JP4874006B2 - Semiconductor product resin molding method and semiconductor product resin molding apparatus - Google Patents

Description

  According to the present invention, an IC chip is mounted and fixed on the upper surface of a substrate formed on a plate, a connection terminal is bonded to the IC chip, and the periphery of the IC chip is placed on the upper surface side of the substrate. The present invention relates to an improvement in a resin molding method when a periphery of an IC chip to which a connection terminal is bonded is molded with a synthetic resin material in a semiconductor product formed by molding with a synthetic resin material.

  A semiconductor product, which is formed by adhering an IC chip of a semiconductor element to the upper surface of a substrate, bonding wire-like connection terminals to it, and pressing the periphery around it with a synthetic resin material, is usually made in the following process. ing.

  First, as shown in FIG. 1, IC chips 2 are placed on a top surface of a substrate 1 to be formed into a strip-shaped plate at a predetermined interval and fixed to the substrate 1. Next, a metal plate in which a large number of wire-like connection terminals 3 are formed in a net shape is placed on the chip 2 for bonding, and then a synthetic resin material 4 is placed thereon to cover it. 2. A state in which the mold is processed so as to be pressed, and the periphery of the IC chip 2 fixed on the substrate 1 with a predetermined interval is molded with a continuous synthetic resin material 4 as shown in FIG. Then, as shown in FIG. 3, this is separated for each chip of one IC, so that the IC chip 2 as shown in the perspective view of FIG. 4 and the sectional view of FIG. The connection terminals 3 are combined and assembled into a semiconductor product M in a state of being pressed and fixed on the substrate 1 with the synthetic resin material 4. In FIG. 5, the small protrusions 5 provided on the lower surface side of the substrate 1 are solder small balls provided for connection.

  Then, when the semiconductor product M is manufactured, the resin molding process in which the periphery of the substrate 1 on which the IC chip 2 and the connection terminal 3 are assembled is molded with the synthetic resin material 4 is usually shown in FIGS. As shown in FIG. 4, a mold B is used which comprises an upper mold a fixedly supported on the machine frame, a lower mold b that moves up and down with respect to the upper mold a, and a lifting device c that moves the lower mold b up and down. Then, the substrate 1 on which the IC chip 2 and the connection terminal 3 are assembled, and the synthetic resin material 4 are supplied to operate the mold B to operate the lower mold b and the lower mold b. Molding is performed by applying pressure and heating with the built-in heater.

  At this time, as the synthetic resin material 4 supplied to the mold B, a powdered thermoplastic powder resin 4 is used, and this is formed on the upper surface of the lower mold b of the mold B as shown in FIG. However, the amount of the synthetic resin powder resin 4 to be charged is sufficient to press the periphery of the IC chip 2 and the connection terminal 3 assembled to the substrate 1. The required amount is calculated in advance by a sensor, and this is inserted into and extracted from the space between the upper mold a of the mold B and the lower mold b lowered as shown in FIG. 8 is loaded into the frame of the supply frame f that can be placed on the upper surface of the tray e, and the tray e is inserted to occupy the position indicated by the chain line in FIG. 8, and then the supply frame f is placed at that position. By fixing the tray e and pulling it out sequentially, As in, so that gradually loaded therein plunge powder resin 4 within the framework of the supply frame f into the cavity d provided in the lower mold b.

  The substrate 1 supplied into the mold B has an inverted posture in which the IC chip 2 and the connection terminal 3 assembled on the substrate B are located on the lower surface side, and this is used as a suction holder g that acts like a suction cup by intake air. 10 is placed in the mold B as shown in FIG. 10, and then the suction is stopped and the substrate 1 is separated from the suction holder g of the transport device h, and the substrate 1 is placed in the lower mold. 11 is dropped onto the powder resin 4 placed in the cavity d on the upper surface of b, and the conveying device h is pulled out to obtain the state shown in FIG. 11. From this state, the lower mold b is raised and pressurized, and simultaneously the lower mold b The heater built in is energized and heated to form the powder resin 4, and then the mold B is opened, and the conveying device h is inserted. As shown in FIG. g to hold the substrate 1 by suction Taken out to the outside of the metal, it is performed in the step of.

  A conventional resin molding means for a semiconductor product performed by such a process is to mold an IC chip 2 assembled on a substrate 1 and a connection terminal 3 bonded thereto with a synthetic resin material 4 into a semiconductor product M. The resin molding means in this conventional semiconductor product to be assembled is charged so that a powder resin 4 made of a synthetic resin material is placed in a cavity d formed on the upper surface side of the lower mold b of the mold B. On top of this, the IC chip 2 assembled with the substrate 1 and the connection terminal 3 bonded thereto are placed so as to be turned upside down, and the upper mold a and lower mold b of the mold B are mounted. Since the mold processing is performed by closing and pressurizing and heating, the powder resin 4 scatters in the mold B, rises and adheres to the inner surface of the mold B during the molding process. It is transferred to the surface of the semiconductor product of molding, there is a problem of causing a soiled product.

  Further, the powder resin 4 to be charged so as to be placed in the cavity d is weighed and charged in an amount necessary for molding the upper surface of the substrate 1 on which the IC chip 2 and the connection terminals 3 are assembled. Since the IC chips 2 and connecting terminals assembled in the board are not uniform, the outer shape of the molded product becomes uneven when molded, resulting in variations in the shape of the product.

  In addition, the powder resin 4 is put into the cavity d provided on the upper surface of the lower mold b of the mold B. If the semiconductor product is a large MAP type, the cavity d to be formed is enlarged according to the size. However, in the case of a small semiconductor product such as a POP type of 10 mm × 10 mm size, it is difficult to put the powder resin 4 into the cavity d having a size corresponding to this. As a result, there is a problem that a molding apparatus for performing a molding process on a semiconductor product can be adapted only to a molding process on a semiconductor product having a large size.

  The problem to be solved in the present invention is that the resin material for molding the semiconductor product M by feeding into the mold B is a thermosetting synthetic resin powder resin 4, which is below the mold B. The mold is placed in the cavity d provided in the mold b, and the IC chip 2 and the connection terminal 3 are placed so as to cover the substrate 1 in an inverted orientation facing downward, and the mold is placed. The powder resin 4 scatters in the mold B, which is generated in the resin molding means of the conventional semiconductor product that is molded into the semiconductor product M by the process of closing and closing the B and applying pressure and heating to the inner surface of the mold. The problem of sticking and being transferred to the outer surface of the semiconductor product to cause a dirty product, the problem of causing variation in the shape of the product due to the missing of the IC chip 2 and the connection terminal 3 assembled on the substrate 1, and the semiconductor product In that allowed to overcome the problems which can not be adapted by size.

In the present invention, as means for solving this problem, as described in claim 1,
A predetermined amount of the powder resin 4 is supplied to the upper surface of the substrate 1 on which the IC chip 2 and the connection terminals 3 bonded thereto are assembled on the upper surface side, and the powder resin 4 is preheated to about 180 ° C. to 250 ° C. A resin molding method for a semiconductor product, wherein the substrate 1 is supplied to a mold B and molded by vacuum pressure casting.
Is to raise.
In addition,
A powder resin supply device 6 for supplying the powder resin 4 to the upper surface side of the substrate 1 on which the IC chip 2 and the connection terminal 3 bonded thereto are assembled on the upper surface side, and the powder supplied to the upper surface side of the substrate 1 A preheating device 7 that preheats the resin 4 to be gelled, a transport device h that clamps and transports the substrate 1 that has been subjected to the gelling process of the powder resin 4 by the preheating device 7, and a substrate 1 that is transported by the transport device h. A resin molding apparatus for semiconductor products, comprising: a mold B which is received between the upper mold a and the lower mold b and integrally molds the substrate 1, the IC chip 2, the connection terminal 3 and the resin 4 by vacuum casting. .
Is to raise.

  In the means of the present invention, the powder resin is placed on the upper surface of the substrate outside the mold, and is supplied into the mold together with the substrate as a gelled state by pre-heat treatment. The powder resin does not scatter, so that no dirty product is produced. In addition, the powder resin is supplied to the upper surface of the substrate. A frame-shaped plate is placed on the upper surface of the substrate, and the powder is placed on the frame. By placing the resin and grinding it, leaving the required amount of powder resin in the frame allows the specified amount of resin to be supplied, so that weighing can be performed easily, and when grinding, By filling the part with powder resin, the measurement will be accurate and will not cause variation in the molded product.

  Furthermore, a square frame-shaped plate is placed on the upper surface side of the substrate, and a predetermined amount of powder resin is supplied to the upper surface side of the substrate by placing and grinding the powder resin on it. A predetermined amount of powder resin necessary for substrates of various sizes can be supplied without being affected by the size.

  Next, embodiments of the means of the present invention will be described in detail with reference to the accompanying drawings.

  14 and 15 show a general top view of the entire resin molding apparatus used for implementing the resin molding means for semiconductor products according to the present invention.

  The resin molding apparatus W includes a powdery powder resin 4 made of a thermosetting synthetic resin material for compressing the periphery of the IC chip 2 and connection terminals 3 assembled on the upper surface of the substrate 1 with respect to the substrate 1. Before supplying the powder resin resin device 6 made of a synthetic resin material supplied to the substrate 1 to the mold B, the powder resin supply device 6 that measures and supplies the required amount to the predetermined amount is 180 degrees C ~. A preheating device 7 for raising the temperature to about 250 ° C. for gelation, a conveying device h for feeding the gelled substrate 1 with the synthetic resin powder resin 4 to the mold B, It consists of a mold B for molding the placed synthetic resin powder resin 4 by vacuum pressure casting, and a carry-out device i for taking out the substrate 1 after the molding of the resin material from the mold B.

  As shown in FIG. 14, the powder resin supply device 6 includes a flat plate-like base plate 61 that is long on the front and rear and mounted on the upper surface of a base 60 that is positioned and positioned next to the installed mold B. The substrate mounting table 62 is mounted on the upper surface of the substrate mounting table 62 so as to slide back and forth, and the substrate 1 is formed in a square frame shape surrounding the periphery of the substrate 1 mounted on the substrate mounting table 62 so as to cover the substrate 1. Thus, the plate 63 placed on the substrate platform 62 and the endless transport belts 64 and 64 disposed on the left and right sides of the upper half of the upper surface of the platform 61 are placed on the substrate platform 62. A powder resin supply container 65 that reciprocates back and forth on the upper surface of the plate 63 to be moved. Inside the container 65, as shown in FIG. 17, the powder resin is driven and rotated in the direction of the arrow about the shaft 650. , A delivery port provided on the bottom surface of the container 65 Feeding wheel 652 which feeds from the 51 are rotatably supported. The bottom surface of the container 65 is in sliding contact with the upper surface of the plate 63 placed on the substrate mounting table 62, and the height position relative to the upper surface of the plate 63 when the container 65 reciprocates is held at a fixed position. A guide ruler 653 for restricting the guide ruler 653 is provided, and a scraper 654 whose lower surface coincides with the bottom surface of the guide ruler 653 is provided on one end side in the moving direction of the container 65.

  In the powder resin supply device 6, as shown in FIGS. 16 and 17, the IC chip 2 and the connection terminal 3 are assembled on the upper surface of the substrate mounting table 62 mounted on the base plate 61. When the substrate 1 is placed and a rectangular frame-shaped plate 63 is placed thereon, as shown in FIG. 18, a powder resin supply container 65 is loaded inside the container 65 for supplying the powder resin. The powder resin 4 that is moved from one end side to the other end side in the longitudinal direction of the substrate 1 while being fed from the feed port 651 by the operation of the feed wheel 652 is fed to the upper surface of the substrate 1. The scraper 654 provided on one end side of the container 65 is slidably brought into contact with the upper surface of the frame edge around the frame-shaped plate 63, so that the powder resin 4 is moved to the frame-shaped plate. Within 63 After the process is completed, the square frame-shaped plate 63 is pulled out, and the volume shape inside the frame of the square frame-shaped plate 63 is specified as shown in FIG. The amount of the powder resin 4 thus formed is shaped and placed in a trapezoidal shape that wraps around the IC chip 2 and the connection terminals 3.

  The substrate mounting table 62 has a suction pipe k for sucking and holding the substrate 1 mounted on the upper surface of the substrate mounting table 62 at the mounting position by suction exhaust, and a substrate mounted on the substrate mounting table 62. A heater 70 for raising the temperature of 1 is embedded. Then, the synthetic resin material powder resin 4 supplied from the above-described powder resin supply container 65 is applied to the upper surface of the substrate 1 placed on the substrate mounting table 62 by the heater 70 incorporated in the substrate mounting table 62. The preheating device 7 is configured to increase the temperature to about 180 ° C. to 250 ° C. to cause gelation.

  In the transfer device h, the powder resin 4 is supplied from the powder resin supply device 6 to the upper surface of the substrate 1 placed on the substrate mounting table 62, and the powder resin 4 is gelated by heating by the preheating device 7. When a state is reached, the pair of holding tools j and j that hold the substrate 1 from the left and right by the conveying means that grips the substrate 1 and supplies it to the mold B opens and closes the body that is not shown in the drawing. The body is supported by a separate moving mechanism, and the second half of the base 61 from above the substrate mounting base 62 as shown by the double-line arrows in FIG. Between the upper side of the base plate 61 and the inside of the mold B from the upper side of the second half side of the base plate 61 so as to reciprocate. Place the mounted substrate 1 in the mold B It operates to supply.

  The mold B includes an upper mold a that is fixedly supported on the machine frame, a lower mold b that moves up and down, and a lifting device c such as a hydraulic jack that moves the lower mold b up and down. And a powder resin 4 made of a thermosetting resin, by closing the upper mold a and the lower mold b and mounting the mold B on the mold B, the inside of the mold B is 100 to 1 to 1 Although this is a normal mold that is integrally insert-molded by vacuum pressure casting under a reduced pressure of about Torr, the mold B of the apparatus of this embodiment has a cavity d that accommodates the powder resin 4 to be supplied, an upper mold a The lower die b is formed in a plane on the upper surface side of the lower die b, and the IC chip 2 and the connection terminals 3 assembled thereon are directed to the upper surface side. It is supposed to be placed as a proper posture.

  Then, this mold B closes the upper mold a and the lower mold b, pressurizes and heats the supplied substrate 1 and the resin material, and performs mold processing with the resin material in FIG. As shown by the arrows of the double lines, the closed upper die a is biased in the pressing direction by the spring force of a spring (not shown), and the lower die b has a lifting device c. It is configured to receive an urging force in the push-up direction by the operation of.

  As a result, the substrate 1 placed on the upper surface of the substrate mounting table 62 installed on the above-described base plate 61 in a posture in which the assembled IC chip 2 and the connection terminal 3 are positioned on the upper surface side is provided on the upper surface side. When the powder resin 4 is supplied from the powder resin supply device 6 and the powder resin 4 is preheated and gelled by the preheating device 7 incorporated in the substrate mounting table 62, the substrate 1 is kept in its state posture. Carrying out with the conveying device h, supplying it to the upper surface of the lower mold b of the mold B as it is, closing the upper mold a and the lower mold b of the mold B, and applying pressure and heating. Is molded into a semiconductor product M.

  The unloading device i is a conveying means for unloading the semiconductor product M manufactured after the molding process using the resin material by the above-described process from the mold B, and is omitted in the drawing, but similar to the above-described conveying device h. It is configured.

It is explanatory drawing of the molding process in the resin molding means of the conventional semiconductor product, and is a perspective view of the state before a mold. It is explanatory drawing of the mold processing process of a semiconductor product same as the above, and is a perspective view of the state after performing mold processing. It is a perspective view of the state where it separated for every single semiconductor product after finishing mold processing same as the above. It is the perspective view which saw through the inside of the semiconductor product of the state cut | disconnected for every single semiconductor product. It is a longitudinal cross-sectional view of a semiconductor product same as the above. It is a general | schematic front view of the conventional metal mold | die used for the mold process of a semiconductor product. It is a cross-sectional top view of a metal mold | die same as the above. It is explanatory drawing of the process of charging the measured powder resin between the upper mold | type and lower mold of a metal mold | die same as the above. It is explanatory drawing of the process of throwing in the measured powder resin to the cavity formed in the lower mold of a metal mold | die same as the above. It is explanatory drawing of the process of putting a board | substrate upside down on the powder resin after a process same as the above. It is explanatory drawing of the state which finished the process same as the above. It is explanatory drawing of the process which closes a metal mold | die and is performing the mold process. It is explanatory drawing of the process of taking out the semiconductor product shape | molded after finishing the process of a mold process from a metal mold | die. It is a general | schematic front view of the resin molding apparatus of the semiconductor product used for this invention means. It is an outline top view of an apparatus same as the above. It is explanatory drawing of the process of mounting a board | substrate on the board | substrate mounting base of this invention means, and covering a frame-shaped plate from it. It is explanatory drawing of the process of moving the container for powder resin supply to the place which mounted the board | substrate on the board | substrate mounting base and covered the frame-shaped plate on it. It is explanatory drawing of the process of drawing out the powder resin currently loaded in the container by the drawing-out wheel incorporated in the container same as the above in the frame of a plate. It is explanatory drawing of the process of grinding the powder resin paid out by the movement of a container in the frame of a plate with the scraper provided in the one end side of the container. It is explanatory drawing which shows the state which finished the grinding of powder resin, lifted the plate, and the powder resin was piled up on the upper surface side of the board | substrate in the shape which follows the frame of a plate. It is explanatory drawing of the process preheated by the heater incorporated in the substrate mounting base and gelatinized the powder resin put on the board | substrate. It is explanatory drawing of the state which inserted the board | substrate which finished the pre-heat treatment same as the above in a metal mold | die. It is explanatory drawing of the process which is performing the vacuum press casting of the board | substrate same as the above with a metal mold | die. It is explanatory drawing of the process of taking out the semiconductor product molded after finishing the process same as the above from a metal mold | die.

Explanation of symbols

  B ... Mold, M ... Semiconductor product, W ... Resin molding device, a ... Upper die, b ... Lower die, c ... Lifting device, d ... Cavity, e ... Tray, f ... Supply frame, g ... Suction holder h ... conveying device, i ... unloading device, j ... clamping device, k ... suction pipe, 1 ... substrate, 2 ... IC chip, 3 ... connection terminal, 4 ... powder resin, 5 ... small protrusion, 6 ... powder resin supply Device: 60 ... frame, 61: base plate, 62 ... substrate mounting table, 63 ... plate, 631 ... frame hole, 64 ... transport belt, 65 ... container, 650 ... shaft, 651 ... feeding outlet, 652 ... feeding wheel, 653 ... Guide ruler, 654 ... Scraper, 7 ... Preheating device, 70 ... Heater.

Claims (5)

  A predetermined amount of the powder resin 4 is supplied to the upper surface of the substrate 1 on which the IC chip 2 and the connection terminals 3 bonded thereto are assembled on the upper surface side, and the powder resin 4 is preheated to about 180 ° C. to 250 ° C. A resin molding method for a semiconductor product, wherein the substrate 1 is supplied to a mold B and molded by vacuum pressure casting.   The step of supplying the powder resin 4 to the upper surface of the substrate 1 is a frame-shaped plate in which the portion corresponding to the portion to be molded with the resin material of the substrate 1 is a window hole-shaped frame hole 631 on the upper surface of the substrate 1. 63 is placed, the powder resin 4 is placed on the plate 63, and the powder resin 4 is left in the frame hole 631 of the plate 63 along the upper surface of the plate 63. A resin molding method for a semiconductor product according to claim 1.   A powder resin supply device 6 for supplying the powder resin 4 to the upper surface side of the substrate 1 on which the IC chip 2 and the connection terminal 3 bonded thereto are assembled on the upper surface side, and the powder supplied to the upper surface side of the substrate 1 A preheating device 7 that preheats the resin 4 to be gelled, a transport device h that clamps and transports the substrate 1 that has been subjected to the gelling process of the powder resin 4 by the preheating device 7, and a substrate 1 that is transported by the transport device h. A resin molding apparatus for semiconductor products, comprising: a mold B which is received between the upper mold a and the lower mold b and integrally molds the substrate 1, the IC chip 2, the connection terminal 3 and the resin 4 by vacuum casting. .   The powder resin supply device 6 is placed on the upper surface of a flat plate-like base plate 61 that is placed on a pedestal 60 that is disposed at a position adjacent to the mold B, and on the substrate mounting table 62. A frame-like plate 63 covering the upper surface side of the substrate 1 to be placed; a powder resin supplying container 65 disposed above the substrate placing table 62 so as to reciprocate along the upper surface of the substrate placing table 62; The powder resin 4 to be loaded in the container 65 is fed from the feed port 651 on the bottom surface so that the feeding impeller 652 incorporated in the container 65 and the plate placed on the substrate placing table 62 are placed on the substrate placing table 62. A scraper 654 provided on one end side of the container 65 so as to move in sliding contact with the upper surface of the substrate 6, and the powder level fed from the container 65 to the upper surface of the plate 63 placed on the upper surface side of the substrate 1 on the substrate mounting table 62. The emissions 4, semiconductor products of the resin molding apparatus according to claim 3, characterized in that so as to supply to the upper surface of the substrate 1 by wear out in the frame of the plate 6 by scraper 654.   The semiconductor product according to claim 3, wherein a heater (70) which is heated by energization is embedded in a substrate mounting table (62) on which the substrate (1) is mounted, and the preheating device (7) is constituted by the substrate mounting table (62). Resin molding equipment.

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