JP4917780B2 - Exposure equipment - Google Patents

Exposure equipment Download PDF

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JP4917780B2
JP4917780B2 JP2005260463A JP2005260463A JP4917780B2 JP 4917780 B2 JP4917780 B2 JP 4917780B2 JP 2005260463 A JP2005260463 A JP 2005260463A JP 2005260463 A JP2005260463 A JP 2005260463A JP 4917780 B2 JP4917780 B2 JP 4917780B2
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substrate
exposure
gas
temperature
pad
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JP2007072267A (en
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健 矢倉
行一 六原
康一 梶山
琢郎 竹下
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Sumitomo Chemical Co Ltd
V Technology Co Ltd
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V Technology Co Ltd
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Description

本発明は、液晶パネル用カラーフィルタ等を製造する際に用いられる露光装置に関するものである。   The present invention relates to an exposure apparatus used when manufacturing a color filter for a liquid crystal panel and the like.

従来、液晶パネル用カラーフィルタの製造において、ブラックマトリックスを形成した基板上に着色層を形成するにあたり、基板に塗布した着色剤に対して露光する場合、前記基板が撓んでいたり、基板の表面に温度差があると露光むらが発生する。
これを防止するために、従来の露光装置においては、塗布装置から露光装置への搬送経路において基板の表面に温度調整された気体をノズルから吹き付けることにより、基板の温度を設定温度に調整するようにした基板温度制御装置を用いることが知られている（例えば、特許文献１、特許文献２参照）。
また、温度制御された基板支持プレートの基板載置面に複数の空気孔を設け、該空気孔から流量制御された空気を噴出させて、基板を前記基板載置面上に浮上させた状態で基板支持プレートの温度により熱処理し、または前記空気孔を真空吸引することによって、基板を前記基板載置面に密着させた状態で基板支持プレートにより冷却するようにした基板温度制御装置も知られている（例えば、特許文献３、特許文献４参照）。
特開２００４−２９６７７３号公報 特開２００２−７２４９２号公報 特開２００３−３４７１８３号公報 特開２００４−３０３９６１号公報 Conventionally, in the production of a color filter for a liquid crystal panel, when forming a colored layer on a substrate on which a black matrix is formed, when the colorant applied to the substrate is exposed, the substrate is bent or the surface of the substrate is If there is a temperature difference, uneven exposure will occur.
In order to prevent this, in the conventional exposure apparatus, the temperature of the substrate is adjusted to the set temperature by blowing the temperature-adjusted gas from the nozzle on the surface of the substrate in the transport path from the coating apparatus to the exposure apparatus. It is known to use a substrate temperature control device that is configured as described above (see, for example, Patent Document 1 and Patent Document 2).
In addition, a plurality of air holes are provided on the substrate mounting surface of the temperature-controlled substrate support plate, and air whose flow rate is controlled is ejected from the air holes so that the substrate floats on the substrate mounting surface. There is also known a substrate temperature control device in which the substrate is cooled by the substrate support plate in a state where the substrate is in close contact with the substrate mounting surface by performing heat treatment according to the temperature of the substrate support plate or vacuuming the air holes. (For example, see Patent Document 3 and Patent Document 4).
JP 2004-296773 A JP 2002-72492 A JP 2003-347183 A JP 2004-303961 A

しかし、前記露光装置に用いる基板温度制御装置においては、前記基板を露光装置に搬送するに先だって、その搬送経路の途中で基板を温度調整しているので、基板が露光装置に搬送されて露光されるまでの間に温度変化を来たしてしまうおそれがある。そして、基板の温度調整処理が露光処理と別工程で行われるので、基板の露光処理時間が長くなると共に、処理ラインが長くなって装置の所要設置空間が大きくなる問題がある。
また、後者の基板温度制御装置においては、これを露光装置に適用する場合には、基板支持プレートが露光装置と別に設けられることとなり、前者の基板温度制御装置と同様な問題があると共に、強いて基板支持プレートを露光装置に組み込む場合には、基板に照射された露光光の基板支持プレートによる反射光が生じるため、基板の露光を均質に行えない問題がある。 However, in the substrate temperature control apparatus used in the exposure apparatus, the temperature of the substrate is adjusted in the middle of the transport path prior to transporting the substrate to the exposure apparatus, so that the substrate is transported to the exposure apparatus and exposed. There is a risk of temperature changes in the meantime. Since the substrate temperature adjustment process is performed in a separate process from the exposure process, there are problems that the exposure process time of the substrate becomes longer and the processing line becomes longer and the required installation space of the apparatus becomes larger.
Further, in the latter substrate temperature control apparatus, when this is applied to the exposure apparatus, the substrate support plate is provided separately from the exposure apparatus, which has the same problems as the former substrate temperature control apparatus, and forcibly. When the substrate support plate is incorporated in the exposure apparatus, there is a problem that exposure of the substrate cannot be performed uniformly because the exposure light irradiated to the substrate is reflected by the substrate support plate.

本発明は、上記事情に鑑みてなされたものであって、基板の温度調整を的確に行うことができ、基板における所定の露光領域に均質に、かつ効率的に露光することができると共に、装置の構成が簡単で、その所要設置空間も小さくて済む露光装置を提供することを目的とする。   The present invention has been made in view of the above circumstances, can accurately adjust the temperature of the substrate, can uniformly and efficiently expose a predetermined exposure region on the substrate, and an apparatus. An object of the present invention is to provide an exposure apparatus that has a simple structure and requires a small installation space.

本発明は、前記課題を解決するために、以下の点を特徴としている。
すなわち、請求項１に係る露光装置は、基板搬送手段によって露光領域に搬送される基板に対して、前記露光領域において露光光源からの露光光を露光光学系を通して照射し、前記基板上に所要の露光パターンを形成する露光装置であって、前記基板の搬送方向における前記露光領域の上流側と下流側の位置に、前記基板の下側へ温度調整された気体を噴出させて基板を浮上させた状態で支持する基板支持パッドが配置されており、前記基板支持パッドは、上面を平らに形成した突起からなるパッド部を、前記基板の搬送方向とそれに直角な方向に間隔をあけて複数個備えており、気体供給装置に連絡された気体噴出孔が、前記パッド部の上面に開口して設けられると共に、気体吸引装置に連絡させた気体吸引孔が、基板の搬送方向における少なくとも一対のパッド部間に形成された凹部に開口して設けられ、前記気体噴出孔は前記基板の搬送方向における前記露光領域の上流側と下流側に近接して設けられ、気体の温度調整を行う温度制御装置は、前記気体支持パッドの上流側のみに配設されていることを特徴としている。 The present invention is characterized by the following points in order to solve the above problems.
That is, the exposure apparatus according to claim 1 irradiates exposure light from an exposure light source through the exposure optical system in the exposure region onto the substrate transported to the exposure region by the substrate transport unit, and the substrate is provided with a required amount. An exposure apparatus for forming an exposure pattern, wherein a temperature-adjusted gas is blown to the lower side of the substrate at positions upstream and downstream of the exposure region in the transport direction of the substrate to float the substrate. A substrate support pad for supporting the substrate in a state is disposed, and the substrate support pad includes a plurality of pad portions each formed of a protrusion having a flat upper surface with an interval in a direction perpendicular to the transport direction of the substrate. And a gas ejection hole communicated with the gas supply device is provided in the upper surface of the pad portion, and a gas suction hole communicated with the gas suction device is provided in the substrate transport direction. It provided open to the recess formed between the pair of the pad portion even without the gas ejection hole is provided close to the upstream side and the downstream side of the exposure area in the transport direction of the substrate, the temperature adjustment of the gas The temperature control device for performing the above is characterized by being disposed only on the upstream side of the gas support pad .

請求項２に係る露光装置は、請求項１に記載の露光装置において、前記温度制御装置は、基板支持パッドに設けた温度センサーによって検出される温度にもとづいて、前記気体供給装置から前記気体噴出孔に供給される気体の温度を調整することを特徴としている。 An exposure apparatus according to a second aspect is the exposure apparatus according to the first aspect, wherein the temperature control device ejects the gas from the gas supply device based on a temperature detected by a temperature sensor provided on a substrate support pad. It is characterized by adjusting the temperature of the gas supplied into the hole.

本発明によれば、以下の優れた効果を奏する。
請求項１に係る露光装置によれば、露光領域の上流側で基板支持パッドから噴出される温度調整された気体によって、基板が僅かに浮上されながら該気体に接触されるので、気体との熱伝達によって基板を的確に温度調整することができると共に、露光領域の下流側でも基板支持パッドから噴出される気体によって基板が温度調整されるので、基板は、露光領域の上流側と下流側とで温度差が生じることなく、露光領域の全体において温度むらが無くなり、露光領域の全体を均質に露光することができる。
また、基板は温度調整されながら露光領域に移動されて直ちに露光されるので、基板の温度調整と露光を１つの装置内で連続して一工程で行うことができ、基板の露光を効率的に行うことができると共に、露光装置の構成が簡単となり、その所要設置空間も小さくすることができる。 The present invention has the following excellent effects.
According to the exposure apparatus of the first aspect, the temperature-adjusted gas ejected from the substrate support pad on the upstream side of the exposure region is brought into contact with the gas while being slightly lifted. The temperature of the substrate can be accurately adjusted by the transmission, and the temperature of the substrate is also adjusted by the gas ejected from the substrate support pad on the downstream side of the exposure region. There is no temperature difference, and there is no temperature unevenness in the entire exposure area, and the entire exposure area can be uniformly exposed.
In addition, since the substrate is moved to the exposure region while being adjusted in temperature and exposed immediately, the temperature adjustment and exposure of the substrate can be continuously performed in one apparatus in one process, and the exposure of the substrate is efficiently performed. In addition to this, the configuration of the exposure apparatus can be simplified and the required installation space can be reduced.

しかも、気体供給装置と気体吸引装置の動作を制御して基板支持パッドの気体噴出孔からの気体の噴出圧と気体吸引孔からの気体の吸引圧を調節することにより、基板支持パッドからの基板の浮上量を正確に調整することができ、露光領域において基板の基板支持パッドによる無接触状態での支持を高精度に行うことができる。 Moreover, by controlling the operation of the gas supply apparatus and the gas suction device for regulating the suction pressure of the gas from the ejection pressure and a gas suction hole of the gas from the gas ejection hole of the substrate support pads, from the substrate support pad The flying height of the substrate can be adjusted accurately, and the substrate can be supported in a non-contact state by the substrate support pad in the exposure region with high accuracy.

請求項２に係る露光装置によれば、気体噴出孔から噴出する気体に接触して気体と等しい温度になっている基板支持パッドの温度を検出することにより、気体の温度を容易に検出することができるので、気体の温度調整を的確に行うことができる。 According to the exposure apparatus of the second aspect , the temperature of the gas can be easily detected by detecting the temperature of the substrate support pad that is in contact with the gas ejected from the gas ejection hole and has a temperature equal to the gas. Therefore, the temperature of the gas can be adjusted accurately.

以下、本発明の一実施の形態に係る露光装置について、添付図面を参照して説明する。
図１〜図３において、１は本発明の一実施の形態に係る露光装置を示す。この露光装置１は、支持脚２ａによって床面に設置された基台２と、該基台２上にＸ軸方向ｘに向けられ、Ｙ軸方向ｙに間隔をあけて立設された一対の正面視（図３）で門型に形成された支柱３ａ，３ａと、前記基台２に設けた支持部材４上に固定したＸ軸レール（案内レール）５に沿ってＸ軸方向ｘに所定ストロークだけ往復移動する支持台６と、該支持台６上の一側部（図１で上側、図３、図４で左側）に固定した架台７に設置されＹ軸方向ｙに向けたＹ軸レール（案内レール）８に沿ってＹ軸方向ｙに往復移動する往復台９とを備えている。なお、前記支柱３ａ，３ａは上端の両端部で互いに接続フレーム３ｂで連結されている。 Hereinafter, an exposure apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.
1 to 3, reference numeral 1 denotes an exposure apparatus according to an embodiment of the present invention. The exposure apparatus 1 includes a base 2 installed on a floor surface by support legs 2a and a pair of standing on the base 2 in the X-axis direction x and spaced apart in the Y-axis direction y. Predetermined in the X-axis direction x along the pillars 3a, 3a formed in a gate shape in front view (FIG. 3) and the X-axis rail (guide rail) 5 fixed on the support member 4 provided on the base 2 A support base 6 that reciprocates by a stroke, and a Y axis that is installed on a base 7 fixed on one side of the support base 6 (upper side in FIG. 1, left side in FIGS. 3 and 4) and directed in the Y-axis direction y A carriage 9 that reciprocates in the Y-axis direction y along a rail (guide rail) 8 is provided. The support columns 3a and 3a are connected to each other by connection frames 3b at both ends at the upper end.

前記支持台６の中央の上面にはテーブル１０が固定されており、該テーブル１０上には露光対象である基板Ｗを気体圧力で支持して通過させる基板支持パッド１１が取り付けられている。また、前記支持台６上には、前記基板支持パッド１１を間にしてそのＹ軸方向ｙの前後（図１で左右）に前記基板Ｗを下から支える一対の搬送台１２，１２が設置されている。そして、前記往復台９には、前記搬送台１２上に支持された基板Ｗの側縁部（図１で上側縁）を上下一対のグリップ１３ａ，１３ａ（図４参照）で把持する基板把持部１３が複数取り付けられ、往復台９がＹ軸方向ｙに往復することにより、前記基板把持部１３が基板Ｗを掴んで一方の搬送台１２から前記基板支持パッド１１の区間を通過して他方の搬送台１２まで搬送するようになっている。
また、前記支持台６上には、基板ＷのＸ軸方向ｘの端部に位置決め部材１４ａを当接させて基板ＷをＸ軸方向ｘに位置決めして前記基板把持部１３に把持させるためのＸ軸位置調節装置１４と、基板ＷのＹ軸方向ｙの端部に位置決め部材１５ａを当接させて基板ＷをＹ軸方向ｙに位置決めして基板把持部１３に把持させるためのＹ軸位置調節装置１５とが設備されている。 A table 10 is fixed to the upper surface of the center of the support base 6, and a substrate support pad 11 is attached on the table 10 to support and pass the substrate W to be exposed with gas pressure. Further, on the support table 6, a pair of transport tables 12, 12 that support the substrate W from below is installed in the front and back of the Y-axis direction y (left and right in FIG. 1) with the substrate support pad 11 in between. ing. The carriage 9 has a substrate gripping portion for gripping a side edge (upper edge in FIG. 1) of the substrate W supported on the transport table 12 with a pair of upper and lower grips 13a and 13a (see FIG. 4). 13 is attached, and the carriage 9 reciprocates in the Y-axis direction y, so that the substrate gripping part 13 grips the substrate W and passes through the section of the substrate support pad 11 from one transport table 12 to the other. It conveys to the conveyance stand 12.
Further, on the support base 6, a positioning member 14 a is brought into contact with an end portion of the substrate W in the X-axis direction x so that the substrate W is positioned in the X-axis direction x and held by the substrate gripping portion 13. The X-axis position adjusting device 14 and the Y-axis position for positioning the substrate W in the Y-axis direction y by causing the positioning member 15a to contact the end of the substrate W in the Y-axis direction y and gripping the substrate gripping portion 13 An adjustment device 15 is provided.

また、前記門型の支柱３ａ，３ａの一方（図２で左方）の上部ビーム３ｃには、そのＸ軸方向の中央部に位置して第１の露光ヘッド１６Ａが、他方の（図２で右方）の上部ビーム３ｃには、第１の露光ヘッド１６ＡのＸ軸方向ｘにおける両側に位置して第２、第３の露光ヘッド１６Ｂ，１６Ｃがそれぞれ取り付けられている。
前記各露光ヘッド１６Ａ，１６Ｂ，１６Ｃは、それぞれ、露光光源１７と、反射鏡１８と投影レンズ１９を有する露光光学系２０と、反射鏡１８と投影レンズ１９との間にあって露光光学系２０の光軸Ｌ上に設けたマスク２１とを備え、前記露光光源部１７からの露光光を前記マスク２１の開口部を通して前記基板支持パッド１１上にある基板Ｗに照射して、前記開口部の像（露光パターン）を基板Ｗの表面に転写するようになっている。 In addition, the upper beam 3c of one of the gate-shaped support columns 3a and 3a (left side in FIG. 2) has the first exposure head 16A located at the center in the X-axis direction and the other (FIG. 2). The right and left) upper beam 3c has second and third exposure heads 16B and 16C attached to both sides in the X-axis direction x of the first exposure head 16A.
Each of the exposure heads 16A, 16B, and 16C is disposed between the exposure light source 17, the exposure optical system 20 having the reflection mirror 18 and the projection lens 19, and the light of the exposure optical system 20 between the reflection mirror 18 and the projection lens 19, respectively. A mask 21 provided on the axis L, and irradiating the substrate W on the substrate support pad 11 with the exposure light from the exposure light source unit 17 through the opening of the mask 21 to form an image of the opening ( The exposure pattern) is transferred to the surface of the substrate W.

前記基板支持パッド１１は、図５、図６に示すように、前記露光ヘッド１６Ａ，１６Ｂ，１６Ｃに対応させて、Ｘ軸方向ｘに３つに区分されて前記テーブル１０の上板１０ａ上に配置されたパッド集合体１１Ａ，１１Ｂ，１１Ｃからなっている。各パッド集合体１１Ａ，１１Ｂ，１１Ｃは、それぞれ、突起からなる単位パッド（パッド部）２２をＸ軸方向ｘとＹ軸方向ｙにＸ軸溝２３およびＸ軸方向ｘに沿う凹部２２ａとＹ軸溝２４を隔てて複数個（図示の例ではＸ軸方向ｘに８個、Ｙ軸方向ｙに１２個）配置して構成されている。さらに、各パッド集合体１１Ａ，１１Ｂ，１１ＣはＹ軸方向ｙに３固ずつのブロック１１ａ，１１ｂ，１１ｃに分けられて、それぞれ、周囲の３箇所に設けた取付フランジ２５を介して、ボルトと位置決めピンからなる固定具２６によって前記テーブル１０の上板１０ａに固定されている。   As shown in FIGS. 5 and 6, the substrate support pad 11 is divided into three in the X-axis direction x so as to correspond to the exposure heads 16A, 16B, and 16C, and is placed on the upper plate 10a of the table 10. The pad assemblies 11A, 11B, and 11C are arranged. Each of the pad aggregates 11A, 11B, and 11C includes a unit pad (pad portion) 22 formed of a protrusion in the X-axis direction x and the Y-axis direction y, the X-axis groove 23, and the recess 22a and the Y-axis along the X-axis direction x. A plurality (8 in the X-axis direction x and 12 in the Y-axis direction y in the illustrated example) are arranged across the groove 24. Further, each of the pad assemblies 11A, 11B, 11C is divided into three blocks 11a, 11b, 11c in the Y-axis direction y. It is fixed to the upper plate 10a of the table 10 by a fixing tool 26 comprising a positioning pin.

各パッド集合体１１Ａ，１１Ｂ，１１Ｃの各ブロック１１ａ，１１ｂ，１１ｃの相互間におけるＸ軸溝２３ａの間隔は、他の箇所のＸ軸溝２３の間隔より広く設定されており、前記露光ヘッド１６Ａ，１６Ｂ，１６Ｃによる露光領域２７に対応する露光部２８とされ、その下方はパッド構成部材が存在しない空間とされている。各パッド集合体１１Ａ，１１Ｂ，１１ＣのＸ軸方向ｘの幅は前記露光領域２７（露光部２８）のＸ軸方向ｘにおける幅の略３個分に相当している。
また、基板支持パッド１１には、図７に示すように、一対の単位パッド２２，２２をＹ軸方向ｙに隔てる前記凹部２２ａに開口する気体吸引孔２９が上下方向に向けて設けられ、前記凹部２２ａのＹ軸方向ｙにおける両側の単位パッド２２，２２に、それらの上面２２ｂに開口する一対の気体噴出孔３０，３０が上下方向に向けて設けられている。そして、前記各単位パッド２２の上面は平滑に仕上げられている。 The interval between the X-axis grooves 23a between the blocks 11a, 11b, and 11c of each pad assembly 11A, 11B, and 11C is set wider than the interval between the X-axis grooves 23 at other locations, and the exposure head 16A. , 16B, and 16C, the exposure unit 28 corresponds to the exposure region 27, and the space below it is a space where there is no pad component. The width of each pad assembly 11A, 11B, 11C in the X-axis direction x corresponds to approximately three widths in the X-axis direction x of the exposure region 27 (exposure portion 28).
Further, as shown in FIG. 7, the substrate support pad 11 is provided with a gas suction hole 29 that opens in the recess 22a that separates the pair of unit pads 22 and 22 in the Y-axis direction y, and is provided in the vertical direction. The unit pads 22 and 22 on both sides of the recess 22a in the Y-axis direction y are provided with a pair of gas ejection holes 30 and 30 that open to the upper surface 22b in the vertical direction. The upper surface of each unit pad 22 is finished smoothly.

前記各搬送台１２，１２は、前記支持台６の上面に固定された受け台１２ａにＸ軸方向ｘに間隔をあけて複数の支持部材１２ｂが立設され、各支持部材１２ｂの上端にＹ軸方向ｙに向けて水平にローラ保持材１２ｃが固定され、そして、該ローラ保持材１２ｃにＹ軸方向ｙに所定間隔をあけて配置され、水平軸に支持されてＹ軸方向ｙに沿う面内で回転するローラ１２ｄを設けて構成されている。前記ローラ１２ｄの上面は、前記基板支持パッドの１１の単位パッド２２の上面２２ｂより微小距離ｅだけ高くなるように設定されている。   Each of the transport tables 12, 12 is provided with a plurality of support members 12 b erected at intervals in the X-axis direction x on a receiving table 12 a fixed to the upper surface of the support table 6. A roller holding member 12c is fixed horizontally in the axial direction y, and is disposed on the roller holding member 12c at a predetermined interval in the Y-axis direction y. The surface is supported by the horizontal axis and extends along the Y-axis direction y. A roller 12d that rotates inside is provided. The upper surface of the roller 12d is set to be slightly higher than the upper surface 22b of the unit pad 22 of the substrate support pad 11 by a minute distance e.

なお、前記支持台６には制御ボックス３１が設置されている。該制御ボックス３１は支持台６をＸ軸方向ｘに往復移動させるＸ軸駆動手段、前記往復台９を作動させて前記基板把持部１３を介して基板ＷをＹ軸方向ｙに往復移動させるＹ軸駆動手段、前記基板把持部１３を作動させてグリップ１３ａで基板Ｗを把持、開放させる把持部作動手段、前記Ｘ軸，Ｙ軸位置調節装置１４，１５を操作する位置決め作動手段等を制御する動作制御部、前記各露光ヘッド１６Ａ，１６Ｂ，１６Ｃの動作を制御する露光ヘッド制御手段や、前記基板支持パッド１１による基板Ｗの温度を調整するための基板温度制御装置３２が格納されている。前記架台７、Ｙ軸レール８、往復台９、搬送台１２、基板把持部１３等によって基板搬送手段Ｆが構成されている。   A control box 31 is installed on the support base 6. The control box 31 is an X-axis driving means for reciprocating the support base 6 in the X-axis direction x, and the control box 31 operates the reciprocating base 9 to reciprocate the substrate W in the Y-axis direction y via the substrate gripping portion 13. Axis driving means, gripping part actuating means for actuating the substrate gripping part 13 and gripping and releasing the substrate W with the grip 13a, positioning actuating means for operating the X-axis and Y-axis position adjusting devices 14, 15 and the like are controlled. An operation control unit, exposure head control means for controlling the operation of each of the exposure heads 16A, 16B, and 16C, and a substrate temperature control device 32 for adjusting the temperature of the substrate W by the substrate support pad 11 are stored. Substrate transport means F is constituted by the gantry 7, the Y-axis rail 8, the carriage 9, the transport platform 12, the substrate gripping portion 13, and the like.

前記基板温度制御装置３２は、図７に示すように、前記基板支持パッド１１の単位パッド２２に設けた前記気体噴出孔３０に配管３３によって連絡され、気体噴出孔３０に圧縮空気等の気体を供給するエアコンプレッサー等の気体供給装置３４と、前記配管３３に設けられて圧縮気体供給装置３４から送り出された気体の温度を調整する気体冷却装置３５と、該気体冷却装置３５の出口側における配管３３に設けられ管内を流れる気体の流量を調節する気体流量調節弁３６と、前記配管３３の気体流量調節弁３６の下流側に設けられ管内を流れる気体の温度を検出する温度センサー３７と、前記基板支持パッド１１の単位パッド２２に設けた前記気体吸引孔２９に配管３８によって連絡され、単位パッド２２の凹部２２ａ内の気体を吸引する真空ポンプ等の気体吸引ポンプ（気体吸引装置）３９と、前記配管３８の上流側（気体吸引孔２９に近い側）に設けられ管内を流れる気体の温度を検出する温度センサー４０と、前記配管３８を開閉する開閉弁４１と、前記単位パッド２２に装着されて単位パッド２２の温度を検出する温度センサー４２と、前記単位パッド２２上の基板Ｗに一定の気体圧を作用させるように前記気体供給装置３４と気体吸引ポンプ３９の作動を制御すると共に、前記温度センサー３７，４０，４２の検出温度にもとづいて前記気体冷却装置３５と気体流量調節弁３６の作動を制御する制御部（温度制御装置）４３とを備えている。   As shown in FIG. 7, the substrate temperature control device 32 is connected to the gas ejection hole 30 provided in the unit pad 22 of the substrate support pad 11 by a pipe 33, and gas such as compressed air is supplied to the gas ejection hole 30. A gas supply device 34 such as an air compressor to be supplied, a gas cooling device 35 that is provided in the pipe 33 and adjusts the temperature of the gas sent from the compressed gas supply device 34, and a pipe on the outlet side of the gas cooling device 35 A gas flow rate adjusting valve 36 for adjusting the flow rate of the gas flowing in the pipe provided in 33, a temperature sensor 37 for detecting the temperature of the gas flowing in the pipe provided on the downstream side of the gas flow rate adjusting valve 36 of the pipe 33, and The gas suction hole 29 provided in the unit pad 22 of the substrate support pad 11 is connected to the gas suction hole 29 by a pipe 38 and sucks the gas in the recess 22 a of the unit pad 22. A gas suction pump (gas suction device) 39 such as an empty pump, a temperature sensor 40 provided on the upstream side (side near the gas suction hole 29) of the pipe 38 to detect the temperature of the gas flowing in the pipe, and the pipe 38 An on-off valve 41 for opening and closing, a temperature sensor 42 attached to the unit pad 22 for detecting the temperature of the unit pad 22, and the gas supply so that a constant gas pressure is applied to the substrate W on the unit pad 22. A control unit (temperature control device) that controls the operation of the gas cooling pump 35 and the gas flow rate control valve 36 based on the detected temperatures of the temperature sensors 37, 40, 42 while controlling the operation of the device 34 and the gas suction pump 39. 43).

次に、上記のように構成された露光装置１の作用について説明する。
先ず、前記制御ボックス３１を操作して露光装置１を動作状態とした後に、基板Ｗを搬送台１２に載置して、Ｘ軸、Ｙ軸位置調節装置１４，１５によってＸ，Ｙ軸方向ｘ、ｙにおける基板Ｗの位置をその大きさに応じて調節してから、基板把持部１３のグリップ１３ａで基板Ｗを把持する。そして、前記支持台６をＸ軸方向ｘの一方（図１、図５で下方）に移動させて、各パッド集合体１１Ａ，１１Ｂ，１１Ｃにおける第１の露光部２８ａ（２８）の中央が、露光ヘッド１６Ａ，１６Ｂ，１６Ｃの投影レンズ１９の光軸Ｌの下方位置を通過するように合わせる。 Next, the operation of the exposure apparatus 1 configured as described above will be described.
First, after operating the control box 31 to bring the exposure apparatus 1 into an operating state, the substrate W is placed on the transport table 12 and the X and Y axis position adjusting devices 14 and 15 are used to adjust the X and Y axis directions x. Then, the position of the substrate W at y is adjusted according to its size, and then the substrate W is gripped by the grip 13 a of the substrate gripping portion 13. Then, the support base 6 is moved to one side in the X-axis direction x (downward in FIGS. 1 and 5), and the center of the first exposure unit 28a (28) in each pad assembly 11A, 11B, 11C is The exposure heads 16A, 16B, and 16C are adjusted so as to pass through a position below the optical axis L of the projection lens 19 of the exposure heads 16A, 16B, and 16C.

しかる後に、往復台９を作動させて基板把持部１３を介して基板Ｗを、例えば、図１、図５で右端側の待機位置からＹ軸方向ｙにおける左方へ一定速度で移動させ、基板Ｗの左端縁が第２、第３の露光ヘッド１６Ｂ，１６Ｃの光軸Ｌを少し通過した露光開始位置まで移動されたとき、前記露光ヘッド１６Ｂ，１６Ｃを動作させて第２、第３のパッド集合体１１Ｂ，１１Ｃにおける第１の露光部２８ａで基板Ｗに対する露光を開始し、また、基板Ｗの左端が第１の露光ヘッド１６Ａを少し通過したところで、該露光ヘッド１６Ａを動作させて第１のパッド集合体１１Ａにおける第１の露光部２８ａで基板Ｗに対する露光を開始する。そして、基板ＷがＹ軸方向ｙへ所定距離だけ移動して、各露光ヘッド１６Ａ，１６Ｂ，１６Ｃによって基板Ｗに対する露光が連続して行われる。これにより、前記露光部２８（２８ａ）では、各露光ヘッド１６Ａ，１６Ｂ，１６Ｃのマスク２１の開口部で画成される露光領域２７に対応して基板Ｗ上に露光パターンＰが投影されて露光され、基板Ｗの移動により、Ｘ軸方向ｘに所定の幅を有し基板Ｗの移動距離に相当する長さを有する帯状をした第１の露光帯域の露光が行われる。第１露光帯域の露光が終了すると、各露光ヘッド１６Ａ，１６Ｂ，１６Ｃによる基板Ｗの露光が一旦中断される。   Thereafter, the carriage 9 is operated to move the substrate W through the substrate gripping portion 13 at a constant speed, for example, from the standby position on the right end side to the left in the Y-axis direction y in FIGS. When the left end edge of W is moved to the exposure start position slightly passing through the optical axes L of the second and third exposure heads 16B and 16C, the exposure heads 16B and 16C are operated to move the second and third pads. Exposure to the substrate W is started by the first exposure unit 28a in the aggregates 11B and 11C, and when the left end of the substrate W slightly passes through the first exposure head 16A, the exposure head 16A is operated to perform the first exposure. The exposure of the substrate W is started by the first exposure unit 28a in the pad assembly 11A. Then, the substrate W is moved by a predetermined distance in the Y-axis direction y, and the exposure to the substrate W is continuously performed by the exposure heads 16A, 16B, and 16C. Thereby, in the exposure unit 28 (28a), an exposure pattern P is projected onto the substrate W corresponding to the exposure region 27 defined by the opening of the mask 21 of each exposure head 16A, 16B, 16C. As a result of the movement of the substrate W, exposure is performed in a first exposure band having a band shape having a predetermined width in the X-axis direction x and a length corresponding to the movement distance of the substrate W. When the exposure of the first exposure band is completed, the exposure of the substrate W by the exposure heads 16A, 16B, and 16C is temporarily interrupted.

次に、前記支持台６がＸ軸方向ｘの他端側（図１、図５で上端側）へ所定距離だけ移動された後に、基板Ｗが前記と反対であるＹ軸方向ｙにおける右側へ移動されて、前記と同様にして各パッド集合体１１Ａ〜１１Ｃにおける第２の露光部２８ｂで基板Ｗに対する露光が行われる。そして、基板Ｗが右端側に所定距離だけ移動して第１の露光帯域に隣接した第２の露光帯域の露光が終了すると、前記支持台６が更にＸ軸方向ｘの他端側へ所定距離だけ移動された後、再び、基板ＷがＹ軸方向ｙにおける左側へ移動されながら、各パッド集合体１１Ａ〜１１Ｃにおける第３の露光部２８ｃで基板Ｗに対する露光が行われる。これにより、第２の露光帯域に隣接して第３の露光帯域が露光されて基板Ｗに対する露光が完了する。このようにして、基板Ｗの表面にＸ軸方向ｘに間隔をあけて複数の平行な露光帯域が露光されることとなる。
なお、前記露光ヘッド１１Ａ，１１Ｂ，１１Ｃは、前記基板Ｗの大きさ（Ｘ軸方向ｘにおける大きさ）によって、所要のものを１つまたは複数選択して使用する。 Next, after the support 6 is moved a predetermined distance to the other end side in the X-axis direction x (the upper end side in FIGS. 1 and 5), the substrate W is moved to the right side in the Y-axis direction y opposite to the above. The substrate W is exposed by the second exposure unit 28b in each of the pad assemblies 11A to 11C in the same manner as described above. When the substrate W moves to the right end side by a predetermined distance and the exposure of the second exposure band adjacent to the first exposure band is completed, the support base 6 further moves the predetermined distance to the other end side in the X axis direction x. Then, the substrate W is exposed to the third exposure unit 28c in each of the pad assemblies 11A to 11C while the substrate W is moved to the left side in the Y-axis direction y again. As a result, the third exposure zone is exposed adjacent to the second exposure zone, and the exposure to the substrate W is completed. In this way, a plurality of parallel exposure zones are exposed on the surface of the substrate W with an interval in the X-axis direction x.
The exposure heads 11A, 11B, and 11C are used by selecting one or more required ones depending on the size of the substrate W (size in the X-axis direction x).

前記露光中は、基板温度制御装置３２の制御部４３が動作して、気体流量調節弁３４と開閉弁４１が開かれると共に気体供給装置３４から配管３３を通して圧力を調整された気体が、前記基板支持パッド１１における単位パッド２２の気体噴出孔３０から、単位パッド２２の上方を移動される基板Ｗの下面に噴射されることにより、基板Ｗが単位パッド２２の上面２２ｂから僅かな距離ｅ、例えば、数十ミクロンだけ浮上した状態で移動される。また、同時に、前記気体吸引装置３９が作動されて基板Ｗの下面に噴射された気体が前記気体吸引孔２９から吸引されることにより、気体噴出孔３０から噴出される気体による基板Ｗの浮上圧力と気体吸引孔２９から吸引される気体による基板Ｗの押し下げ圧力とが平衡され、基板Ｗの下面に発生する圧力が一定に保持されて、基板Ｗは上下に振動することなく安定した状態で円滑に露光部２３ａを移動される。   During the exposure, the control unit 43 of the substrate temperature control device 32 is operated to open the gas flow rate adjustment valve 34 and the on-off valve 41, and the gas whose pressure is adjusted from the gas supply device 34 through the pipe 33 is supplied to the substrate. The substrate W is ejected from the gas ejection hole 30 of the unit pad 22 in the support pad 11 onto the lower surface of the substrate W that is moved above the unit pad 22, so that the substrate W is a slight distance e from the upper surface 22 b of the unit pad 22, for example, , Moved in a state where it floated by several tens of microns. At the same time, the gas suction device 39 is operated and the gas jetted onto the lower surface of the substrate W is sucked from the gas suction hole 29, so that the floating pressure of the substrate W by the gas jetted from the gas jet hole 30. And the pressure by which the substrate W is pushed down by the gas sucked from the gas suction holes 29 is balanced, the pressure generated on the lower surface of the substrate W is kept constant, and the substrate W is smooth in a stable state without vibrating up and down. The exposure unit 23a is moved.

また、露光中は、前記気体噴出孔３０から噴出される気体の熱伝達によって前記基板Ｗが冷却される。その際、前記温度センサー３７により検出された気体噴出孔３０に供給される気体の温度と、前記温度センサー４０により検出された気体吸引孔２９から気体吸引装置３９に吸引される気体の温度と、温度センサー４２によって検出された単位パッド２２の温度とにもとづいて、前記制御部４３が前記気体冷却装置３５により配管３３内を流れる空気の冷却温度を調節すると共に、配管３３を経て前記気体噴出孔３０から噴出される気体の流量を調節することにより、基板Ｗの下面に供給される気体の温度を設定温度に調節される。   Further, during exposure, the substrate W is cooled by heat transfer of the gas ejected from the gas ejection holes 30. At that time, the temperature of the gas supplied to the gas ejection hole 30 detected by the temperature sensor 37, the temperature of the gas sucked into the gas suction device 39 from the gas suction hole 29 detected by the temperature sensor 40, Based on the temperature of the unit pad 22 detected by the temperature sensor 42, the control unit 43 adjusts the cooling temperature of the air flowing in the pipe 33 by the gas cooling device 35, and also passes through the pipe 33 and the gas ejection hole. By adjusting the flow rate of the gas ejected from 30, the temperature of the gas supplied to the lower surface of the substrate W is adjusted to the set temperature.

また、前記基板Ｗは、Ｘ，Ｙ軸方向ｘ，ｙに複数配置された単位パッド２２の気体噴出孔３０から噴出される気体によって全体が冷却され、特に、露光領域２７のＹ軸方向ｙ（基板Ｗの搬送方向）における両側（上流側と下流側）に近接した位置において、対をなす単位パッド２２，２２からの噴出空気で冷却されるので、基板Ｗは搬送方向に温度勾配が生じることなく、露光領域２７における温度を極めて均一に保持することができ、これにより、基板Ｗに対する露光がむら無く、均質に行われる。しかも、基板Ｗの露光領域２７の下方は、基板支持パッド１１を構成する部材の無い空間となっているので、露光光の反射波が生じることがなく、この点でも露光を均質に行える。   Further, the substrate W is entirely cooled by the gas ejected from the gas ejection holes 30 of the unit pads 22 arranged in the X and Y axis directions x and y, and in particular, in the Y axis direction y ( Since the substrate W is cooled by the blown air from the pair of unit pads 22 and 22 at positions close to both sides (upstream side and downstream side) in the transport direction of the substrate W, the substrate W has a temperature gradient in the transport direction. In addition, the temperature in the exposure region 27 can be kept extremely uniform, so that the substrate W is uniformly exposed without unevenness. In addition, since the space below the exposure region 27 of the substrate W is a space without the members constituting the substrate support pad 11, the reflected light of the exposure light is not generated, and the exposure can be performed uniformly in this respect.

以上説明したように、実施の形態に係る露光装置１は、基板搬送手段Ｆによって一定方向に搬送される基板Ｗに対して、露光領域２７で露光光源１７からの露光光を露光光学系２０を通して照射し、前記基板Ｗ上に所要の露光パターンＰを形成する露光装置であって、前記露光領域２７を間にして前記基板Ｗの搬送方向における上流側と下流側の位置に、基板Ｗの下側へ温度調整された気体を噴出させて基板Ｗを浮上させた状態で支持する基板支持パッド１１が配置された構成とされている。   As described above, the exposure apparatus 1 according to the embodiment passes the exposure light from the exposure light source 17 through the exposure optical system 20 in the exposure region 27 with respect to the substrate W transported in a certain direction by the substrate transport means F. An exposure apparatus that irradiates and forms a required exposure pattern P on the substrate W, with the exposure region 27 in between, at upstream and downstream positions in the transport direction of the substrate W. A substrate support pad 11 that supports the substrate W in a state where the temperature-adjusted gas is jetted to the side and the substrate W is floated is arranged.

したがって、前記実施の形態に係る露光装置１によれば、露光領域２７の上流側で基板支持パッド１１から噴出される温度調整された気体によって、基板Ｗが僅かに浮上されながら該気体に接触されるので、気体との熱伝達によって基板Ｗを的確に温度調整することができると共に、露光領域２７の下流側でも基板支持パッド１１から噴出される気体によって基板Ｗが温度調整されるので、基板Ｗは、露光領域２７の上流側と下流側とで温度差が生じることなく、露光領域の全体において温度むらが無くなり、露光領域２７の全体を均質に露光することができる。
また、基板Ｗは温度調整されながら露光領域２７に移動されて直ちに露光されるので、基板Ｗの温度調整と露光を１つの装置内で連続して一工程で行うことができ、基板Ｗの露光を効率的に行うことができると共に、露光装置１の構成が簡単となり、その所要設置空間も小さくすることができる。 Therefore, according to the exposure apparatus 1 according to the embodiment, the substrate W is brought into contact with the gas while being slightly floated by the temperature-adjusted gas ejected from the substrate support pad 11 on the upstream side of the exposure region 27. Therefore, the temperature of the substrate W can be accurately adjusted by heat transfer with the gas, and the temperature of the substrate W is also adjusted by the gas ejected from the substrate support pad 11 on the downstream side of the exposure region 27. The temperature difference does not occur between the upstream side and the downstream side of the exposure area 27, the temperature unevenness is eliminated in the entire exposure area 27, and the entire exposure area 27 can be uniformly exposed.
Further, since the substrate W is moved to the exposure region 27 while being adjusted in temperature and exposed immediately, the temperature adjustment and exposure of the substrate W can be performed continuously in one apparatus in one process, and the exposure of the substrate W is performed. Can be efficiently performed, the configuration of the exposure apparatus 1 is simplified, and the required installation space can be reduced.

そして、前記露光装置１において、前記基板支持パッド１１が、上面２２ｂを平らに形成した突起からなる単位パッド２２を、前記基板Ｗの搬送方向（Ｙ軸方向ｙ）とそれに直角な方向（Ｘ軸方向ｘ）に間隔をあけて複数固備えており、気体供給装置３４に連絡された気体噴出孔３０が、前記単位パッド２２の上面２２ｂに開口して設けられると共に、気体吸引装置３９に連絡させた気体吸引孔２９が、基板Ｗの搬送方向における少なくとも一対の単位パッド２２，２２間に形成された凹部２２ａに開口して設けられた構成とされる場合には、前記気体供給装置３４と気体吸引装置３９の動作を制御して基板支持パッド１１の気体噴出孔３０からの気体の噴出圧と気体吸引孔からの排気圧を調節することにより、基板支持パッド１１からの基板Ｗの浮上量を正確に調整することができ、露光領域２７において基板Ｗの基板支持パッド１１による無接触状態での支持を高精度に行うことができる。   In the exposure apparatus 1, the substrate support pad 11 includes a unit pad 22 formed of a protrusion having a flat upper surface 22 b, and a direction perpendicular to the transport direction (Y-axis direction y) of the substrate W (X-axis). A plurality of gas ejection holes 30 are provided at intervals in the direction x) and communicated with the gas supply device 34 so as to open to the upper surface 22b of the unit pad 22 and communicate with the gas suction device 39. In the case where the gas suction hole 29 is configured to be open and provided in the recess 22a formed between at least the pair of unit pads 22 and 22 in the transport direction of the substrate W, the gas supply device 34 and the gas By controlling the operation of the suction device 39 and adjusting the gas ejection pressure from the gas ejection holes 30 and the exhaust pressure from the gas suction holes of the substrate support pad 11, the base from the substrate support pad 11 is controlled. W flying height can be adjusted accurately, it is possible to provide support in a non-contact state by the substrate support pads 11 of the substrate W with high accuracy in the exposure area 27.

また、前記露光装置１において、前記基板支持パッド１１の単位パッド２２に設けた温度センサー４２によって検出される温度にもとづいて、前記気体供給装置３４から前記気体噴出孔３０に供給される気体の温度を調整する制御部４３が設けられた構成とした場合には、気体噴出孔３０から噴出する気体に接触して気体と等しい温度になっている前記単位パッド２２の温度を検出することにより、基板Ｗに噴出される気体の温度を容易に検出することができるので、該気体の温度調整を的確に行うことができる。   In the exposure apparatus 1, the temperature of the gas supplied from the gas supply device 34 to the gas ejection hole 30 based on the temperature detected by the temperature sensor 42 provided on the unit pad 22 of the substrate support pad 11. When the control unit 43 for adjusting the temperature is provided, the substrate pad 22 is detected by detecting the temperature of the unit pad 22 which is in contact with the gas ejected from the gas ejection hole 30 and has a temperature equal to the gas. Since the temperature of the gas ejected to W can be easily detected, the temperature of the gas can be adjusted accurately.

なお、前記実施の形態に係る露光装置１においては、露光ヘッド１６Ａ，１６Ｂ，１６Ｃのマスク２１の露光パターンを投影レンズ１９によって基板Ｗ上に投影して露光する投影露光方式の露光装置に適用した例を示したが、本発明はこれに限らず、結像レンズを通した露光光をマスクの露光パターンを通して基板Ｗに転写するプロキシ露光方式の露光装置に適用してもよく、ＤＭＤ（デジタル・マイクロミラー・デバイス）露光装置に適用することもできる。   In the exposure apparatus 1 according to the embodiment, the exposure pattern of the mask 21 of the exposure heads 16A, 16B, and 16C is applied to a projection exposure type exposure apparatus that projects and exposes the exposure pattern on the substrate W by the projection lens 19. Although an example is shown, the present invention is not limited thereto, and may be applied to a proxy exposure type exposure apparatus that transfers exposure light passing through an imaging lens to a substrate W through an exposure pattern of a mask. It can also be applied to a micromirror device) exposure apparatus.

本発明の一実施の形態に係る露光装置を示す平面図である。It is a top view which shows the exposure apparatus which concerns on one embodiment of this invention. 図１のイ−イ断面図である。FIG. 2 is a cross-sectional view taken along the line II in FIG. 1. 本発明に一実施の形態に係る露光装置の正面図である。1 is a front view of an exposure apparatus according to an embodiment of the present invention. 同じく露光装置における基板搬送手段を示す正面図である。It is a front view which similarly shows the board | substrate conveyance means in exposure apparatus. 同じく露光装置における露光部を示す拡大平面図である。It is an enlarged plan view which similarly shows the exposure part in exposure apparatus. 同じく露光装置における露光部を示す拡大側面図である。It is an enlarged side view which similarly shows the exposure part in exposure apparatus. 同じく露光装置の基板温度制御部を示す系統図である。It is a systematic diagram which similarly shows the substrate temperature control part of exposure apparatus.

符号の説明Explanation of symbols

１ 露光装置
２ 基台
３ 支柱
６ 支持台
９ 移動台
１０ テーブル
１１ 基板支持パッド
１２ 搬送台
１３ 基板把持部
１６Ａ，１６Ｂ，１６Ｃ 露光ヘッド
１９ 投影レンズ
２０ 露光光学系
２１ マスク
２２ 単位パッド（パッド部）
２７ 露光領域
２８，２８ａ，２８ｂ，２８ｃ 露光部
２９ 気体吸引孔
３０ 気体噴出孔
３２ 基板温度制御装置
３４ 気体供給装置
３５ 気体冷却装置
３６ 気体流量調節弁
３７，４０，４２ 温度センサー
３９ 気体吸引装置
４３ 制御部
Ｗ 基板
DESCRIPTION OF SYMBOLS 1 Exposure apparatus 2 Base 3 Support | pillar 6 Support stand 9 Moving stand 10 Table 11 Substrate support pad 12 Transport stand 13 Substrate gripping part 16A, 16B, 16C Exposure head 19 Projection lens 20 Exposure optical system 21 Mask 22 Unit pad (pad part)
27 Exposure region 28, 28a, 28b, 28c Exposure unit 29 Gas suction hole 30 Gas ejection hole 32 Substrate temperature control device 34 Gas supply device 35 Gas cooling device 36 Gas flow control valve 37, 40, 42 Temperature sensor 39 Gas suction device 43 Control unit W substrate

Claims (2)

基板搬送手段によって露光領域に搬送される基板に対して、前記露光領域において露光光源からの露光光を露光光学系を通して照射し、前記基板上に所要の露光パターンを形成する露光装置であって、
前記基板の搬送方向における前記露光領域の上流側と下流側の位置に、前記基板の下側へ温度調整された気体を噴出させて基板を浮上させた状態で支持する基板支持パッドが配置されており、
前記基板支持パッドは、上面を平らに形成した突起からなるパッド部を、前記基板の搬送方向とそれに直角な方向に間隔をあけて複数個備えており、気体供給装置に連絡された気体噴出孔が、前記パッド部の上面に開口して設けられると共に、気体吸引装置に連絡させた気体吸引孔が、基板の搬送方向における少なくとも一対のパッド部間に形成された凹部に開口して設けられ、
前記基板の搬送方向における前記露光領域の上流側と下流側に近接して前記気体噴出孔が設けられ、
気体の温度調整を行う温度制御装置は、前記基板支持パッドの上流側のみに配設されていることを特徴とする露光装置。 An exposure apparatus that irradiates exposure light from an exposure light source through an exposure optical system in the exposure region to a substrate transported to an exposure region by a substrate transport unit, and forms a required exposure pattern on the substrate,
Substrate support pads are disposed at positions upstream and downstream of the exposure region in the substrate transport direction to support the substrate in a state where the temperature-adjusted gas is jetted to the lower side of the substrate to float the substrate. And
The substrate support pad is provided with a plurality of pad portions made of protrusions having a flat upper surface, spaced apart in the direction perpendicular to the transport direction of the substrate, and a gas ejection hole connected to a gas supply device Is provided with an opening on the upper surface of the pad portion, and a gas suction hole communicated with the gas suction device is provided with an opening in a recess formed between at least a pair of pad portions in the substrate transport direction ,
The gas ejection holes are provided close to the upstream side and the downstream side of the exposure region in the transport direction of the substrate,
An exposure apparatus characterized in that a temperature control device for adjusting the temperature of the gas is disposed only upstream of the substrate support pad . 前記温度制御装置は、前記基板支持パッドに設けた温度センサーによって検出される温度にもとづいて、前記気体供給装置から前記気体噴出孔に供給される気体の温度を調整することを特徴とする請求項１に記載の露光装置。 Claim wherein the temperature control device, which on the basis of the temperature detected by the temperature sensor provided in the substrate support pads, and adjusting the temperature of the gas supplied to the gas ejection hole from the gas supply device 2. The exposure apparatus according to 1.
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