JP4878388B2 - スイッチング電源 - Google Patents
スイッチング電源 Download PDFInfo
- Publication number
- JP4878388B2 JP4878388B2 JP2009529623A JP2009529623A JP4878388B2 JP 4878388 B2 JP4878388 B2 JP 4878388B2 JP 2009529623 A JP2009529623 A JP 2009529623A JP 2009529623 A JP2009529623 A JP 2009529623A JP 4878388 B2 JP4878388 B2 JP 4878388B2
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- switching power
- piezoelectric fan
- transformer
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 claims description 25
- 238000004804 winding Methods 0.000 claims description 23
- 230000005284 excitation Effects 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 13
- 230000007613 environmental effect Effects 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000009423 ventilation Methods 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002918 waste heat Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D33/00—Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/22—Conversion of dc power input into dc power output with intermediate conversion into ac
- H02M3/24—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters
- H02M3/28—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Dc-Dc Converters (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
圧電ファン8をトランス1に固定する別の実施例が図6に示されている。ここでは射出成形部材として構成されたコイル体12aが、図7に示すように設けられている。コイル体12aのフランジには、曲げられた突起が配置されている。この突起は矩形の開口部を、圧電ファン8の収容のために有し、その端部は再度曲げられている。したがってこの端部は、ここに図示しない回路基板1上に支持される。コイル体12aの突起は実質的にトランスからのブリッジを形成する。回路基板にあるこのブリッジ下方の自由空間には冷却すべき別の回路素子を配置することができる。
Claims (9)
- トランス(1)を備え、該トランスは少なくとも1つの一次巻線と少なくとも2つの二次巻線を有し、
前記一次巻線はスイッチ素子(4)を介して直流電圧に接続され、
前記二次巻線は、少なくとも1つのダイオード(2)を有する整流回路を介して負荷に接続されるスイッチング電源の駆動方法において、
前記スイッチング電源内に配置された少なくとも1つの圧電ファン(8)を有し、
該少なくとも1つの圧電ファン(8)は、所定の励振周波数の制御信号によって振動され、
該制御信号としてマイクロコントローラにより正弦波信号が形成される、ことを特徴とする駆動方法。 - 請求項1記載の方法において、
前記少なくとも1つの圧電ファン(8)の電力消費が励振周波数に依存してマイクロコントローラにより検出され、
電力消費が最大のときに、共振周波数が識別される、ことを特徴とする方法。 - 請求項2記載の方法において、
励振周波数をステップごとに変化することによって、環境の影響のために変化した共振周波数を所定の時間間隔で新たに調整し、
スイッチング電源の運転開始時に、最後に調整された共振周波数を励振周波数として設定する、ことを特徴とする方法。 - 請求項2または3記載の方法において、
前記マイクロコントローラに、所定の励振周波数およびこれに所属する公差について少なくとも1つの圧電ファン(8)が損傷せずに自由振動するときに検出された電力値をプログラミングし、
運転中に制御信号の周波数を所定の時間間隔で変化し、変化した共振周波数を識別する、ことを特徴とする方法。 - 請求項1から4までのいずれか一項記載の方法を実施するためのスイッチング電源であって、前記スイッチング電源はトランス(1)と少なくとも1つの圧電ファン(8)を有し、
該圧電ファンは空気流を、前記トランス(1)および/または前記スイッチ素子(4)および/または前記ダイオード(2)に当て、
前記少なくとも1つの圧電ファンは、マイクロコントローラによって制御される、ことを特徴とするスイッチング電源。 - 請求項5記載のスイッチング電源において、
前記少なくとも1つの圧電ファン(8)は、実質的にストライプ状の羽根(10)から形成されており、
該羽根の一方の端部は自由振動するように配置されており、
該羽根の他方の端部は保持部(9)に保持されており、
該羽根は制御ユニットと電気接続している、ことを特徴とするスイッチング電源。 - 請求項5または6記載のスイッチング電源において、
前記スイッチング電源が偶数の圧電ファン(8)を有し、
該圧電ファンは、羽根(10)の自由振動端部の慣性力が、当該羽根(10)が逆相に同期して振動すると相殺されるように配置されている、ことを特徴とするスイッチング電源。 - 請求項5から7までのいずれか一項記載のスイッチング電源において、
前記少なくとも1つの圧電ファン(8)の保持部は、トランス(1)と強固に結合されている、ことを特徴とするスイッチング電源。 - 請求項5から7までのいずれか一項記載のスイッチング電源において、
前記少なくとも1つの圧電ファン(8)の保持部は、スイッチング電源に配置された冷却体(5,5a)と強固に結合されている、ことを特徴とするスイッチング電源。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006046982 | 2006-10-04 | ||
DE102006046982.8 | 2006-10-04 | ||
PCT/EP2007/057038 WO2008040578A1 (de) | 2006-10-04 | 2007-07-10 | Schaltnetzteil |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010505375A JP2010505375A (ja) | 2010-02-18 |
JP4878388B2 true JP4878388B2 (ja) | 2012-02-15 |
Family
ID=38582022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009529623A Expired - Fee Related JP4878388B2 (ja) | 2006-10-04 | 2007-07-10 | スイッチング電源 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8106567B2 (ja) |
EP (1) | EP2070401A1 (ja) |
JP (1) | JP4878388B2 (ja) |
KR (1) | KR20090086398A (ja) |
CN (1) | CN101524010B (ja) |
RU (1) | RU2400951C1 (ja) |
WO (1) | WO2008040578A1 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102130081A (zh) * | 2010-01-12 | 2011-07-20 | 富瑞精密组件(昆山)有限公司 | 散热装置及其气流产生装置 |
DE102012200925A1 (de) * | 2012-01-23 | 2013-07-25 | Siemens Aktiengesellschaft | Elektroenergieübertragungseinrichtung mit einem bewegbaren Blatt sowie Verfahren zum Bewegen eines Blattes |
US11156235B2 (en) * | 2012-07-05 | 2021-10-26 | Tai-Her Yang | Thermal transferring method and structural device utilizing thermal energy body performing vibration displacement (relative) to fluid |
EP2722975B1 (en) | 2012-10-16 | 2017-06-28 | ABB Research Ltd. | Cooled electrical assembly |
GB201220471D0 (en) * | 2012-11-14 | 2012-12-26 | Technology Partnership The | Pump |
CN103857225B (zh) * | 2012-12-03 | 2017-03-01 | 联想(北京)有限公司 | 一种电子设备 |
US10280945B2 (en) * | 2013-02-01 | 2019-05-07 | Alcatel Lucent | Device for moving air |
TW201526770A (zh) * | 2013-12-17 | 2015-07-01 | Wistron Corp | 散熱裝置及其控制方法 |
EP2960522A1 (en) * | 2014-06-27 | 2015-12-30 | Alcatel Lucent | Apparatus and method for operating an oscillation blade device and a system comprising the apparatus |
EP2960521A1 (en) * | 2014-06-27 | 2015-12-30 | Alcatel Lucent | Apparatus comprising an oscillation blade fan and method for cleaning the oscillation blade fan |
EP3010320B8 (de) * | 2014-10-13 | 2020-06-10 | Vitesco Technologies GmbH | Vorrichtung zur Kühlung einer elektronischen Steuereinheit und Steuergerät für ein Kraftfahrzeug |
EP3171038B1 (en) * | 2015-11-18 | 2019-01-02 | Alcatel Lucent | Apparatus and method for operating an oscillation blade device and a system comprising the apparatus |
TWM521322U (zh) * | 2015-12-18 | 2016-05-01 | Xian-Qin Su | 散熱裝置及其擺動結構 |
EP3507140B1 (en) * | 2016-09-02 | 2020-10-28 | Gentex Corporation | Cooling device for rearview assembly |
CN111918792B (zh) | 2018-03-27 | 2023-09-26 | 金泰克斯公司 | 具有集成冷却系统的全显示镜 |
TWI667871B (zh) * | 2018-08-07 | 2019-08-01 | 國立交通大學 | 風扇裝置 |
DE102021119120A1 (de) * | 2020-08-12 | 2022-02-17 | Defond Components Limited | Kühlsystem zur kühlung einer elektronischen komponente eines elektrischen geräts |
DE102023201451A1 (de) | 2023-02-20 | 2024-08-22 | Siemens Aktiengesellschaft | Elektronisches Modul und Kühlsystem dazu |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6261993A (ja) * | 1985-09-11 | 1987-03-18 | ヘキスト アクチェンゲゼルシャフト | 二官能性第三芳香族ホスフインオキシドの製法 |
JPS6261994A (ja) * | 1985-09-11 | 1987-03-18 | ヘキスト アクチェンゲゼルシャフト | 第三ホスフインオキシドの製法 |
JPH01137597A (ja) * | 1987-11-24 | 1989-05-30 | Matsushita Electric Works Ltd | 照明負荷の駆動状態検出装置 |
JPH0340462A (ja) * | 1989-03-03 | 1991-02-21 | Microelectron & Computer Technol Corp | 流体熱交換器 |
US5008582A (en) * | 1988-01-29 | 1991-04-16 | Kabushiki Kaisha Toshiba | Electronic device having a cooling element |
JPH0671226A (ja) * | 1992-07-28 | 1994-03-15 | Suzuki Motor Corp | 超音波発生装置 |
WO1996012924A1 (en) * | 1994-10-20 | 1996-05-02 | Ast Research, Inc. | Piezoelectric cooling device |
JPH10143257A (ja) * | 1996-11-08 | 1998-05-29 | Sansha Electric Mfg Co Ltd | 電源装置 |
JP2000261173A (ja) * | 1999-03-10 | 2000-09-22 | Sony Corp | 冷却装置および電子機器 |
US20040253130A1 (en) * | 2003-01-06 | 2004-12-16 | Ioan Sauciuc | Electronic thermal management |
EP1748688A2 (en) * | 2005-07-28 | 2007-01-31 | Delphi Technologies, Inc. | Electronic package and method of cooling electronics |
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-
2007
- 2007-07-10 EP EP07787313A patent/EP2070401A1/de not_active Withdrawn
- 2007-07-10 CN CN200780037090XA patent/CN101524010B/zh not_active Expired - Fee Related
- 2007-07-10 KR KR1020097009211A patent/KR20090086398A/ko not_active Application Discontinuation
- 2007-07-10 RU RU2009116654/09A patent/RU2400951C1/ru not_active IP Right Cessation
- 2007-07-10 JP JP2009529623A patent/JP4878388B2/ja not_active Expired - Fee Related
- 2007-07-10 US US12/311,147 patent/US8106567B2/en not_active Expired - Fee Related
- 2007-07-10 WO PCT/EP2007/057038 patent/WO2008040578A1/de active Application Filing
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6261993A (ja) * | 1985-09-11 | 1987-03-18 | ヘキスト アクチェンゲゼルシャフト | 二官能性第三芳香族ホスフインオキシドの製法 |
JPS6261994A (ja) * | 1985-09-11 | 1987-03-18 | ヘキスト アクチェンゲゼルシャフト | 第三ホスフインオキシドの製法 |
JPH01137597A (ja) * | 1987-11-24 | 1989-05-30 | Matsushita Electric Works Ltd | 照明負荷の駆動状態検出装置 |
US5008582A (en) * | 1988-01-29 | 1991-04-16 | Kabushiki Kaisha Toshiba | Electronic device having a cooling element |
JPH0340462A (ja) * | 1989-03-03 | 1991-02-21 | Microelectron & Computer Technol Corp | 流体熱交換器 |
JPH0671226A (ja) * | 1992-07-28 | 1994-03-15 | Suzuki Motor Corp | 超音波発生装置 |
WO1996012924A1 (en) * | 1994-10-20 | 1996-05-02 | Ast Research, Inc. | Piezoelectric cooling device |
JPH10143257A (ja) * | 1996-11-08 | 1998-05-29 | Sansha Electric Mfg Co Ltd | 電源装置 |
JP2000261173A (ja) * | 1999-03-10 | 2000-09-22 | Sony Corp | 冷却装置および電子機器 |
US20040253130A1 (en) * | 2003-01-06 | 2004-12-16 | Ioan Sauciuc | Electronic thermal management |
EP1748688A2 (en) * | 2005-07-28 | 2007-01-31 | Delphi Technologies, Inc. | Electronic package and method of cooling electronics |
Also Published As
Publication number | Publication date |
---|---|
US8106567B2 (en) | 2012-01-31 |
KR20090086398A (ko) | 2009-08-12 |
RU2400951C1 (ru) | 2010-09-27 |
EP2070401A1 (de) | 2009-06-17 |
JP2010505375A (ja) | 2010-02-18 |
US20100038994A1 (en) | 2010-02-18 |
CN101524010A (zh) | 2009-09-02 |
WO2008040578A1 (de) | 2008-04-10 |
CN101524010B (zh) | 2012-11-14 |
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