置決定方法及び基準位置決定装置並びに接合材料の印刷方法及び印刷装置

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