JP2007324025A5 - - Google Patents

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Publication number
JP2007324025A5
JP2007324025A5 JP2006154506A JP2006154506A JP2007324025A5 JP 2007324025 A5 JP2007324025 A5 JP 2007324025A5 JP 2006154506 A JP2006154506 A JP 2006154506A JP 2006154506 A JP2006154506 A JP 2006154506A JP 2007324025 A5 JP2007324025 A5 JP 2007324025A5
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JP
Japan
Prior art keywords
copper
firing
nanoparticle dispersion
coating
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006154506A
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English (en)
Japanese (ja)
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JP2007324025A (ja
JP4995491B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2006154506A priority Critical patent/JP4995491B2/ja
Priority claimed from JP2006154506A external-priority patent/JP4995491B2/ja
Publication of JP2007324025A publication Critical patent/JP2007324025A/ja
Publication of JP2007324025A5 publication Critical patent/JP2007324025A5/ja
Application granted granted Critical
Publication of JP4995491B2 publication Critical patent/JP4995491B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006154506A 2006-06-02 2006-06-02 銅被膜の製造方法 Expired - Fee Related JP4995491B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006154506A JP4995491B2 (ja) 2006-06-02 2006-06-02 銅被膜の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006154506A JP4995491B2 (ja) 2006-06-02 2006-06-02 銅被膜の製造方法

Publications (3)

Publication Number Publication Date
JP2007324025A JP2007324025A (ja) 2007-12-13
JP2007324025A5 true JP2007324025A5 (https=) 2009-02-12
JP4995491B2 JP4995491B2 (ja) 2012-08-08

Family

ID=38856642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006154506A Expired - Fee Related JP4995491B2 (ja) 2006-06-02 2006-06-02 銅被膜の製造方法

Country Status (1)

Country Link
JP (1) JP4995491B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023110342A (ja) * 2022-01-28 2023-08-09 セイコーエプソン株式会社 積層造形用粉末および金属焼結体の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3630920B2 (ja) * 1997-05-02 2005-03-23 株式会社アルバック 金属ペーストの焼成方法
JP3764349B2 (ja) * 2001-05-07 2006-04-05 ハリマ化成株式会社 金属微粒子分散液を用いたメッキ代替導電性金属皮膜の形成方法
JP2004006613A (ja) * 2002-04-12 2004-01-08 Mitsui Mining & Smelting Co Ltd プリント配線板用銅箔及びそのプリント配線板用銅箔の製造方法並びにそのプリント配線板用銅箔を用いた銅張積層板
JP2004164876A (ja) * 2002-11-11 2004-06-10 Asahi Kasei Corp 金属被膜の製造方法
JP4761110B2 (ja) * 2005-01-28 2011-08-31 住友電気工業株式会社 金属被膜とその形成方法

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