JP4897604B2 - フォトマスク製造用のエッチング液 - Google Patents

フォトマスク製造用のエッチング液 Download PDF

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Publication number
JP4897604B2
JP4897604B2 JP2007195594A JP2007195594A JP4897604B2 JP 4897604 B2 JP4897604 B2 JP 4897604B2 JP 2007195594 A JP2007195594 A JP 2007195594A JP 2007195594 A JP2007195594 A JP 2007195594A JP 4897604 B2 JP4897604 B2 JP 4897604B2
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Prior art keywords
etching
etching solution
photomask
chromium
component
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JP2007195594A
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Japanese (ja)
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JP2009032914A5 (https=
JP2009032914A (ja
Inventor
利夫 小松
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DNP Fine Chemicals Co Ltd
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DNP Fine Chemicals Co Ltd
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Priority to JP2007195594A priority Critical patent/JP4897604B2/ja
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Publication of JP2009032914A5 publication Critical patent/JP2009032914A5/ja
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  • Weting (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • ing And Chemical Polishing (AREA)
JP2007195594A 2007-07-27 2007-07-27 フォトマスク製造用のエッチング液 Active JP4897604B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007195594A JP4897604B2 (ja) 2007-07-27 2007-07-27 フォトマスク製造用のエッチング液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007195594A JP4897604B2 (ja) 2007-07-27 2007-07-27 フォトマスク製造用のエッチング液

Publications (3)

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JP2009032914A JP2009032914A (ja) 2009-02-12
JP2009032914A5 JP2009032914A5 (https=) 2009-07-16
JP4897604B2 true JP4897604B2 (ja) 2012-03-14

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Family Applications (1)

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JP2007195594A Active JP4897604B2 (ja) 2007-07-27 2007-07-27 フォトマスク製造用のエッチング液

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4940102B2 (ja) * 2007-10-25 2012-05-30 株式会社 マイクロプロセス エッチング剤組成物及びそれを用いた半導体装置の製造方法
JP5293114B2 (ja) * 2008-11-26 2013-09-18 三菱電機株式会社 半導体装置の製造方法
JP5442987B2 (ja) * 2008-12-10 2014-03-19 株式会社Ｄｎｐファインケミカル エッチング液およびブラックマトリックスの製造方法
JP5678464B2 (ja) * 2009-07-14 2015-03-04 株式会社リコー インクジェット記録用インク、インクカートリッジ、インクジェット記録装置
JP2011108975A (ja) * 2009-11-20 2011-06-02 Dnp Fine Chemicals Co Ltd 導電膜用エッチング液および導電膜のエッチング方法
JP2011198901A (ja) * 2010-03-18 2011-10-06 Dnp Fine Chemicals Co Ltd 導電膜用エッチング液および導電膜のエッチング方法
JP5872213B2 (ja) * 2011-09-08 2016-03-01 公益財団法人神奈川科学技術アカデミー 拡面処理された箔の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02285081A (ja) * 1989-04-25 1990-11-22 Sanyo Chem Ind Ltd エッチング液
JPH05271967A (ja) * 1992-03-24 1993-10-19 The Ink Tec Kk エッチング液組成物およびクロム材薄膜のエッチング方法
US6555510B2 (en) * 2001-05-10 2003-04-29 3M Innovative Properties Company Bis(perfluoroalkanesulfonyl)imides and their salts as surfactants/additives for applications having extreme environments and methods therefor
JP4005437B2 (ja) * 2002-07-26 2007-11-07 ザ・インクテック株式会社 ニッケル系薄膜用エッチング液
US6884338B2 (en) * 2002-12-16 2005-04-26 3M Innovative Properties Company Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor

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Publication number Publication date
JP2009032914A (ja) 2009-02-12

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