JP4944414B2 - 向上した一致性のためのガードリング - Google Patents

向上した一致性のためのガードリング Download PDF

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Publication number
JP4944414B2
JP4944414B2 JP2005266157A JP2005266157A JP4944414B2 JP 4944414 B2 JP4944414 B2 JP 4944414B2 JP 2005266157 A JP2005266157 A JP 2005266157A JP 2005266157 A JP2005266157 A JP 2005266157A JP 4944414 B2 JP4944414 B2 JP 4944414B2
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JP
Japan
Prior art keywords
guard ring
photoresist
devices
thickness
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005266157A
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English (en)
Japanese (ja)
Other versions
JP2006086533A (ja
JP2006086533A5 (enExample
Inventor
チャールズ カー ダニエル
テー．ルース ロスコー
マリー ジャミソン マイケル
サンゴン チェン アラン
エー．ルーセル ウィリアム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agere Systems LLC
Original Assignee
Agere Systems LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agere Systems LLC filed Critical Agere Systems LLC
Publication of JP2006086533A publication Critical patent/JP2006086533A/ja
Publication of JP2006086533A5 publication Critical patent/JP2006086533A5/ja
Application granted granted Critical
Publication of JP4944414B2 publication Critical patent/JP4944414B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/947—Subphotolithographic processing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/948—Radiation resist
    • Y10S438/95—Multilayer mask including nonradiation sensitive layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Drying Of Semiconductors (AREA)
JP2005266157A 2004-09-14 2005-09-14 向上した一致性のためのガードリング Expired - Fee Related JP4944414B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/941,665 US7253012B2 (en) 2004-09-14 2004-09-14 Guard ring for improved matching
US10/941665 2004-09-14

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011254917A Division JP2012060152A (ja) 2004-09-14 2011-11-22 向上した一致性のためのガードリング

Publications (3)

Publication Number Publication Date
JP2006086533A JP2006086533A (ja) 2006-03-30
JP2006086533A5 JP2006086533A5 (enExample) 2008-05-01
JP4944414B2 true JP4944414B2 (ja) 2012-05-30

Family

ID=36034618

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2005266157A Expired - Fee Related JP4944414B2 (ja) 2004-09-14 2005-09-14 向上した一致性のためのガードリング
JP2011254917A Withdrawn JP2012060152A (ja) 2004-09-14 2011-11-22 向上した一致性のためのガードリング

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011254917A Withdrawn JP2012060152A (ja) 2004-09-14 2011-11-22 向上した一致性のためのガードリング

Country Status (5)

Country Link
US (2) US7253012B2 (enExample)
JP (2) JP4944414B2 (enExample)
KR (2) KR101215425B1 (enExample)
CN (1) CN1750252B (enExample)
TW (1) TWI368258B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7958467B2 (en) * 2006-06-20 2011-06-07 Adtran, Inc. Deterministic system and method for generating wiring layouts for integrated circuits
US7992117B2 (en) * 2006-06-20 2011-08-02 Adtran, Inc. System and method for designing a common centroid layout for an integrated circuit
KR101782503B1 (ko) * 2011-05-18 2017-09-28 삼성전자 주식회사 솔더 범프 붕괴를 억제하는 반도체 소자의 범프 형성방법
CN102339826B (zh) * 2011-11-01 2013-01-16 矽力杰半导体技术(杭州)有限公司 一种器件匹配的集成电路及其设计方法
US8846302B2 (en) * 2012-02-01 2014-09-30 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor structure and method and tool for forming the semiconductor structure
US8658444B2 (en) 2012-05-16 2014-02-25 International Business Machines Corporation Semiconductor active matrix on buried insulator
US9202000B1 (en) * 2014-09-30 2015-12-01 Cadence Design Systems, Inc. Implementing designs of guard ring and fill structures from simple unit cells

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59161834A (ja) * 1983-03-07 1984-09-12 Oki Electric Ind Co Ltd 半導体装置の製造方法
JPS61206262A (ja) * 1985-03-11 1986-09-12 Shindengen Electric Mfg Co Ltd 高耐圧プレ−ナ型半導体装置
US4988636A (en) * 1990-01-29 1991-01-29 International Business Machines Corporation Method of making bit stack compatible input/output circuits
EP0538507B1 (de) * 1991-10-22 1996-12-27 Deutsche ITT Industries GmbH Schutzschaltung für Anschlusskontakte von monolithisch integrierten Schaltungen
JP3223490B2 (ja) * 1993-06-30 2001-10-29 ソニー株式会社 半導体集積回路製造方法
US5965925A (en) 1997-10-22 1999-10-12 Artisan Components, Inc. Integrated circuit layout methods and layout structures
JP3998454B2 (ja) * 2001-10-31 2007-10-24 株式会社東芝 電力用半導体装置
JP2003142583A (ja) * 2001-11-01 2003-05-16 Seiko Epson Corp 半導体装置及びその設計方法
US6646509B2 (en) 2002-01-23 2003-11-11 Broadcom Corporation Layout technique for matched resistors on an integrated circuit substrate
US7393755B2 (en) 2002-06-07 2008-07-01 Cadence Design Systems, Inc. Dummy fill for integrated circuits
JP4353685B2 (ja) * 2002-09-18 2009-10-28 株式会社ルネサステクノロジ 半導体装置
US7148089B2 (en) * 2004-03-01 2006-12-12 Taiwan Semiconductor Manufacturing Co., Ltd. Method for forming copper fuse links

Also Published As

Publication number Publication date
KR101215425B1 (ko) 2012-12-26
CN1750252B (zh) 2012-05-30
US20060057840A1 (en) 2006-03-16
JP2006086533A (ja) 2006-03-30
JP2012060152A (ja) 2012-03-22
US7253012B2 (en) 2007-08-07
KR20120023172A (ko) 2012-03-12
TW200633007A (en) 2006-09-16
US7407824B2 (en) 2008-08-05
KR20060051300A (ko) 2006-05-19
CN1750252A (zh) 2006-03-22
US20070212873A1 (en) 2007-09-13
TWI368258B (en) 2012-07-11

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