TWI483081B - 微影投影物鏡、具此投影物鏡之微影投影曝光設備、元件微影製造方法及以此製造方法製造之元件 - Google Patents
微影投影物鏡、具此投影物鏡之微影投影曝光設備、元件微影製造方法及以此製造方法製造之元件 Download PDFInfo
- Publication number
- TWI483081B TWI483081B TW097118807A TW97118807A TWI483081B TW I483081 B TWI483081 B TW I483081B TW 097118807 A TW097118807 A TW 097118807A TW 97118807 A TW97118807 A TW 97118807A TW I483081 B TWI483081 B TW I483081B
- Authority
- TW
- Taiwan
- Prior art keywords
- field
- view
- projection objective
- plane
- component
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 47
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 238000001393 microlithography Methods 0.000 title 2
- 230000003287 optical effect Effects 0.000 claims description 243
- 230000004313 glare Effects 0.000 claims description 191
- 239000000463 material Substances 0.000 claims description 85
- 230000003746 surface roughness Effects 0.000 claims description 65
- 210000001747 pupil Anatomy 0.000 claims description 54
- 238000009826 distribution Methods 0.000 claims description 52
- 239000013078 crystal Substances 0.000 claims description 26
- 238000001459 lithography Methods 0.000 claims description 25
- 230000008859 change Effects 0.000 claims description 11
- 238000005259 measurement Methods 0.000 claims description 11
- 238000009792 diffusion process Methods 0.000 claims description 10
- 229910052596 spinel Inorganic materials 0.000 claims description 10
- 239000011029 spinel Substances 0.000 claims description 10
- 230000006978 adaptation Effects 0.000 claims description 9
- 208000027534 Emotional disease Diseases 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 230000000873 masking effect Effects 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 4
- 239000002223 garnet Substances 0.000 claims description 2
- 229910001404 rare earth metal oxide Inorganic materials 0.000 claims description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims 1
- 230000002745 absorbent Effects 0.000 claims 1
- 239000002250 absorbent Substances 0.000 claims 1
- 238000010276 construction Methods 0.000 claims 1
- 238000013461 design Methods 0.000 description 60
- 238000005286 illumination Methods 0.000 description 25
- 235000012431 wafers Nutrition 0.000 description 25
- 230000008569 process Effects 0.000 description 22
- 238000000671 immersion lithography Methods 0.000 description 20
- 239000004065 semiconductor Substances 0.000 description 18
- 239000011521 glass Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 15
- 238000005562 fading Methods 0.000 description 13
- 238000012545 processing Methods 0.000 description 12
- 238000007654 immersion Methods 0.000 description 10
- 239000007788 liquid Substances 0.000 description 10
- 229920002120 photoresistant polymer Polymers 0.000 description 9
- 238000005498 polishing Methods 0.000 description 9
- 238000000233 ultraviolet lithography Methods 0.000 description 9
- 201000009310 astigmatism Diseases 0.000 description 8
- 230000008901 benefit Effects 0.000 description 8
- 206010042772 syncope Diseases 0.000 description 7
- 206010010071 Coma Diseases 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000012937 correction Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 6
- 230000018109 developmental process Effects 0.000 description 6
- 238000013507 mapping Methods 0.000 description 6
- 230000001419 dependent effect Effects 0.000 description 5
- 239000004615 ingredient Substances 0.000 description 5
- 230000001788 irregular Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- 239000000395 magnesium oxide Substances 0.000 description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 4
- 241000022563 Rema Species 0.000 description 3
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 3
- 210000003128 head Anatomy 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 239000013598 vector Substances 0.000 description 3
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 101100355582 Arabidopsis thaliana ARAC1 gene Proteins 0.000 description 2
- 101100355577 Arabidopsis thaliana ARAC11 gene Proteins 0.000 description 2
- 229910017768 LaF 3 Inorganic materials 0.000 description 2
- 229910020068 MgAl Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- FPIPGXGPPPQFEQ-OVSJKPMPSA-N all-trans-retinol Chemical compound OC\C=C(/C)\C=C\C=C(/C)\C=C\C1=C(C)CCCC1(C)C FPIPGXGPPPQFEQ-OVSJKPMPSA-N 0.000 description 2
- 229910000420 cerium oxide Inorganic materials 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 210000000887 face Anatomy 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 2
- 210000003462 vein Anatomy 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 101100282455 Arabidopsis thaliana AMP1 gene Proteins 0.000 description 1
- 101100218464 Haloarcula sp. (strain arg-2 / Andes heights) cop2 gene Proteins 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 238000000342 Monte Carlo simulation Methods 0.000 description 1
- 241001274197 Scatophagus argus Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 235000019169 all-trans-retinol Nutrition 0.000 description 1
- 239000011717 all-trans-retinol Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 208000002173 dizziness Diseases 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 1
- 208000024756 faint Diseases 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 238000012886 linear function Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000012887 quadratic function Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052566 spinel group Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- BYMUNNMMXKDFEZ-UHFFFAOYSA-K trifluorolanthanum Chemical compound F[La](F)F BYMUNNMMXKDFEZ-UHFFFAOYSA-K 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70941—Stray fields and charges, e.g. stray light, scattered light, flare, transmission loss
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Epidemiology (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Lenses (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Polarising Elements (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
- Holo Graphy (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007024685 | 2007-05-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200905414A TW200905414A (en) | 2009-02-01 |
| TWI483081B true TWI483081B (zh) | 2015-05-01 |
Family
ID=39877324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097118807A TWI483081B (zh) | 2007-05-25 | 2008-05-21 | 微影投影物鏡、具此投影物鏡之微影投影曝光設備、元件微影製造方法及以此製造方法製造之元件 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US9063439B2 (enExample) |
| EP (1) | EP2165241B1 (enExample) |
| JP (2) | JP4968558B2 (enExample) |
| KR (1) | KR101544224B1 (enExample) |
| CN (1) | CN101689027B (enExample) |
| DE (1) | DE102008001800A1 (enExample) |
| TW (1) | TWI483081B (enExample) |
| WO (2) | WO2008145295A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015012982A1 (en) * | 2013-07-22 | 2015-01-29 | Johnson Kenneth C | Scanned-spot-array duv lithography system |
| US9188874B1 (en) | 2011-05-09 | 2015-11-17 | Kenneth C. Johnson | Spot-array imaging system for maskless lithography and parallel confocal microscopy |
| US9097983B2 (en) | 2011-05-09 | 2015-08-04 | Kenneth C. Johnson | Scanned-spot-array EUV lithography system |
| US8994920B1 (en) | 2010-05-07 | 2015-03-31 | Kenneth C. Johnson | Optical systems and methods for absorbance modulation |
| DE102008001800A1 (de) * | 2007-05-25 | 2008-11-27 | Carl Zeiss Smt Ag | Projektionsobjektiv für die Mikrolithographie, Mikrolithographie-Projektionsbelichtungsanlage mit einem derartigen Projektionsobjektiv, mikrolithographisches Herstellungsverfahren für Bauelemente sowie mit diesem Verfahren hergestelltes Bauelement |
| WO2009061196A1 (en) * | 2007-11-08 | 2009-05-14 | Asml Netherlands B.V. | Lithographic projection apparatus and method of compensating perturbation factors |
| DE102008043324B4 (de) * | 2008-10-30 | 2010-11-11 | Carl Zeiss Smt Ag | Optische Anordnung zur dreidimensionalen Strukturierung einer Materialschicht |
| EP2219077A1 (en) | 2009-02-12 | 2010-08-18 | Carl Zeiss SMT AG | Projection exposure method, projection exposure system and projection objective |
| US20110094123A1 (en) * | 2009-10-28 | 2011-04-28 | Richard Vaughn | Fabric-covered fluid-filled therapeutic foot orthotic with thong-cut device systems |
| US8443308B2 (en) * | 2011-05-02 | 2013-05-14 | Synopsys Inc. | EUV lithography flare calculation and compensation |
| DE102012112773B4 (de) * | 2012-12-20 | 2020-04-30 | Jenoptik Optical Systems Gmbh | Verfahren zur Herstellung einer wellenfrontkorrigierten optischen Anordnung aus mindestens zwei optischen Elementen und Verwendung des Verfahrens |
| US9857570B1 (en) * | 2014-07-24 | 2018-01-02 | Hoyos Integrity Corporation | Full flat mirror guiding reflections to aperture of panoramic optical device |
| CN104317168B (zh) * | 2014-10-28 | 2016-03-02 | 中国科学院长春光学精密机械与物理研究所 | 极紫外光刻系统中与杂散光有关的镜面加工误差分析方法 |
| US10098529B2 (en) * | 2015-10-28 | 2018-10-16 | Ricoh Company, Ltd. | Optical design of a light field otoscope |
| US20170119237A1 (en) * | 2015-10-28 | 2017-05-04 | Ricoh Company, Ltd. | Optical Design of a Light Field Otoscope |
| US10417533B2 (en) * | 2016-08-09 | 2019-09-17 | Cognex Corporation | Selection of balanced-probe sites for 3-D alignment algorithms |
| CN106773555B (zh) * | 2017-03-21 | 2019-03-26 | 上海华力微电子有限公司 | 补偿由光刻镜头散射光导致曝光误差的方法 |
| CN112034605B (zh) * | 2020-09-09 | 2025-01-24 | 苏州大学 | 一种折反式Golay3稀疏孔径光学系统 |
| CN119270401A (zh) * | 2023-07-07 | 2025-01-07 | 玉晶光电(厦门)有限公司 | 一种使杂散光多次反射的光学元件 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200519524A (en) * | 2003-10-30 | 2005-06-16 | Hoya Corp | Photomask and method of producing a video device |
| WO2006061225A1 (en) * | 2004-12-09 | 2006-06-15 | Carl Zeiss Smt Ag | Transmitting optical element and objective for a microlithographic projection exposure apparatus |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6985210B2 (en) | 1999-02-15 | 2006-01-10 | Carl Zeiss Smt Ag | Projection system for EUV lithography |
| JP2001264626A (ja) | 2000-03-15 | 2001-09-26 | Canon Inc | 回折光学素子を有する光学系 |
| JP2002353094A (ja) | 2001-05-22 | 2002-12-06 | Nikon Corp | 照明光学装置および露光装置 |
| JP3679736B2 (ja) | 2001-07-04 | 2005-08-03 | キヤノン株式会社 | 露光装置、露光方法、デバイス製造方法、並びに、デバイス |
| JP2004004601A (ja) * | 2002-04-04 | 2004-01-08 | Sony Corp | 光スイッチング素子、光スイッチング素子アレイ、及び画像表示装置 |
| JP2003318095A (ja) * | 2002-04-24 | 2003-11-07 | Nikon Corp | フレア計測方法及びフレア計測装置、露光方法及び露光装置、露光装置の調整方法 |
| TWI249082B (en) | 2002-08-23 | 2006-02-11 | Nikon Corp | Projection optical system and method for photolithography and exposure apparatus and method using same |
| US7348575B2 (en) | 2003-05-06 | 2008-03-25 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
| WO2005015313A1 (en) | 2003-08-04 | 2005-02-17 | Carl Zeiss Smt Ag | Illumination mask for range-resolved detection of scattered light |
| US7466489B2 (en) | 2003-12-15 | 2008-12-16 | Susanne Beder | Projection objective having a high aperture and a planar end surface |
| KR101150037B1 (ko) | 2004-01-14 | 2012-07-02 | 칼 짜이스 에스엠티 게엠베하 | 반사굴절식 투영 대물렌즈 |
| JP2006120899A (ja) | 2004-10-22 | 2006-05-11 | Nikon Corp | 投影光学系、投影光学系の調整方法、投影露光装置、投影露光方法、および投影露光装置の調整方法 |
| DE602004014002D1 (de) | 2004-12-10 | 2008-07-03 | Essilor Int | Stempel zum Auftragen eines Motivs, Verfahren zur Stempelherstellung und Verfahren zur Herstellung eines Objekts anhand von diesem Stempel |
| US7125178B2 (en) | 2004-12-22 | 2006-10-24 | Eastman Kodak Company | Photographic processing arrangement and a processing solution supply cartridge for the processing arrangement |
| JP2006222222A (ja) | 2005-02-09 | 2006-08-24 | Canon Inc | 投影光学系及びそれを有する露光装置 |
| KR101590743B1 (ko) | 2005-06-02 | 2016-02-01 | 칼 짜이스 에스엠티 게엠베하 | 마이크로리소그래피 투영 대물 렌즈 |
| EP1913445B1 (de) | 2005-08-10 | 2011-05-25 | Carl Zeiss SMT GmbH | Abbildungssystem, insbesondere projektionsobjektiv einer mikrolithographischen projektionsbelichtungsanlage |
| DE102008001800A1 (de) * | 2007-05-25 | 2008-11-27 | Carl Zeiss Smt Ag | Projektionsobjektiv für die Mikrolithographie, Mikrolithographie-Projektionsbelichtungsanlage mit einem derartigen Projektionsobjektiv, mikrolithographisches Herstellungsverfahren für Bauelemente sowie mit diesem Verfahren hergestelltes Bauelement |
-
2008
- 2008-05-15 DE DE102008001800A patent/DE102008001800A1/de not_active Withdrawn
- 2008-05-21 EP EP08784500A patent/EP2165241B1/en not_active Not-in-force
- 2008-05-21 WO PCT/EP2008/004081 patent/WO2008145295A1/en not_active Ceased
- 2008-05-21 WO PCT/EP2008/004084 patent/WO2008145296A1/en not_active Ceased
- 2008-05-21 KR KR1020097024610A patent/KR101544224B1/ko not_active Expired - Fee Related
- 2008-05-21 TW TW097118807A patent/TWI483081B/zh not_active IP Right Cessation
- 2008-05-21 JP JP2010508737A patent/JP4968558B2/ja active Active
- 2008-05-21 CN CN200880017510.2A patent/CN101689027B/zh not_active Expired - Fee Related
-
2009
- 2009-11-24 US US12/624,993 patent/US9063439B2/en active Active
- 2009-11-24 US US12/624,755 patent/US20100079741A1/en not_active Abandoned
-
2011
- 2011-12-01 JP JP2011263850A patent/JP5436523B2/ja not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200519524A (en) * | 2003-10-30 | 2005-06-16 | Hoya Corp | Photomask and method of producing a video device |
| WO2006061225A1 (en) * | 2004-12-09 | 2006-06-15 | Carl Zeiss Smt Ag | Transmitting optical element and objective for a microlithographic projection exposure apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101689027B (zh) | 2013-09-25 |
| US9063439B2 (en) | 2015-06-23 |
| EP2165241A1 (en) | 2010-03-24 |
| JP4968558B2 (ja) | 2012-07-04 |
| CN101689027A (zh) | 2010-03-31 |
| WO2008145296A9 (en) | 2010-01-14 |
| TW200905414A (en) | 2009-02-01 |
| WO2008145295A9 (en) | 2010-01-14 |
| JP5436523B2 (ja) | 2014-03-05 |
| WO2008145296A1 (en) | 2008-12-04 |
| EP2165241B1 (en) | 2013-02-27 |
| WO2008145295A1 (en) | 2008-12-04 |
| JP2012060155A (ja) | 2012-03-22 |
| JP2010528463A (ja) | 2010-08-19 |
| KR20100023823A (ko) | 2010-03-04 |
| KR101544224B1 (ko) | 2015-08-21 |
| US20100079741A1 (en) | 2010-04-01 |
| DE102008001800A1 (de) | 2008-11-27 |
| US20100079739A1 (en) | 2010-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI483081B (zh) | 微影投影物鏡、具此投影物鏡之微影投影曝光設備、元件微影製造方法及以此製造方法製造之元件 | |
| TWI468838B (zh) | 成像光學系統與包含此類型成像光學系統之用於微影的投影曝光裝置 | |
| US8325426B2 (en) | Projection objective of a microlithographic projection exposure apparatus | |
| JP7071327B2 (ja) | Euv投影リソグラフィのための投影光学ユニット | |
| JP6221159B2 (ja) | コレクター | |
| JP6249449B2 (ja) | マイクロリソグラフィのための投影対物系 | |
| CN102870030B (zh) | 成像光学系统和具有这种成像光学系统的用于微光刻的投射曝光设备 | |
| US9146475B2 (en) | Projection exposure system and projection exposure method | |
| JP6410230B2 (ja) | 結像反射euv投影光学ユニット | |
| TWI768243B (zh) | 確定用於微影光罩基材之複數個像素的位置之方法和裝置 | |
| CN110914760A (zh) | 用于euv曝光工具的具有弯曲一维图案化掩模的照明系统 | |
| JP7284766B2 (ja) | Euvマイクロリソグラフィ用の結像光学ユニット | |
| JP7535667B2 (ja) | 特にマイクロリソグラフィ用の光学系を調整する方法 | |
| JP4921580B2 (ja) | 反射屈折投影対物系 | |
| JP2005294622A (ja) | 反射型拡散ミラー及びeuv用照明光学装置 | |
| CN117441116A (zh) | 成像光学单元 | |
| JP2011076094A5 (enExample) | ||
| US20120274913A1 (en) | Enhanced contrast pin mirror for lithography tools |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |