JP4947618B2 - 電子部品用パッケージ - Google Patents

電子部品用パッケージ Download PDF

Info

Publication number
JP4947618B2
JP4947618B2 JP2005364921A JP2005364921A JP4947618B2 JP 4947618 B2 JP4947618 B2 JP 4947618B2 JP 2005364921 A JP2005364921 A JP 2005364921A JP 2005364921 A JP2005364921 A JP 2005364921A JP 4947618 B2 JP4947618 B2 JP 4947618B2
Authority
JP
Japan
Prior art keywords
side wall
ceramic base
alloy plating
plating layer
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005364921A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007173306A (ja
JP2007173306A5 (enExample
Inventor
進 西脇
Original Assignee
エヌイーシー ショット コンポーネンツ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エヌイーシー ショット コンポーネンツ株式会社 filed Critical エヌイーシー ショット コンポーネンツ株式会社
Priority to JP2005364921A priority Critical patent/JP4947618B2/ja
Publication of JP2007173306A publication Critical patent/JP2007173306A/ja
Publication of JP2007173306A5 publication Critical patent/JP2007173306A5/ja
Application granted granted Critical
Publication of JP4947618B2 publication Critical patent/JP4947618B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2005364921A 2005-12-19 2005-12-19 電子部品用パッケージ Expired - Lifetime JP4947618B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005364921A JP4947618B2 (ja) 2005-12-19 2005-12-19 電子部品用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005364921A JP4947618B2 (ja) 2005-12-19 2005-12-19 電子部品用パッケージ

Publications (3)

Publication Number Publication Date
JP2007173306A JP2007173306A (ja) 2007-07-05
JP2007173306A5 JP2007173306A5 (enExample) 2009-01-29
JP4947618B2 true JP4947618B2 (ja) 2012-06-06

Family

ID=38299503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005364921A Expired - Lifetime JP4947618B2 (ja) 2005-12-19 2005-12-19 電子部品用パッケージ

Country Status (1)

Country Link
JP (1) JP4947618B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8424145B2 (en) 2003-03-12 2013-04-23 Best Whasung Co., Ltd. Toothbrush having needle-shaped bristles with various end points and manufacturing method thereof

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1308624C (zh) * 2005-02-01 2007-04-04 深圳百灵达火机电器有限公司 打火机的燃料引流结构
JP5206713B2 (ja) * 2010-03-09 2013-06-12 富士電機株式会社 半導体パッケージの組立方法
JP5568416B2 (ja) * 2010-08-31 2014-08-06 京セラクリスタルデバイス株式会社 電子デバイスの製造方法
JP2015076562A (ja) * 2013-10-11 2015-04-20 三菱電機株式会社 パワーモジュール
FR3065318B1 (fr) * 2017-04-18 2021-09-10 E2V Semiconductors Boitier hermetique de composant electronique, en particulier pour capteur d'image
JP6964734B1 (ja) * 2020-09-08 2021-11-10 三菱電機株式会社 回転電機

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216930A (ja) * 2004-01-27 2005-08-11 Kyocera Corp 電気部品
JP4494849B2 (ja) * 2004-04-12 2010-06-30 シチズンファインテックミヨタ株式会社 パッケージ用ロー材付き封着板およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8424145B2 (en) 2003-03-12 2013-04-23 Best Whasung Co., Ltd. Toothbrush having needle-shaped bristles with various end points and manufacturing method thereof

Also Published As

Publication number Publication date
JP2007173306A (ja) 2007-07-05

Similar Documents

Publication Publication Date Title
CN100365803C (zh) 气密封用盖帽及其制造方法
JP5024290B2 (ja) 圧電振動デバイス
JP2008218811A (ja) 機能素子パッケージ
JP4947618B2 (ja) 電子部品用パッケージ
JP5398689B2 (ja) 圧電デバイス及びその製造方法
WO2013172440A1 (ja) 水晶振動子の製造方法及び水晶振動子
JP2000236035A (ja) 電子部品用パッケージおよび圧電振動デバイス
JP5090836B2 (ja) 圧電デバイス及び圧電デバイスの製造方法
JP2007059736A (ja) 圧電振動子パッケージ及びその製造方法ならびに物理量センサ
JP6264962B2 (ja) 圧電振動子とその製造方法
JP5227834B2 (ja) 機能素子パッケージの製造方法
JP3401781B2 (ja) 電子部品用パッケージおよび電子部品用パッケージの製造方法
JP2011228352A (ja) リッドおよびベースおよび電子部品用パッケージ
JP3893617B2 (ja) 電子部品用パッケージ
JP2004281545A (ja) 圧電デバイス用パッケージの封止方法並びにパッケージの蓋体及び圧電デバイス
JP3783605B2 (ja) 気密封止パッケージおよびこれを用いたデバイス
JP2006229283A (ja) 圧電デバイス
JP2006033265A (ja) 圧電デバイスの製造方法
JP3886437B2 (ja) 小型電子部品パッケージの封止構造
JP2011228353A (ja) リッドおよび電子部品用パッケージ
JP2007318209A (ja) 表面実装型圧電振動デバイス、およびその製造方法
JP6465484B2 (ja) パッケージ用部品、電子部品および電子部品の製造方法
JP2008109430A (ja) 圧電デバイス
US20200076401A1 (en) Piezoelectric device
JP2006100669A (ja) 電子部品容器

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081205

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20081205

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100928

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110330

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110524

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110823

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111006

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120301

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120301

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150316

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4947618

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: R3D02

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250