JP4986351B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP4986351B2 JP4986351B2 JP2001265021A JP2001265021A JP4986351B2 JP 4986351 B2 JP4986351 B2 JP 4986351B2 JP 2001265021 A JP2001265021 A JP 2001265021A JP 2001265021 A JP2001265021 A JP 2001265021A JP 4986351 B2 JP4986351 B2 JP 4986351B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- insulating film
- wiring
- substrate
- tft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims description 79
- 239000000758 substrate Substances 0.000 claims description 121
- 229910052751 metal Inorganic materials 0.000 claims description 77
- 239000002184 metal Substances 0.000 claims description 77
- 239000011229 interlayer Substances 0.000 claims description 59
- 239000003990 capacitor Substances 0.000 claims description 33
- 239000010408 film Substances 0.000 description 378
- 239000010410 layer Substances 0.000 description 95
- 238000000034 method Methods 0.000 description 94
- 239000012535 impurity Substances 0.000 description 51
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 47
- 229910052710 silicon Inorganic materials 0.000 description 47
- 239000010703 silicon Substances 0.000 description 47
- 238000003860 storage Methods 0.000 description 35
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- 238000005401 electroluminescence Methods 0.000 description 30
- 238000005530 etching Methods 0.000 description 30
- 230000008569 process Effects 0.000 description 27
- 230000015572 biosynthetic process Effects 0.000 description 17
- 239000011159 matrix material Substances 0.000 description 15
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 15
- 229910052581 Si3N4 Inorganic materials 0.000 description 14
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000004544 sputter deposition Methods 0.000 description 13
- 229910052760 oxygen Inorganic materials 0.000 description 12
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 12
- 239000004973 liquid crystal related substance Substances 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 229910052739 hydrogen Inorganic materials 0.000 description 10
- 238000000137 annealing Methods 0.000 description 9
- 239000007789 gas Substances 0.000 description 9
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
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- 239000011347 resin Substances 0.000 description 8
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
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- 238000005984 hydrogenation reaction Methods 0.000 description 7
- 150000002500 ions Chemical class 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
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- 239000011574 phosphorus Substances 0.000 description 7
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- 229910052721 tungsten Inorganic materials 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- 230000001133 acceleration Effects 0.000 description 6
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- 239000002356 single layer Substances 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
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- 238000001994 activation Methods 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
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- 238000005224 laser annealing Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 229910052715 tantalum Inorganic materials 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 4
- 230000004913 activation Effects 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229910021419 crystalline silicon Inorganic materials 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 238000009616 inductively coupled plasma Methods 0.000 description 4
- 238000005499 laser crystallization Methods 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000004151 rapid thermal annealing Methods 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 229910021332 silicide Inorganic materials 0.000 description 3
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- -1 tungsten nitride Chemical class 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000005281 excited state Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000005283 ground state Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910020286 SiOxNy Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000002294 plasma sputter deposition Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- NXHILIPIEUBEPD-UHFFFAOYSA-H tungsten hexafluoride Chemical compound F[W](F)(F)(F)(F)F NXHILIPIEUBEPD-UHFFFAOYSA-H 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Landscapes
- Liquid Crystal (AREA)
- Electrodes Of Semiconductors (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Thin Film Transistor (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001265021A JP4986351B2 (ja) | 2000-09-06 | 2001-08-31 | 半導体装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-269797 | 2000-09-06 | ||
JP2000269797 | 2000-09-06 | ||
JP2000269797 | 2000-09-06 | ||
JP2001265021A JP4986351B2 (ja) | 2000-09-06 | 2001-08-31 | 半導体装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011223526A Division JP5542261B2 (ja) | 2000-09-06 | 2011-10-10 | 半導体装置の作製方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2002189429A JP2002189429A (ja) | 2002-07-05 |
JP2002189429A5 JP2002189429A5 (enrdf_load_stackoverflow) | 2008-08-28 |
JP4986351B2 true JP4986351B2 (ja) | 2012-07-25 |
Family
ID=26599332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001265021A Expired - Fee Related JP4986351B2 (ja) | 2000-09-06 | 2001-08-31 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4986351B2 (enrdf_load_stackoverflow) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4182022B2 (ja) * | 2004-04-01 | 2008-11-19 | キヤノン株式会社 | 表示装置用パネル及び表示装置 |
US8148895B2 (en) | 2004-10-01 | 2012-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method of the same |
JP4930704B2 (ja) | 2006-03-14 | 2012-05-16 | セイコーエプソン株式会社 | 有機エレクトロルミネッセンス装置及び電子機器 |
US7435633B2 (en) | 2006-03-14 | 2008-10-14 | Seiko Epson Corporation | Electroluminescence device, manufacturing method thereof, and electronic apparatus |
KR101499233B1 (ko) | 2008-09-03 | 2015-03-06 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
US20100224878A1 (en) | 2009-03-05 | 2010-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0225A (ja) * | 1989-04-28 | 1990-01-05 | Canon Inc | 駆動装置 |
JP2667304B2 (ja) * | 1991-05-13 | 1997-10-27 | シャープ株式会社 | アクティブマトリクス基板 |
JPH0545640A (ja) * | 1991-08-09 | 1993-02-26 | Ricoh Co Ltd | 液晶表示装置 |
JPH06347826A (ja) * | 1993-06-07 | 1994-12-22 | Sanyo Electric Co Ltd | 液晶表示装置 |
JPH08152612A (ja) * | 1994-11-30 | 1996-06-11 | Sanyo Electric Co Ltd | 液晶表示装置 |
JP3469663B2 (ja) * | 1994-12-09 | 2003-11-25 | 三洋電機株式会社 | 液晶表示装置 |
JPH09179106A (ja) * | 1995-12-21 | 1997-07-11 | Dainippon Printing Co Ltd | 薄型ディスプレイ用基板とこれを使用したフィルム液晶ディスプレイおよびフィールドエミッションディスプレイ |
JPH09197437A (ja) * | 1996-01-24 | 1997-07-31 | Toshiba Corp | 液晶表示装置及びその製造方法 |
KR100234376B1 (ko) * | 1996-04-09 | 1999-12-15 | 윤종용 | 박막 트랜지스터의 제조방법 및 이를 이용한 액정 표시장치의 제조방법 |
JP3708637B2 (ja) * | 1996-07-15 | 2005-10-19 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
JPH1096949A (ja) * | 1996-09-24 | 1998-04-14 | Toshiba Electron Eng Corp | アクティブマトリクス型液晶表示装置 |
JPH1138439A (ja) * | 1997-07-16 | 1999-02-12 | Toshiba Corp | アクティブマトリクス基板及びその製造方法並びにアクティブマトリクス型液晶表示装置 |
JP3127894B2 (ja) * | 1998-07-24 | 2001-01-29 | 日本電気株式会社 | アクティブマトリクス型液晶表示装置 |
-
2001
- 2001-08-31 JP JP2001265021A patent/JP4986351B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2002189429A (ja) | 2002-07-05 |
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