JP4937957B2 - 配線基板及びその実装構造 - Google Patents

配線基板及びその実装構造 Download PDF

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Publication number
JP4937957B2
JP4937957B2 JP2008091192A JP2008091192A JP4937957B2 JP 4937957 B2 JP4937957 B2 JP 4937957B2 JP 2008091192 A JP2008091192 A JP 2008091192A JP 2008091192 A JP2008091192 A JP 2008091192A JP 4937957 B2 JP4937957 B2 JP 4937957B2
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Japan
Prior art keywords
wiring board
coil
external connection
wiring
connection terminal
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JP2008091192A
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English (en)
Japanese (ja)
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JP2009246153A (ja
JP2009246153A5 (https=
Inventor
宏章 三水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2008091192A priority Critical patent/JP4937957B2/ja
Publication of JP2009246153A publication Critical patent/JP2009246153A/ja
Publication of JP2009246153A5 publication Critical patent/JP2009246153A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2008091192A 2008-03-31 2008-03-31 配線基板及びその実装構造 Active JP4937957B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008091192A JP4937957B2 (ja) 2008-03-31 2008-03-31 配線基板及びその実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008091192A JP4937957B2 (ja) 2008-03-31 2008-03-31 配線基板及びその実装構造

Publications (3)

Publication Number Publication Date
JP2009246153A JP2009246153A (ja) 2009-10-22
JP2009246153A5 JP2009246153A5 (https=) 2011-02-10
JP4937957B2 true JP4937957B2 (ja) 2012-05-23

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ID=41307719

Family Applications (1)

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JP2008091192A Active JP4937957B2 (ja) 2008-03-31 2008-03-31 配線基板及びその実装構造

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JP (1) JP4937957B2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH081772Y2 (ja) 1989-09-07 1996-01-24 東芝タンガロイ株式会社 セラミックス製チップ刃付丸鋸
JP2570513B2 (ja) 1991-05-20 1997-01-08 日立工機株式会社 金属切断チップソー用チップ材

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2765399B1 (fr) * 1997-06-27 2001-12-07 Sgs Thomson Microelectronics Dispositif semi-conducteur a moyen d'echanges a distance
JP2000114046A (ja) * 1998-10-05 2000-04-21 Alps Electric Co Ltd 薄膜トランス
JP2005340577A (ja) * 2004-05-28 2005-12-08 Matsushita Electric Ind Co Ltd 多層プリント基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH081772Y2 (ja) 1989-09-07 1996-01-24 東芝タンガロイ株式会社 セラミックス製チップ刃付丸鋸
JP2570513B2 (ja) 1991-05-20 1997-01-08 日立工機株式会社 金属切断チップソー用チップ材

Also Published As

Publication number Publication date
JP2009246153A (ja) 2009-10-22

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