JP4951880B2 - 熱電変換モジュール - Google Patents

熱電変換モジュール Download PDF

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Publication number
JP4951880B2
JP4951880B2 JP2005177970A JP2005177970A JP4951880B2 JP 4951880 B2 JP4951880 B2 JP 4951880B2 JP 2005177970 A JP2005177970 A JP 2005177970A JP 2005177970 A JP2005177970 A JP 2005177970A JP 4951880 B2 JP4951880 B2 JP 4951880B2
Authority
JP
Japan
Prior art keywords
pad
conversion module
thermoelectric conversion
electrode
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005177970A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006351942A5 (https=
JP2006351942A (ja
Inventor
晃弘 森本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aisin Corp
Original Assignee
Aisin Seiki Co Ltd
Aisin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aisin Seiki Co Ltd, Aisin Corp filed Critical Aisin Seiki Co Ltd
Priority to JP2005177970A priority Critical patent/JP4951880B2/ja
Publication of JP2006351942A publication Critical patent/JP2006351942A/ja
Publication of JP2006351942A5 publication Critical patent/JP2006351942A5/ja
Application granted granted Critical
Publication of JP4951880B2 publication Critical patent/JP4951880B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/281—Auxiliary members
    • H10W72/283—Reinforcing structures, e.g. bump collars
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP2005177970A 2005-06-17 2005-06-17 熱電変換モジュール Expired - Fee Related JP4951880B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005177970A JP4951880B2 (ja) 2005-06-17 2005-06-17 熱電変換モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005177970A JP4951880B2 (ja) 2005-06-17 2005-06-17 熱電変換モジュール

Publications (3)

Publication Number Publication Date
JP2006351942A JP2006351942A (ja) 2006-12-28
JP2006351942A5 JP2006351942A5 (https=) 2010-03-18
JP4951880B2 true JP4951880B2 (ja) 2012-06-13

Family

ID=37647451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005177970A Expired - Fee Related JP4951880B2 (ja) 2005-06-17 2005-06-17 熱電変換モジュール

Country Status (1)

Country Link
JP (1) JP4951880B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5404025B2 (ja) * 2008-12-24 2014-01-29 京セラ株式会社 熱電変換モジュールの製法
CN113285009A (zh) * 2021-05-26 2021-08-20 杭州大和热磁电子有限公司 一种通过沉积金锡焊料组装的tec及制备方法
CN117979802B (zh) * 2024-03-29 2024-07-05 四川科尔威光电科技有限公司 一种具有阻焊流动的集成电路结构及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5858379A (ja) * 1981-09-29 1983-04-06 松下電工株式会社 開口体
JPH0325965A (ja) * 1989-06-23 1991-02-04 Fuji Electric Co Ltd 半導体装置
JPH07111370A (ja) * 1993-10-13 1995-04-25 Fuji Electric Co Ltd 半導体装置
JP4127437B2 (ja) * 1998-11-30 2008-07-30 小松エレクトロニクス株式会社 サーモモジュール
JP2000286289A (ja) * 1999-03-31 2000-10-13 Fujitsu Ten Ltd 金属貼付基板および半導体装置
JP2001015820A (ja) * 1999-07-02 2001-01-19 Seiko Instruments Inc 熱電素子
JP3627719B2 (ja) * 2001-04-10 2005-03-09 ヤマハ株式会社 熱電モジュール
JP2004023039A (ja) * 2002-06-20 2004-01-22 Yamaha Corp 熱電装置およびその製造方法
JP2004031696A (ja) * 2002-06-26 2004-01-29 Kyocera Corp 熱電モジュール及びその製造方法
JP2004266103A (ja) * 2003-02-28 2004-09-24 Toshiba Corp 窒化アルミニウムメタライズ基板およびその製造方法
JP2004327785A (ja) * 2003-04-25 2004-11-18 Seiko Instruments Inc 多段熱電素子及びこれを用いた電子機器

Also Published As

Publication number Publication date
JP2006351942A (ja) 2006-12-28

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