JP4901154B2 - 半導体装置の検査方法および検査装置ならびに半導体装置の製造方法 - Google Patents

半導体装置の検査方法および検査装置ならびに半導体装置の製造方法 Download PDF

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Publication number
JP4901154B2
JP4901154B2 JP2005227878A JP2005227878A JP4901154B2 JP 4901154 B2 JP4901154 B2 JP 4901154B2 JP 2005227878 A JP2005227878 A JP 2005227878A JP 2005227878 A JP2005227878 A JP 2005227878A JP 4901154 B2 JP4901154 B2 JP 4901154B2
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Prior art keywords
probe
electron beam
wiring
current
scanning
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Expired - Fee Related
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JP2005227878A
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Japanese (ja)
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JP2005347773A5 (https=
JP2005347773A (ja
Inventor
真理 野副
博之 品田
敏幸 真島
朗 嶋瀬
克郎 水越
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Renesas Electronics Corp
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Renesas Electronics Corp
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  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2005227878A 2005-08-05 2005-08-05 半導体装置の検査方法および検査装置ならびに半導体装置の製造方法 Expired - Fee Related JP4901154B2 (ja)

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JP2005227878A JP4901154B2 (ja) 2005-08-05 2005-08-05 半導体装置の検査方法および検査装置ならびに半導体装置の製造方法

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JP2005227878A JP4901154B2 (ja) 2005-08-05 2005-08-05 半導体装置の検査方法および検査装置ならびに半導体装置の製造方法

Related Parent Applications (1)

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JP2001174988A Division JP3955445B2 (ja) 2001-06-11 2001-06-11 半導体装置の検査方法及び試料検査装置

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JP2005347773A JP2005347773A (ja) 2005-12-15
JP2005347773A5 JP2005347773A5 (https=) 2008-07-24
JP4901154B2 true JP4901154B2 (ja) 2012-03-21

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JP2005227878A Expired - Fee Related JP4901154B2 (ja) 2005-08-05 2005-08-05 半導体装置の検査方法および検査装置ならびに半導体装置の製造方法

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100741858B1 (ko) 2006-05-18 2007-07-24 삼성전자주식회사 반도체 회로의 결함 검사용 모니터링 패턴 및 이를 이용한결함 검사 방법.
JP5276921B2 (ja) * 2008-08-08 2013-08-28 株式会社日立ハイテクノロジーズ 検査装置
JP5908418B2 (ja) 2013-01-31 2016-04-26 株式会社東芝 半導体装置の検査回路、検査方法及び検査装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01223709A (ja) * 1988-03-02 1989-09-06 Tdk Corp コイル
JPH02195271A (ja) * 1989-01-25 1990-08-01 Hitachi Ltd 電圧波形計測システム
JPH0567654A (ja) * 1991-09-09 1993-03-19 Fujitsu Ltd 半導体試験装置及び半導体集積回路装置の試験方法
JPH0572234A (ja) * 1991-09-12 1993-03-23 Mitsubishi Electric Corp 半導体装置の配線評価方法
US5404110A (en) * 1993-03-25 1995-04-04 International Business Machines Corporation System using induced current for contactless testing of wiring networks
JP2861849B2 (ja) * 1994-08-31 1999-02-24 日本電気株式会社 半導体集積回路チップ上の配線試験方法及びその装置
JPH09223726A (ja) * 1996-02-14 1997-08-26 Hitachi Ltd 荷電粒子ビームによる断面解析システムおよびその方法並びに荷電粒子ビーム処理装置
JP3577839B2 (ja) * 1996-06-04 2004-10-20 株式会社日立製作所 不良検査方法および装置
JPH1187451A (ja) * 1997-09-08 1999-03-30 Mitsubishi Electric Corp 半導体装置の検査方法および半導体装置検査器
JP3652144B2 (ja) * 1998-11-17 2005-05-25 株式会社日立製作所 プローブ装置
JP3708763B2 (ja) * 1999-08-31 2005-10-19 株式会社東芝 欠陥検出方法

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