JP4889326B2 - 処理装置および蓋体の開閉機構 - Google Patents

処理装置および蓋体の開閉機構 Download PDF

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Publication number
JP4889326B2
JP4889326B2 JP2006067733A JP2006067733A JP4889326B2 JP 4889326 B2 JP4889326 B2 JP 4889326B2 JP 2006067733 A JP2006067733 A JP 2006067733A JP 2006067733 A JP2006067733 A JP 2006067733A JP 4889326 B2 JP4889326 B2 JP 4889326B2
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JP
Japan
Prior art keywords
lid
adjustment
processing
processing container
shaft
Prior art date
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Expired - Fee Related
Application number
JP2006067733A
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English (en)
Japanese (ja)
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JP2007250568A (ja
JP2007250568A5 (https=
Inventor
潤 山下
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Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2006067733A priority Critical patent/JP4889326B2/ja
Priority to US11/684,717 priority patent/US7707965B2/en
Priority to KR1020070023916A priority patent/KR100886030B1/ko
Publication of JP2007250568A publication Critical patent/JP2007250568A/ja
Publication of JP2007250568A5 publication Critical patent/JP2007250568A5/ja
Application granted granted Critical
Publication of JP4889326B2 publication Critical patent/JP4889326B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
JP2006067733A 2006-03-13 2006-03-13 処理装置および蓋体の開閉機構 Expired - Fee Related JP4889326B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006067733A JP4889326B2 (ja) 2006-03-13 2006-03-13 処理装置および蓋体の開閉機構
US11/684,717 US7707965B2 (en) 2006-03-13 2007-03-12 Processing apparatus and lid opening/closing mechanism
KR1020070023916A KR100886030B1 (ko) 2006-03-13 2007-03-12 처리 장치 및 덮개의 개폐 기구

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006067733A JP4889326B2 (ja) 2006-03-13 2006-03-13 処理装置および蓋体の開閉機構

Publications (3)

Publication Number Publication Date
JP2007250568A JP2007250568A (ja) 2007-09-27
JP2007250568A5 JP2007250568A5 (https=) 2009-02-12
JP4889326B2 true JP4889326B2 (ja) 2012-03-07

Family

ID=38575880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006067733A Expired - Fee Related JP4889326B2 (ja) 2006-03-13 2006-03-13 処理装置および蓋体の開閉機構

Country Status (3)

Country Link
US (1) US7707965B2 (https=)
JP (1) JP4889326B2 (https=)
KR (1) KR100886030B1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5196474B2 (ja) * 2008-01-29 2013-05-15 サムコ株式会社 薄膜製造装置
CN101946121B (zh) * 2008-02-18 2013-03-06 夏普株式会社 底座组件、照明装置、显示装置和电视接收装置
JP5357486B2 (ja) 2008-09-30 2013-12-04 東京エレクトロン株式会社 プラズマ処理装置
CN102414794B (zh) * 2009-04-21 2015-01-28 应用材料公司 改良膜厚度不均匀性与粒子表现的cvd设备
KR101066033B1 (ko) * 2009-07-28 2011-09-20 엘아이지에이디피 주식회사 화학기상 증착장치 및 기판 처리장치
KR101136728B1 (ko) * 2010-10-18 2012-04-20 주성엔지니어링(주) 기판처리장치와 그의 분해 및 조립방법
US8826857B2 (en) * 2011-11-21 2014-09-09 Lam Research Corporation Plasma processing assemblies including hinge assemblies
WO2019033878A1 (zh) * 2017-08-17 2019-02-21 北京北方华创微电子装备有限公司 内衬、反应腔室及半导体加工设备
JP7360305B2 (ja) * 2019-11-13 2023-10-12 株式会社日立ハイテク 真空処理装置
JP7350907B2 (ja) * 2022-01-24 2023-09-26 株式会社Ｓｃｒｅｅｎホールディングス 処理チャンバおよび基板処理装置
KR102747906B1 (ko) * 2022-12-22 2024-12-31 주식회사 에스에프에이 Oled 증착용 대형 마스크와 캐리어의 탈부착장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0369757A (ja) * 1989-08-07 1991-03-26 Mitsuo Kumabe アンテナ取付部付屋根裏換気装置
JP2970891B2 (ja) * 1992-08-08 1999-11-02 東京エレクトロン株式会社 プラズマ装置の真空チャンバー
TW295677B (https=) * 1994-08-19 1997-01-11 Tokyo Electron Co Ltd
JPH11101345A (ja) 1997-09-30 1999-04-13 Tokyo Electron Ltd 真空処理装置の開閉蓋ヒンジ機構
JPH11354457A (ja) * 1998-06-08 1999-12-24 Kokusai Electric Co Ltd 半導体基板処理装置
US6558506B1 (en) * 1999-02-01 2003-05-06 Tokyo Electron Limited Etching system and etching chamber
JP2004055614A (ja) * 2002-07-16 2004-02-19 Tokyo Electron Ltd プラズマ処理装置
JP2004293649A (ja) * 2003-03-26 2004-10-21 Ts Corporation 蓋の開閉装置
KR100544490B1 (ko) * 2003-11-11 2006-01-23 주식회사 디엠에스 기판의 진공처리장치
JP4550554B2 (ja) * 2004-11-11 2010-09-22 株式会社日立ハイテクノロジーズ 試料処理装置

Also Published As

Publication number Publication date
KR20070093350A (ko) 2007-09-18
JP2007250568A (ja) 2007-09-27
US20070238307A1 (en) 2007-10-11
US7707965B2 (en) 2010-05-04
KR100886030B1 (ko) 2009-02-26

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