JP4886112B2 - 面型光素子と光ファイバを有する装置 - Google Patents

面型光素子と光ファイバを有する装置 Download PDF

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Publication number
JP4886112B2
JP4886112B2 JP2001012593A JP2001012593A JP4886112B2 JP 4886112 B2 JP4886112 B2 JP 4886112B2 JP 2001012593 A JP2001012593 A JP 2001012593A JP 2001012593 A JP2001012593 A JP 2001012593A JP 4886112 B2 JP4886112 B2 JP 4886112B2
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Japan
Prior art keywords
optical fiber
optical
guide hole
layer
light
Prior art date
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Expired - Fee Related
Application number
JP2001012593A
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English (en)
Japanese (ja)
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JP2002214485A5 (enrdf_load_stackoverflow
JP2002214485A (ja
Inventor
肇 坂田
彩 今田
敏彦 尾内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2001012593A priority Critical patent/JP4886112B2/ja
Priority to US09/903,709 priority patent/US6932516B2/en
Publication of JP2002214485A publication Critical patent/JP2002214485A/ja
Publication of JP2002214485A5 publication Critical patent/JP2002214485A5/ja
Application granted granted Critical
Publication of JP4886112B2 publication Critical patent/JP4886112B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Optical Couplings Of Light Guides (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
JP2001012593A 2000-07-19 2001-01-22 面型光素子と光ファイバを有する装置 Expired - Fee Related JP4886112B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2001012593A JP4886112B2 (ja) 2001-01-22 2001-01-22 面型光素子と光ファイバを有する装置
US09/903,709 US6932516B2 (en) 2000-07-19 2001-07-13 Surface optical device apparatus, method of fabricating the same, and apparatus using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001012593A JP4886112B2 (ja) 2001-01-22 2001-01-22 面型光素子と光ファイバを有する装置

Publications (3)

Publication Number Publication Date
JP2002214485A JP2002214485A (ja) 2002-07-31
JP2002214485A5 JP2002214485A5 (enrdf_load_stackoverflow) 2008-03-06
JP4886112B2 true JP4886112B2 (ja) 2012-02-29

Family

ID=18879581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001012593A Expired - Fee Related JP4886112B2 (ja) 2000-07-19 2001-01-22 面型光素子と光ファイバを有する装置

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JP (1) JP4886112B2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180088110A (ko) * 2017-01-26 2018-08-03 엘지이노텍 주식회사 수직 캐비티 표면 방출 레이저 반도체 소자, 광 전송 모듈 및 광 전송 장치
US11124402B2 (en) * 2016-11-08 2021-09-21 Pepsico, Inc. Ambient filling system and method

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4600733B2 (ja) * 2004-07-12 2010-12-15 ソニー株式会社 半導体レーザ装置およびその製造方法
JP5277959B2 (ja) * 2006-03-29 2013-08-28 株式会社ジェイテクト 光ファイバアレイ及び半導体レーザ集光装置及び光ファイバアレイの製造方法
JP4914638B2 (ja) * 2006-04-28 2012-04-11 オリンパス株式会社 内視鏡、内視鏡装置、内視鏡の組み立て方法、内視鏡装置の組み立て方法
JP2009088405A (ja) * 2007-10-02 2009-04-23 Fuji Xerox Co Ltd 光モジュール
JP5479765B2 (ja) * 2009-03-27 2014-04-23 古河電気工業株式会社 一次元アレイ素子の製造方法および一次元アレイ素子
JP2012032733A (ja) * 2010-08-03 2012-02-16 Tokai Univ 光モジュール及びその製造方法
KR101875519B1 (ko) * 2016-11-25 2018-07-10 주식회사 옵토웰 다채널 송수신 모듈

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594514A (ja) * 1982-06-28 1984-01-11 Matsushita Electric Works Ltd リニヤ−パ−ツフイ−ダ
JPS60156023A (ja) * 1983-12-29 1985-08-16 Omron Tateisi Electronics Co 発光素子と光フアイバとの光結合装置
JPS63226607A (ja) * 1986-10-24 1988-09-21 Hitachi Ltd 光結合構造
EP0562211A1 (en) * 1992-03-25 1993-09-29 International Business Machines Corporation Self-aligning fiber couplers
JPH06237016A (ja) * 1993-02-09 1994-08-23 Matsushita Electric Ind Co Ltd 光ファイバモジュールおよびその製造方法
JP3884155B2 (ja) * 1998-01-29 2007-02-21 古河電気工業株式会社 面型光デバイス、光結合用コネクタ、光ファイバとの光結合方法、光デバイスアレー
US6095697A (en) * 1998-03-31 2000-08-01 Honeywell International Inc. Chip-to-interface alignment
JPH11307869A (ja) * 1998-04-22 1999-11-05 Furukawa Electric Co Ltd:The アレイ光素子モジュール
JP4532688B2 (ja) * 2000-07-19 2010-08-25 キヤノン株式会社 面型光素子を備えた装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11124402B2 (en) * 2016-11-08 2021-09-21 Pepsico, Inc. Ambient filling system and method
KR20180088110A (ko) * 2017-01-26 2018-08-03 엘지이노텍 주식회사 수직 캐비티 표면 방출 레이저 반도체 소자, 광 전송 모듈 및 광 전송 장치
KR102623614B1 (ko) * 2017-01-26 2024-01-11 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 수직 캐비티 표면 방출 레이저 반도체 소자, 광 전송 모듈 및 광 전송 장치

Also Published As

Publication number Publication date
JP2002214485A (ja) 2002-07-31

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