JP4926811B2 - 樹脂組成物、プリプレグ、積層板及び配線板 - Google Patents

樹脂組成物、プリプレグ、積層板及び配線板 Download PDF

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Publication number
JP4926811B2
JP4926811B2 JP2007116605A JP2007116605A JP4926811B2 JP 4926811 B2 JP4926811 B2 JP 4926811B2 JP 2007116605 A JP2007116605 A JP 2007116605A JP 2007116605 A JP2007116605 A JP 2007116605A JP 4926811 B2 JP4926811 B2 JP 4926811B2
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Japan
Prior art keywords
resin
thermal expansion
manufactured
elastic modulus
epoxy resin
Prior art date
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JP2007116605A
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English (en)
Japanese (ja)
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JP2007314782A (ja
JP2007314782A5 (enExample
Inventor
高示 森田
伸 高根沢
和永 坂井
裕介 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2007116605A priority Critical patent/JP4926811B2/ja
Publication of JP2007314782A publication Critical patent/JP2007314782A/ja
Publication of JP2007314782A5 publication Critical patent/JP2007314782A5/ja
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Publication of JP4926811B2 publication Critical patent/JP4926811B2/ja
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  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
JP2007116605A 2006-04-28 2007-04-26 樹脂組成物、プリプレグ、積層板及び配線板 Active JP4926811B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007116605A JP4926811B2 (ja) 2006-04-28 2007-04-26 樹脂組成物、プリプレグ、積層板及び配線板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006125603 2006-04-28
JP2006125603 2006-04-28
JP2007116605A JP4926811B2 (ja) 2006-04-28 2007-04-26 樹脂組成物、プリプレグ、積層板及び配線板

Related Child Applications (4)

Application Number Title Priority Date Filing Date
JP2008204304A Division JP5338187B2 (ja) 2006-04-28 2008-08-07 無機充填剤含有樹脂組成物、プリプレグ、積層板及び配線板
JP2008204303A Division JP4950141B2 (ja) 2006-04-28 2008-08-07 樹脂付フィルム、積層板及び配線板
JP2008204305A Division JP4950142B2 (ja) 2006-04-28 2008-08-07 プリプレグ、積層板及び配線板
JP2009160940A Division JP5316267B2 (ja) 2006-04-28 2009-07-07 樹脂組成物、プリプレグ、積層板及び配線板

Publications (3)

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JP2007314782A JP2007314782A (ja) 2007-12-06
JP2007314782A5 JP2007314782A5 (enExample) 2008-09-25
JP4926811B2 true JP4926811B2 (ja) 2012-05-09

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JP2007116605A Active JP4926811B2 (ja) 2006-04-28 2007-04-26 樹脂組成物、プリプレグ、積層板及び配線板

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JP (1) JP4926811B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY146556A (en) * 2006-09-21 2012-08-30 Sumitomo Bakelite Co Resin composition, prepreg, and laminate
JP2010100803A (ja) * 2008-09-24 2010-05-06 Sekisui Chem Co Ltd エポキシ系樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板及び多層積層板
JP5540494B2 (ja) * 2008-10-30 2014-07-02 日立化成株式会社 熱硬化性樹脂組成物、及びこれを用いたプリプレグ，積層板及びプリント配線板
JP5417799B2 (ja) * 2008-10-30 2014-02-19 日立化成株式会社 熱硬化性樹脂組成物、及びこれを用いたプリプレグ，積層板
JP2010222569A (ja) * 2009-02-24 2010-10-07 Hitachi Chem Co Ltd 樹脂組成物及びそれを用いたプリプレグ、積層板、配線板
JP5136573B2 (ja) 2009-02-24 2013-02-06 日立化成工業株式会社 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板
SG183365A1 (en) 2010-02-24 2012-09-27 Hitachi Chemical Co Ltd Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board
KR101868161B1 (ko) 2010-02-24 2018-06-15 히타치가세이가부시끼가이샤 바니시, 프리프레그, 수지 부착 필름, 금속박장 적층판, 인쇄 배선판
JP5779962B2 (ja) * 2011-04-27 2015-09-16 日立化成株式会社 パッケージ基板用樹脂組成物並びにこれを用いたプリプレグ及び積層板
JP2012054589A (ja) * 2011-10-31 2012-03-15 Hitachi Chem Co Ltd 半導体パッケージ
JP2012124479A (ja) * 2011-11-24 2012-06-28 Hitachi Chem Co Ltd 半導体パッケージ
JP5988220B2 (ja) * 2012-09-28 2016-09-07 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板、プリント配線板、多層プリント配線板
JP7609148B2 (ja) * 2022-09-26 2025-01-07 味の素株式会社 樹脂組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05140266A (ja) * 1991-11-22 1993-06-08 Shin Kobe Electric Mach Co Ltd 積層板用樹脂組成物および積層板の製造法
JP2736212B2 (ja) * 1992-10-26 1998-04-02 住友ベークライト株式会社 エポキシ樹脂組成物
JPH09216933A (ja) * 1996-02-07 1997-08-19 Toshiba Chem Corp エポキシ樹脂組成物および半導体封止装置
JP3659842B2 (ja) * 1999-08-09 2005-06-15 住友ベークライト株式会社 積層板用難燃性樹脂組成物、プリプレグ及び積層板
JP4725704B2 (ja) * 2003-05-27 2011-07-13 味の素株式会社 多層プリント配線板の層間絶縁用樹脂組成物、接着フィルム及びプリプレグ
JP4702764B2 (ja) * 2003-09-04 2011-06-15 日本化薬株式会社 エポキシ樹脂組成物及びその硬化物
JP4354242B2 (ja) * 2003-09-26 2009-10-28 ジャパンエポキシレジン株式会社 新規結晶性エポキシ樹脂、硬化性エポキシ樹脂組成物およびその硬化体
JP4687224B2 (ja) * 2004-04-23 2011-05-25 東レ株式会社 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
CA2599153A1 (en) * 2005-02-25 2006-08-31 Nippon Kayaku Kabushiki Kaisha Epoxy resin, hardenable resin composition containing the same and use thereof
JP2007182544A (ja) * 2005-12-07 2007-07-19 Hitachi Chem Co Ltd ハロゲンフリー樹脂組成物及びそれを用いたプリプレグ並びにプリント配線板

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JP2007314782A (ja) 2007-12-06

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