JP4869551B2 - プロセス制御システム及びプロセス制御方法 - Google Patents

プロセス制御システム及びプロセス制御方法 Download PDF

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Publication number
JP4869551B2
JP4869551B2 JP2003408666A JP2003408666A JP4869551B2 JP 4869551 B2 JP4869551 B2 JP 4869551B2 JP 2003408666 A JP2003408666 A JP 2003408666A JP 2003408666 A JP2003408666 A JP 2003408666A JP 4869551 B2 JP4869551 B2 JP 4869551B2
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measurement
processing
processed
area
measuring device
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JP2003408666A
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JP2004207703A5 (https=
JP2004207703A (ja
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昌幸 友安
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2003408666A 2002-12-06 2003-12-08 プロセス制御システム及びプロセス制御方法 Expired - Fee Related JP4869551B2 (ja)

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JP2003408666A JP4869551B2 (ja) 2002-12-06 2003-12-08 プロセス制御システム及びプロセス制御方法

Applications Claiming Priority (3)

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JP2002354763 2002-12-06
JP2002354763 2002-12-06
JP2003408666A JP4869551B2 (ja) 2002-12-06 2003-12-08 プロセス制御システム及びプロセス制御方法

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JP2006299490A Division JP2007088497A (ja) 2002-12-06 2006-11-02 プロセス制御システム、プロセス制御方法およびプロセス処理装置

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JP2004207703A JP2004207703A (ja) 2004-07-22
JP2004207703A5 JP2004207703A5 (https=) 2006-12-21
JP4869551B2 true JP4869551B2 (ja) 2012-02-08

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11876021B2 (en) 2019-05-23 2024-01-16 Kabushiki Kaisha Toshiba Test circuit and test method

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4678372B2 (ja) * 2004-06-29 2011-04-27 株式会社ニコン 管理方法及び管理システム、並びにプログラム
JP5242906B2 (ja) * 2006-10-17 2013-07-24 東京エレクトロン株式会社 基板処理装置の制御装置、制御方法および制御プログラムを記憶した記憶媒体
JP5165878B2 (ja) 2006-10-20 2013-03-21 東京エレクトロン株式会社 基板処理装置の制御装置、制御方法および制御プログラムを記憶した記憶媒体
JP2009099901A (ja) * 2007-10-19 2009-05-07 Sharp Corp 半導体製造システム及び半導体製造方法
JP5065082B2 (ja) 2008-02-25 2012-10-31 東京エレクトロン株式会社 基板の処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム
JP5429869B2 (ja) * 2008-12-22 2014-02-26 株式会社 Ｎｇｒ パターン検査装置および方法
JP5688227B2 (ja) 2010-02-26 2015-03-25 株式会社日立ハイテクノロジーズ エッチング装置、制御シミュレータ、及び半導体装置製造方法
US9523976B1 (en) * 2012-11-15 2016-12-20 Cypress Semiconductor Corporation Method and system for processing a semiconductor wafer using data associated with previously processed wafers
US10401279B2 (en) 2013-10-29 2019-09-03 Kla-Tencor Corporation Process-induced distortion prediction and feedforward and feedback correction of overlay errors
US11675374B2 (en) * 2018-10-26 2023-06-13 Illinois Tool Works Inc. Mass flow controller with advanced zero trending diagnostics
JP2024137176A (ja) * 2023-03-24 2024-10-07 株式会社Ｓｃｒｅｅｎホールディングス 分析装置、分析方法および分析プログラム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0729958A (ja) * 1993-07-14 1995-01-31 Hitachi Ltd 半導体製造装置
JPH10242127A (ja) * 1997-02-26 1998-09-11 Sony Corp 有機系反射防止膜のプラズマエッチング方法
DE19922936B4 (de) * 1999-05-19 2004-04-29 Infineon Technologies Ag Anlage zur Bearbeitung von Wafern
JP3910324B2 (ja) * 1999-10-26 2007-04-25 ファブソリューション株式会社 半導体製造装置
JP2001237173A (ja) * 2000-02-24 2001-08-31 Sony Corp レジストパターンの形成方法および半導体装置の製造方法
JP2002026106A (ja) * 2000-07-07 2002-01-25 Matsushita Electric Ind Co Ltd 半導体装置製造施設
JP2002107417A (ja) * 2000-09-28 2002-04-10 Miyazaki Oki Electric Co Ltd 半導体集積回路の試験装置及びその管理方法
JP2002110493A (ja) * 2000-10-04 2002-04-12 Matsushita Electric Ind Co Ltd 加工プロセス工程の異常抽出方法及び装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11876021B2 (en) 2019-05-23 2024-01-16 Kabushiki Kaisha Toshiba Test circuit and test method

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