JP4912447B2 - 合金型温度ヒューズ - Google Patents
合金型温度ヒューズ Download PDFInfo
- Publication number
- JP4912447B2 JP4912447B2 JP2009230914A JP2009230914A JP4912447B2 JP 4912447 B2 JP4912447 B2 JP 4912447B2 JP 2009230914 A JP2009230914 A JP 2009230914A JP 2009230914 A JP2009230914 A JP 2009230914A JP 4912447 B2 JP4912447 B2 JP 4912447B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- melting point
- lead conductor
- point alloy
- thermal fuse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910045601 alloy Inorganic materials 0.000 title claims description 115
- 239000000956 alloy Substances 0.000 title claims description 115
- 239000004020 conductor Substances 0.000 claims description 81
- 238000002844 melting Methods 0.000 claims description 61
- 230000008018 melting Effects 0.000 claims description 58
- 230000004907 flux Effects 0.000 claims description 27
- 239000000853 adhesive Substances 0.000 claims description 23
- 230000001070 adhesive effect Effects 0.000 claims description 23
- 239000010410 layer Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 23
- 238000003892 spreading Methods 0.000 claims description 20
- 238000009736 wetting Methods 0.000 claims description 19
- 230000007480 spreading Effects 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 230000002265 prevention Effects 0.000 claims description 10
- 229910052797 bismuth Inorganic materials 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 7
- 238000007711 solidification Methods 0.000 claims description 6
- 230000008023 solidification Effects 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000000155 melt Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 229910052737 gold Inorganic materials 0.000 description 9
- 229910052763 palladium Inorganic materials 0.000 description 9
- 229910052697 platinum Inorganic materials 0.000 description 9
- 229910052733 gallium Inorganic materials 0.000 description 8
- 229910052732 germanium Inorganic materials 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 229910052698 phosphorus Inorganic materials 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 229910052787 antimony Inorganic materials 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910016338 Bi—Sn Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020935 Sn-Sb Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910008757 Sn—Sb Inorganic materials 0.000 description 1
- 206010057040 Temperature intolerance Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000008543 heat sensitivity Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
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- Fuses (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009230914A JP4912447B2 (ja) | 2009-10-02 | 2009-10-02 | 合金型温度ヒューズ |
| CN201010295771.XA CN102034645B (zh) | 2009-10-02 | 2010-09-29 | 合金型温度熔断器及低熔点合金片的制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009230914A JP4912447B2 (ja) | 2009-10-02 | 2009-10-02 | 合金型温度ヒューズ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011081924A JP2011081924A (ja) | 2011-04-21 |
| JP2011081924A5 JP2011081924A5 (enExample) | 2011-07-21 |
| JP4912447B2 true JP4912447B2 (ja) | 2012-04-11 |
Family
ID=43887380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009230914A Expired - Fee Related JP4912447B2 (ja) | 2009-10-02 | 2009-10-02 | 合金型温度ヒューズ |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4912447B2 (enExample) |
| CN (1) | CN102034645B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5939311B2 (ja) * | 2013-01-11 | 2016-06-22 | 株式会社村田製作所 | ヒューズ |
| JP6739922B2 (ja) * | 2015-10-27 | 2020-08-12 | デクセリアルズ株式会社 | ヒューズ素子 |
| CN110323402A (zh) * | 2019-06-17 | 2019-10-11 | 东莞新能源科技有限公司 | 电池组件及电化学装置 |
| CN115537624B (zh) * | 2022-09-30 | 2023-11-21 | 中国航发北京航空材料研究院 | 一种柔性体精密成形用材料、配套模具及制备方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0795419B2 (ja) * | 1989-02-27 | 1995-10-11 | 内橋エステック株式会社 | 薄形ヒューズ |
| JP3152985B2 (ja) * | 1992-02-14 | 2001-04-03 | 内橋エステック株式会社 | 基板型温度ヒュ−ズの製造方法 |
| JPH06342620A (ja) * | 1993-06-01 | 1994-12-13 | Uchihashi Estec Co Ltd | 温度ヒュ−ズ |
| JPH0795419A (ja) * | 1993-09-24 | 1995-04-07 | Toshiba Corp | 画像記録装置 |
| JP4108184B2 (ja) * | 1998-06-11 | 2008-06-25 | 内橋エステック株式会社 | 薄型温度ヒュ−ズの製造方法 |
| JP4190618B2 (ja) * | 1998-07-15 | 2008-12-03 | 内橋エステック株式会社 | 基板型温度ヒュ−ズの製造方法 |
| JP3812865B2 (ja) * | 1998-09-21 | 2006-08-23 | 矢崎総業株式会社 | 電気回路の安全装置 |
| JP4064217B2 (ja) * | 2002-11-26 | 2008-03-19 | 内橋エステック株式会社 | 合金型温度ヒューズ及び温度ヒューズエレメント用材料 |
| JP4230313B2 (ja) * | 2003-08-27 | 2009-02-25 | 内橋エステック株式会社 | 筒状ケースタイプ合金型温度ヒューズ |
| JP2007294117A (ja) * | 2006-04-21 | 2007-11-08 | Uchihashi Estec Co Ltd | 保護素子及び保護素子の動作方法 |
-
2009
- 2009-10-02 JP JP2009230914A patent/JP4912447B2/ja not_active Expired - Fee Related
-
2010
- 2010-09-29 CN CN201010295771.XA patent/CN102034645B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN102034645B (zh) | 2015-02-11 |
| JP2011081924A (ja) | 2011-04-21 |
| CN102034645A (zh) | 2011-04-27 |
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