JP4896247B2 - プリント基板の製造方法及びこれを用いたプリント基板 - Google Patents
プリント基板の製造方法及びこれを用いたプリント基板 Download PDFInfo
- Publication number
- JP4896247B2 JP4896247B2 JP2010099519A JP2010099519A JP4896247B2 JP 4896247 B2 JP4896247 B2 JP 4896247B2 JP 2010099519 A JP2010099519 A JP 2010099519A JP 2010099519 A JP2010099519 A JP 2010099519A JP 4896247 B2 JP4896247 B2 JP 4896247B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- pattern
- mask layer
- printed circuit
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
請求項3の発明では、請求項1の発明において、前記マスク層は、前記積層時に前記導電回路板の一部としてそのまま残っていることを特徴としている。
また、請求項4の発明では、請求項1に記載のプリント基板の製造方法で製造されたプリント基板を提供する。
請求項4の発明によれば、上記効果を有するプリント基板を得ることができる。
2 金属層
3 レジスト層
4 マスク層
5 露出域
6 パターンめっき
7 柄部
8 傘部
8a アウトグロース
9 導電回路板
10 絶縁基材
11 パターン
12 プリント基板
13 基板中間体
14 露出面
Claims (4)
- 支持板上に金属層を形成し、
該金属層上にレジスト層を形成し、
導電パターンとなるべき溝を露出域として該露出域の前記レジスト層が除去されたマスク層を形成し、
前記露出域にめっき処理を施してパターンめっきを形成するに際し、前記溝の横断面でみて前記マスク層高さまでめっきされた柄部と、前記マスク層高さよりも高く盛り上げてめっきされ、一部が前記マスク層の表面にはみ出したアウトグロースを有する傘部とを含むパターンめっきを形成し、
前記支持板、前記金属層及び前記パターンめっきの三者からなる導電回路板に前記絶縁基材を積層して前記パターンめっきが前記絶縁基材に埋設された基板中間体を形成し、
前記基板中間体から前記支持板及び前記金属層を除去して前記導電パターン及び前記絶縁基材が露出する露出面を形成し、
前記露出面を前記パターンめっきの前記柄部が除去されるまで機械的に研磨し、前記露出面上での前記導電パターンの線幅を前記溝幅よりも増大させることを特徴とするプリント基板の製造方法。 - 前記マスク層は、前記めっき処理の後に除去されることを特徴とする請求項1に記載のプリント基板の製造方法。
- 前記マスク層は、前記積層時に前記導電回路体の一部としてそのまま残っていることを特徴とする請求項1に記載のプリント基板の製造方法。
- 請求項1に記載のプリント基板の製造方法で製造されたプリント基板。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010099519A JP4896247B2 (ja) | 2010-04-23 | 2010-04-23 | プリント基板の製造方法及びこれを用いたプリント基板 |
EP11771803.1A EP2563105B1 (en) | 2010-04-23 | 2011-03-02 | Printed substrate manufacturing method and printed substrate employing same |
CN201180020204.6A CN102870510B (zh) | 2010-04-23 | 2011-03-02 | 印刷基板的制造方法 |
PCT/JP2011/054724 WO2011132463A1 (ja) | 2010-04-23 | 2011-03-02 | プリント基板の製造方法及びこれを用いたプリント基板 |
US13/642,471 US9185811B2 (en) | 2010-04-23 | 2011-03-02 | Method of producing printed circuit board, and printed board produced by the method |
KR1020127026339A KR101352819B1 (ko) | 2010-04-23 | 2011-03-02 | 프린트 기판의 제조 방법 및 이것을 이용한 프린트 기판 |
TW100109347A TWI422297B (zh) | 2010-04-23 | 2011-03-18 | A printed circuit board manufacturing method and use of the printed circuit board has this |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010099519A JP4896247B2 (ja) | 2010-04-23 | 2010-04-23 | プリント基板の製造方法及びこれを用いたプリント基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011228605A JP2011228605A (ja) | 2011-11-10 |
JP4896247B2 true JP4896247B2 (ja) | 2012-03-14 |
Family
ID=44834002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010099519A Expired - Fee Related JP4896247B2 (ja) | 2010-04-23 | 2010-04-23 | プリント基板の製造方法及びこれを用いたプリント基板 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9185811B2 (ja) |
EP (1) | EP2563105B1 (ja) |
JP (1) | JP4896247B2 (ja) |
KR (1) | KR101352819B1 (ja) |
CN (1) | CN102870510B (ja) |
TW (1) | TWI422297B (ja) |
WO (1) | WO2011132463A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4896247B2 (ja) * | 2010-04-23 | 2012-03-14 | 株式会社メイコー | プリント基板の製造方法及びこれを用いたプリント基板 |
WO2014119178A1 (ja) * | 2013-01-30 | 2014-08-07 | 京セラ株式会社 | 実装構造体の製造方法 |
TWI517775B (zh) * | 2014-03-06 | 2016-01-11 | 相互股份有限公司 | 印刷電路板及其製法 |
TWI566309B (zh) * | 2016-01-08 | 2017-01-11 | 恆勁科技股份有限公司 | 封裝基板之製作方法 |
CN108401361B (zh) * | 2017-02-04 | 2020-08-07 | 欣兴电子股份有限公司 | 电路板与其制作方法 |
US10512165B2 (en) | 2017-03-23 | 2019-12-17 | Unimicron Technology Corp. | Method for manufacturing a circuit board |
CN108958876B (zh) * | 2018-07-23 | 2022-02-01 | 郑州云海信息技术有限公司 | 浏览器页面的显示方法和装置 |
CN112165773B (zh) * | 2020-10-07 | 2022-10-11 | 广州添利电子科技有限公司 | 一种埋线路的方式制作图形的工艺 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE633477A (ja) * | 1962-06-11 | |||
JPS60147192A (ja) * | 1984-01-11 | 1985-08-03 | 株式会社日立製作所 | プリント配線板の製造方法 |
US5197184A (en) * | 1990-09-11 | 1993-03-30 | Hughes Aircraft Company | Method of forming three-dimensional circuitry |
JPH0537157A (ja) | 1991-07-31 | 1993-02-12 | Sony Corp | 多層プリント基板の製造方法 |
EP0545328B1 (en) * | 1991-11-29 | 1997-03-19 | Hitachi Chemical Co., Ltd. | Printed circuit board manufacturing process |
JPH05217755A (ja) | 1992-02-05 | 1993-08-27 | Tokai Rubber Ind Ltd | パターンめっき成形品の製造方法 |
JP3361556B2 (ja) * | 1992-09-25 | 2003-01-07 | 日本メクトロン株式会社 | 回路配線パタ−ンの形成法 |
US5358604A (en) * | 1992-09-29 | 1994-10-25 | Microelectronics And Computer Technology Corp. | Method for producing conductive patterns |
JPH08181415A (ja) * | 1994-12-27 | 1996-07-12 | Tokai Rubber Ind Ltd | 窓開き回路基板の製法 |
US6143116A (en) * | 1996-09-26 | 2000-11-07 | Kyocera Corporation | Process for producing a multi-layer wiring board |
US6871396B2 (en) * | 2000-02-09 | 2005-03-29 | Matsushita Electric Industrial Co., Ltd. | Transfer material for wiring substrate |
US6692816B2 (en) * | 2001-11-28 | 2004-02-17 | 3M Innovative Properties Company | Abrasion resistant electrode and device |
EP1542519A4 (en) * | 2002-07-31 | 2010-01-06 | Sony Corp | METHOD FOR PCB CONSTRUCTION WITH AN INTEGRATED EQUIPMENT AND PCB WITH INTEGRATED EQUIPMENT AND METHOD FOR PRODUCING A PRINTED PCB AND PRINTED PCB |
US6898850B2 (en) | 2002-08-06 | 2005-05-31 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing circuit board and communication appliance |
KR100607626B1 (ko) * | 2004-05-25 | 2006-08-01 | 대덕전자 주식회사 | 인쇄 회로 기판에 있어서 레진 도포된 동박을 이용한 평탄코팅 공법 |
JP2006339365A (ja) * | 2005-06-01 | 2006-12-14 | Mitsui Mining & Smelting Co Ltd | 配線基板およびその製造方法、多層積層配線基板の製造方法並びにビアホールの形成方法 |
JP2007250925A (ja) * | 2006-03-17 | 2007-09-27 | Ricoh Co Ltd | 配線構造体及びその製造方法 |
JP2008098563A (ja) * | 2006-10-16 | 2008-04-24 | Seiko Epson Corp | 素子基板およびその製造方法 |
JP4697156B2 (ja) * | 2007-02-28 | 2011-06-08 | トヨタ自動車株式会社 | 回路基板の製造方法 |
US8033014B2 (en) * | 2008-07-07 | 2011-10-11 | Unimicron Technology Corp. | Method of making a molded interconnect device |
JP4896247B2 (ja) * | 2010-04-23 | 2012-03-14 | 株式会社メイコー | プリント基板の製造方法及びこれを用いたプリント基板 |
-
2010
- 2010-04-23 JP JP2010099519A patent/JP4896247B2/ja not_active Expired - Fee Related
-
2011
- 2011-03-02 CN CN201180020204.6A patent/CN102870510B/zh not_active Expired - Fee Related
- 2011-03-02 EP EP11771803.1A patent/EP2563105B1/en not_active Not-in-force
- 2011-03-02 WO PCT/JP2011/054724 patent/WO2011132463A1/ja active Application Filing
- 2011-03-02 KR KR1020127026339A patent/KR101352819B1/ko not_active IP Right Cessation
- 2011-03-02 US US13/642,471 patent/US9185811B2/en not_active Expired - Fee Related
- 2011-03-18 TW TW100109347A patent/TWI422297B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI422297B (zh) | 2014-01-01 |
CN102870510A (zh) | 2013-01-09 |
EP2563105A1 (en) | 2013-02-27 |
WO2011132463A1 (ja) | 2011-10-27 |
EP2563105A4 (en) | 2015-01-28 |
KR101352819B1 (ko) | 2014-01-16 |
CN102870510B (zh) | 2014-01-01 |
JP2011228605A (ja) | 2011-11-10 |
US9185811B2 (en) | 2015-11-10 |
EP2563105B1 (en) | 2016-07-20 |
TW201212754A (en) | 2012-03-16 |
KR20130064044A (ko) | 2013-06-17 |
US20130043063A1 (en) | 2013-02-21 |
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