JP4968558B2 - マイクロリソグラフィのための投影対物器械、その投影対物器械を有するマイクロリソグラフィ投影露光装置、構成要素のためのマイクロリソグラフィ製造方法、並びにその方法を用いて製造される構成要素 - Google Patents
マイクロリソグラフィのための投影対物器械、その投影対物器械を有するマイクロリソグラフィ投影露光装置、構成要素のためのマイクロリソグラフィ製造方法、並びにその方法を用いて製造される構成要素 Download PDFInfo
- Publication number
- JP4968558B2 JP4968558B2 JP2010508737A JP2010508737A JP4968558B2 JP 4968558 B2 JP4968558 B2 JP 4968558B2 JP 2010508737 A JP2010508737 A JP 2010508737A JP 2010508737 A JP2010508737 A JP 2010508737A JP 4968558 B2 JP4968558 B2 JP 4968558B2
- Authority
- JP
- Japan
- Prior art keywords
- field
- stray light
- plane
- projection objective
- light component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70941—Stray fields and charges, e.g. stray light, scattered light, flare, transmission loss
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Epidemiology (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Lenses (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Polarising Elements (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
- Holo Graphy (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US94011707P | 2007-05-25 | 2007-05-25 | |
| DE102007024685 | 2007-05-25 | ||
| US60/940,117 | 2007-05-25 | ||
| DE102007024685.6 | 2007-05-25 | ||
| PCT/EP2008/004084 WO2008145296A1 (en) | 2007-05-25 | 2008-05-21 | Projection objective for microlithography, microlithography projection exposure apparatus with said projection objective, microlithographic manufacturing method for components, as well as a component manufactured with said method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011263850A Division JP5436523B2 (ja) | 2007-05-25 | 2011-12-01 | マイクロリソグラフィのための投影対物器械、その投影対物器械を有するマイクロリソグラフィ投影露光装置、構成要素のためのマイクロリソグラフィ製造方法、並びにその方法を用いて製造される構成要素 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010528463A JP2010528463A (ja) | 2010-08-19 |
| JP2010528463A5 JP2010528463A5 (enExample) | 2011-07-14 |
| JP4968558B2 true JP4968558B2 (ja) | 2012-07-04 |
Family
ID=39877324
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010508737A Active JP4968558B2 (ja) | 2007-05-25 | 2008-05-21 | マイクロリソグラフィのための投影対物器械、その投影対物器械を有するマイクロリソグラフィ投影露光装置、構成要素のためのマイクロリソグラフィ製造方法、並びにその方法を用いて製造される構成要素 |
| JP2011263850A Expired - Fee Related JP5436523B2 (ja) | 2007-05-25 | 2011-12-01 | マイクロリソグラフィのための投影対物器械、その投影対物器械を有するマイクロリソグラフィ投影露光装置、構成要素のためのマイクロリソグラフィ製造方法、並びにその方法を用いて製造される構成要素 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011263850A Expired - Fee Related JP5436523B2 (ja) | 2007-05-25 | 2011-12-01 | マイクロリソグラフィのための投影対物器械、その投影対物器械を有するマイクロリソグラフィ投影露光装置、構成要素のためのマイクロリソグラフィ製造方法、並びにその方法を用いて製造される構成要素 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US9063439B2 (enExample) |
| EP (1) | EP2165241B1 (enExample) |
| JP (2) | JP4968558B2 (enExample) |
| KR (1) | KR101544224B1 (enExample) |
| CN (1) | CN101689027B (enExample) |
| DE (1) | DE102008001800A1 (enExample) |
| TW (1) | TWI483081B (enExample) |
| WO (2) | WO2008145295A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015012982A1 (en) * | 2013-07-22 | 2015-01-29 | Johnson Kenneth C | Scanned-spot-array duv lithography system |
| US9188874B1 (en) | 2011-05-09 | 2015-11-17 | Kenneth C. Johnson | Spot-array imaging system for maskless lithography and parallel confocal microscopy |
| US9097983B2 (en) | 2011-05-09 | 2015-08-04 | Kenneth C. Johnson | Scanned-spot-array EUV lithography system |
| US8994920B1 (en) | 2010-05-07 | 2015-03-31 | Kenneth C. Johnson | Optical systems and methods for absorbance modulation |
| DE102008001800A1 (de) * | 2007-05-25 | 2008-11-27 | Carl Zeiss Smt Ag | Projektionsobjektiv für die Mikrolithographie, Mikrolithographie-Projektionsbelichtungsanlage mit einem derartigen Projektionsobjektiv, mikrolithographisches Herstellungsverfahren für Bauelemente sowie mit diesem Verfahren hergestelltes Bauelement |
| WO2009061196A1 (en) * | 2007-11-08 | 2009-05-14 | Asml Netherlands B.V. | Lithographic projection apparatus and method of compensating perturbation factors |
| DE102008043324B4 (de) * | 2008-10-30 | 2010-11-11 | Carl Zeiss Smt Ag | Optische Anordnung zur dreidimensionalen Strukturierung einer Materialschicht |
| EP2219077A1 (en) | 2009-02-12 | 2010-08-18 | Carl Zeiss SMT AG | Projection exposure method, projection exposure system and projection objective |
| US20110094123A1 (en) * | 2009-10-28 | 2011-04-28 | Richard Vaughn | Fabric-covered fluid-filled therapeutic foot orthotic with thong-cut device systems |
| US8443308B2 (en) * | 2011-05-02 | 2013-05-14 | Synopsys Inc. | EUV lithography flare calculation and compensation |
| DE102012112773B4 (de) * | 2012-12-20 | 2020-04-30 | Jenoptik Optical Systems Gmbh | Verfahren zur Herstellung einer wellenfrontkorrigierten optischen Anordnung aus mindestens zwei optischen Elementen und Verwendung des Verfahrens |
| US9857570B1 (en) * | 2014-07-24 | 2018-01-02 | Hoyos Integrity Corporation | Full flat mirror guiding reflections to aperture of panoramic optical device |
| CN104317168B (zh) * | 2014-10-28 | 2016-03-02 | 中国科学院长春光学精密机械与物理研究所 | 极紫外光刻系统中与杂散光有关的镜面加工误差分析方法 |
| US10098529B2 (en) * | 2015-10-28 | 2018-10-16 | Ricoh Company, Ltd. | Optical design of a light field otoscope |
| US20170119237A1 (en) * | 2015-10-28 | 2017-05-04 | Ricoh Company, Ltd. | Optical Design of a Light Field Otoscope |
| US10417533B2 (en) * | 2016-08-09 | 2019-09-17 | Cognex Corporation | Selection of balanced-probe sites for 3-D alignment algorithms |
| CN106773555B (zh) * | 2017-03-21 | 2019-03-26 | 上海华力微电子有限公司 | 补偿由光刻镜头散射光导致曝光误差的方法 |
| CN112034605B (zh) * | 2020-09-09 | 2025-01-24 | 苏州大学 | 一种折反式Golay3稀疏孔径光学系统 |
| CN119270401A (zh) * | 2023-07-07 | 2025-01-07 | 玉晶光电(厦门)有限公司 | 一种使杂散光多次反射的光学元件 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6985210B2 (en) | 1999-02-15 | 2006-01-10 | Carl Zeiss Smt Ag | Projection system for EUV lithography |
| JP2001264626A (ja) | 2000-03-15 | 2001-09-26 | Canon Inc | 回折光学素子を有する光学系 |
| JP2002353094A (ja) | 2001-05-22 | 2002-12-06 | Nikon Corp | 照明光学装置および露光装置 |
| JP3679736B2 (ja) | 2001-07-04 | 2005-08-03 | キヤノン株式会社 | 露光装置、露光方法、デバイス製造方法、並びに、デバイス |
| JP2004004601A (ja) * | 2002-04-04 | 2004-01-08 | Sony Corp | 光スイッチング素子、光スイッチング素子アレイ、及び画像表示装置 |
| JP2003318095A (ja) * | 2002-04-24 | 2003-11-07 | Nikon Corp | フレア計測方法及びフレア計測装置、露光方法及び露光装置、露光装置の調整方法 |
| TWI249082B (en) | 2002-08-23 | 2006-02-11 | Nikon Corp | Projection optical system and method for photolithography and exposure apparatus and method using same |
| US7348575B2 (en) | 2003-05-06 | 2008-03-25 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
| WO2005015313A1 (en) | 2003-08-04 | 2005-02-17 | Carl Zeiss Smt Ag | Illumination mask for range-resolved detection of scattered light |
| JP2005134666A (ja) | 2003-10-30 | 2005-05-26 | Hoya Corp | フォトマスク及び映像デバイスの製造方法 |
| US7466489B2 (en) | 2003-12-15 | 2008-12-16 | Susanne Beder | Projection objective having a high aperture and a planar end surface |
| KR101150037B1 (ko) | 2004-01-14 | 2012-07-02 | 칼 짜이스 에스엠티 게엠베하 | 반사굴절식 투영 대물렌즈 |
| JP2006120899A (ja) | 2004-10-22 | 2006-05-11 | Nikon Corp | 投影光学系、投影光学系の調整方法、投影露光装置、投影露光方法、および投影露光装置の調整方法 |
| EP1820050A1 (en) | 2004-12-09 | 2007-08-22 | Carl Zeiss SMT AG | Transmitting optical element and objective for a microlithographic projection exposure apparatus |
| DE602004014002D1 (de) | 2004-12-10 | 2008-07-03 | Essilor Int | Stempel zum Auftragen eines Motivs, Verfahren zur Stempelherstellung und Verfahren zur Herstellung eines Objekts anhand von diesem Stempel |
| US7125178B2 (en) | 2004-12-22 | 2006-10-24 | Eastman Kodak Company | Photographic processing arrangement and a processing solution supply cartridge for the processing arrangement |
| JP2006222222A (ja) | 2005-02-09 | 2006-08-24 | Canon Inc | 投影光学系及びそれを有する露光装置 |
| KR101590743B1 (ko) | 2005-06-02 | 2016-02-01 | 칼 짜이스 에스엠티 게엠베하 | 마이크로리소그래피 투영 대물 렌즈 |
| EP1913445B1 (de) | 2005-08-10 | 2011-05-25 | Carl Zeiss SMT GmbH | Abbildungssystem, insbesondere projektionsobjektiv einer mikrolithographischen projektionsbelichtungsanlage |
| DE102008001800A1 (de) * | 2007-05-25 | 2008-11-27 | Carl Zeiss Smt Ag | Projektionsobjektiv für die Mikrolithographie, Mikrolithographie-Projektionsbelichtungsanlage mit einem derartigen Projektionsobjektiv, mikrolithographisches Herstellungsverfahren für Bauelemente sowie mit diesem Verfahren hergestelltes Bauelement |
-
2008
- 2008-05-15 DE DE102008001800A patent/DE102008001800A1/de not_active Withdrawn
- 2008-05-21 EP EP08784500A patent/EP2165241B1/en not_active Not-in-force
- 2008-05-21 WO PCT/EP2008/004081 patent/WO2008145295A1/en not_active Ceased
- 2008-05-21 WO PCT/EP2008/004084 patent/WO2008145296A1/en not_active Ceased
- 2008-05-21 KR KR1020097024610A patent/KR101544224B1/ko not_active Expired - Fee Related
- 2008-05-21 TW TW097118807A patent/TWI483081B/zh not_active IP Right Cessation
- 2008-05-21 JP JP2010508737A patent/JP4968558B2/ja active Active
- 2008-05-21 CN CN200880017510.2A patent/CN101689027B/zh not_active Expired - Fee Related
-
2009
- 2009-11-24 US US12/624,993 patent/US9063439B2/en active Active
- 2009-11-24 US US12/624,755 patent/US20100079741A1/en not_active Abandoned
-
2011
- 2011-12-01 JP JP2011263850A patent/JP5436523B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101689027B (zh) | 2013-09-25 |
| US9063439B2 (en) | 2015-06-23 |
| EP2165241A1 (en) | 2010-03-24 |
| CN101689027A (zh) | 2010-03-31 |
| WO2008145296A9 (en) | 2010-01-14 |
| TW200905414A (en) | 2009-02-01 |
| WO2008145295A9 (en) | 2010-01-14 |
| JP5436523B2 (ja) | 2014-03-05 |
| TWI483081B (zh) | 2015-05-01 |
| WO2008145296A1 (en) | 2008-12-04 |
| EP2165241B1 (en) | 2013-02-27 |
| WO2008145295A1 (en) | 2008-12-04 |
| JP2012060155A (ja) | 2012-03-22 |
| JP2010528463A (ja) | 2010-08-19 |
| KR20100023823A (ko) | 2010-03-04 |
| KR101544224B1 (ko) | 2015-08-21 |
| US20100079741A1 (en) | 2010-04-01 |
| DE102008001800A1 (de) | 2008-11-27 |
| US20100079739A1 (en) | 2010-04-01 |
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