JP4995491B2 - 銅被膜の製造方法 - Google Patents

銅被膜の製造方法 Download PDF

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Publication number
JP4995491B2
JP4995491B2 JP2006154506A JP2006154506A JP4995491B2 JP 4995491 B2 JP4995491 B2 JP 4995491B2 JP 2006154506 A JP2006154506 A JP 2006154506A JP 2006154506 A JP2006154506 A JP 2006154506A JP 4995491 B2 JP4995491 B2 JP 4995491B2
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Prior art keywords
copper
firing
substrate
atmosphere
amine compound
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JP2006154506A
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Japanese (ja)
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JP2007324025A (ja
JP2007324025A5 (https=
Inventor
博信 小野
高明 橋本
昌秀 島
暢文 杉尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Shokubai Co Ltd
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Nippon Shokubai Co Ltd
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Priority to JP2006154506A priority Critical patent/JP4995491B2/ja
Publication of JP2007324025A publication Critical patent/JP2007324025A/ja
Publication of JP2007324025A5 publication Critical patent/JP2007324025A5/ja
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Publication of JP4995491B2 publication Critical patent/JP4995491B2/ja
Expired - Fee Related legal-status Critical Current
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  • Paints Or Removers (AREA)
  • Powder Metallurgy (AREA)
  • Non-Insulated Conductors (AREA)
JP2006154506A 2006-06-02 2006-06-02 銅被膜の製造方法 Expired - Fee Related JP4995491B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006154506A JP4995491B2 (ja) 2006-06-02 2006-06-02 銅被膜の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006154506A JP4995491B2 (ja) 2006-06-02 2006-06-02 銅被膜の製造方法

Publications (3)

Publication Number Publication Date
JP2007324025A JP2007324025A (ja) 2007-12-13
JP2007324025A5 JP2007324025A5 (https=) 2009-02-12
JP4995491B2 true JP4995491B2 (ja) 2012-08-08

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ID=38856642

Family Applications (1)

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JP2006154506A Expired - Fee Related JP4995491B2 (ja) 2006-06-02 2006-06-02 銅被膜の製造方法

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JP (1) JP4995491B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023110342A (ja) * 2022-01-28 2023-08-09 セイコーエプソン株式会社 積層造形用粉末および金属焼結体の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3630920B2 (ja) * 1997-05-02 2005-03-23 株式会社アルバック 金属ペーストの焼成方法
JP3764349B2 (ja) * 2001-05-07 2006-04-05 ハリマ化成株式会社 金属微粒子分散液を用いたメッキ代替導電性金属皮膜の形成方法
JP2004006613A (ja) * 2002-04-12 2004-01-08 Mitsui Mining & Smelting Co Ltd プリント配線板用銅箔及びそのプリント配線板用銅箔の製造方法並びにそのプリント配線板用銅箔を用いた銅張積層板
JP2004164876A (ja) * 2002-11-11 2004-06-10 Asahi Kasei Corp 金属被膜の製造方法
JP4761110B2 (ja) * 2005-01-28 2011-08-31 住友電気工業株式会社 金属被膜とその形成方法

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Publication number Publication date
JP2007324025A (ja) 2007-12-13

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