JP4981525B2 - 半導体検査装置 - Google Patents

半導体検査装置 Download PDF

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Publication number
JP4981525B2
JP4981525B2 JP2007148376A JP2007148376A JP4981525B2 JP 4981525 B2 JP4981525 B2 JP 4981525B2 JP 2007148376 A JP2007148376 A JP 2007148376A JP 2007148376 A JP2007148376 A JP 2007148376A JP 4981525 B2 JP4981525 B2 JP 4981525B2
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Japan
Prior art keywords
probe
heating
amount
tip
probe card
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Expired - Fee Related
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JP2007148376A
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English (en)
Japanese (ja)
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JP2008298749A (ja
JP2008298749A5 (enExample
Inventor
親臣 森
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Japan Electronic Materials Corp
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Japan Electronic Materials Corp
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Priority to JP2007148376A priority Critical patent/JP4981525B2/ja
Publication of JP2008298749A publication Critical patent/JP2008298749A/ja
Publication of JP2008298749A5 publication Critical patent/JP2008298749A5/ja
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Publication of JP4981525B2 publication Critical patent/JP4981525B2/ja
Expired - Fee Related legal-status Critical Current
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  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2007148376A 2007-06-04 2007-06-04 半導体検査装置 Expired - Fee Related JP4981525B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007148376A JP4981525B2 (ja) 2007-06-04 2007-06-04 半導体検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007148376A JP4981525B2 (ja) 2007-06-04 2007-06-04 半導体検査装置

Publications (3)

Publication Number Publication Date
JP2008298749A JP2008298749A (ja) 2008-12-11
JP2008298749A5 JP2008298749A5 (enExample) 2011-04-14
JP4981525B2 true JP4981525B2 (ja) 2012-07-25

Family

ID=40172384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007148376A Expired - Fee Related JP4981525B2 (ja) 2007-06-04 2007-06-04 半導体検査装置

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JP (1) JP4981525B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5258590B2 (ja) * 2009-01-16 2013-08-07 株式会社日本マイクロニクス 集積回路の試験装置
JP5294954B2 (ja) * 2009-04-07 2013-09-18 株式会社日本マイクロニクス プローブカードの製造方法
JP5235163B2 (ja) 2009-05-18 2013-07-10 株式会社日本マイクロニクス 検査装置
US20140091826A1 (en) * 2012-10-03 2014-04-03 Corad Technology Inc. Fine pitch interface for probe card
KR102077062B1 (ko) 2013-02-25 2020-02-13 삼성전자주식회사 프로브 카드 및 이를 포함하는 프로빙 장치
CN106269542B (zh) * 2015-06-11 2018-05-22 鸿劲科技股份有限公司 电子元件预热预冷装置及其应用的作业设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152389A (ja) * 1991-11-27 1993-06-18 Mitsubishi Electric Corp プローブカード
JP3103959B2 (ja) * 1993-08-18 2000-10-30 東京エレクトロン株式会社 プローブ装置
JPH11145215A (ja) * 1997-11-11 1999-05-28 Mitsubishi Electric Corp 半導体検査装置およびその制御方法
JP2000346875A (ja) * 1999-06-07 2000-12-15 Advantest Corp プローブカードおよびこれを用いたｉｃ試験装置
JP2003215162A (ja) * 2002-01-17 2003-07-30 Seiko Epson Corp プローブカード及びこれを備えた半導体測定装置

Also Published As

Publication number Publication date
JP2008298749A (ja) 2008-12-11

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