JP4846877B2 - 装置 - Google Patents
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- JP4846877B2 JP4846877B2 JP2011027802A JP2011027802A JP4846877B2 JP 4846877 B2 JP4846877 B2 JP 4846877B2 JP 2011027802 A JP2011027802 A JP 2011027802A JP 2011027802 A JP2011027802 A JP 2011027802A JP 4846877 B2 JP4846877 B2 JP 4846877B2
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- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/2936—Iron [Fe] as principal constituent
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- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75264—Means for applying energy, e.g. heating means by induction heating, i.e. coils
- H01L2224/75265—Means for applying energy, e.g. heating means by induction heating, i.e. coils in the lower part of the bonding apparatus, e.g. in the apparatus chuck
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- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83194—Lateral distribution of the layer connectors
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- H01L2224/832—Applying energy for connecting
- H01L2224/8322—Applying energy for connecting with energy being in the form of electromagnetic radiation
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- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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Description
まず、図2で示したように、プリント回路基板10の接続パッド14上にハンダボール18を介してベアチップ16を位置決め載置した後、加熱によりハンダボール18を溶融させることにより、ベアチップ16をハンダによりBGA実装する。続いて、プリント回路基板10とベアチップ16との間およびベアチップ16の周囲に、熱硬化性樹脂および磁性体粉末22を含む接合材20、例えば50重量%の磁性体粉末22を含む液相状態の熱硬化型一液性エポキシ樹脂溶液を充填し、磁性体粉末含有エポキシ樹脂の充填物を形成する。
その他、遮蔽部材は、磁性体粉末を集約する部位に合わせて、任意の形状とすることができる。
図16に示す実施形態によれば、実装装置の加熱機構40は、可動ステージ32の下に設けられた電磁誘導加熱用の電磁コイル78およびコア79を備えている。
Claims (5)
- プリント回路基板に実装された電子部品と前記プリント回路基板との間および前記電子部品の周囲に、熱硬化性樹脂および磁性体粉末を含む接合材が充填された前記プリント回路基板を支持する支持部と、
前記プリント回路基板に対して磁力を印加する電磁石と、前記電磁石と前記接合材との間に位置され前記電磁石からの磁力を部分的に遮蔽する遮蔽部材と、を備え、前記接合材内の前記磁性体粉末が前記電子部品の周辺側に集まるように前記接合材に磁力を印加する磁力印加部と、
前記接合材を加熱して硬化させる加熱部と、
を備える装置。 - プリント回路基板に実装された電子部品と前記プリント回路基板との間および前記電子部品の周囲に、熱硬化性樹脂および磁性体粉末を含む接合材が充填された前記プリント回路基板を支持する支持部と、
前記プリント回路基板の両側に配置され、前記接合材内の前記磁性体粉末が前記プリント回路基板の実装面に対して垂直な方向に沿って均一に分散するように、前記プリント回路基板の実装面に対し垂直な方向に沿って上方および下方から磁力を印加する2つの電磁石を備える磁力印加部と、
前記接合材を加熱して硬化させる加熱部と、
を備え、
前記磁力印加部は、前記電磁石に供給する電流、電圧、あるいは、駆動周波数を調整して前記磁力を変化させ、前記プリント回路基板の実装面と直交する方向の前記磁性体粉末の分散状態を均一に制御する制御部を更に備える装置。 - プリント回路基板に実装された電子部品と前記プリント回路基板との間および前記電子部品の周囲に、熱硬化性樹脂および磁性体粉末を含む接合材が充填された前記プリント回路基板を支持する支持部と、
前記プリント回路基板の両側に配置され、前記接合材内の前記磁性体粉末が前記プリント回路基板の実装面に対して垂直な方向に沿って均一に分散するように、前記プリント回路基板の実装面に対し垂直な方向に沿って上方および下方から磁力を印加する2つの電磁石を備える磁力印加部と、
前記接合材を加熱して硬化させる加熱部と、
を備え、
前記磁力印加部は、前記2つの電磁石により、前記プリント回路基板の実装面に対して垂直な方向に沿って上方および下方から交互に磁力を前記接合材に印加し前記磁性体粉末の分散状態を均一に制御する制御部を備える装置。 - 熱硬化性樹脂および磁性体粉末を含み電子部品の電極が設けられた面と側面とに亘る接合材が設けられたプリント回路基板を支持する支持部と、
前記プリント回路基板に対して磁力を印加する電磁石を含み、前記電磁石からの磁力を部分的に遮蔽して前記電子部品の周辺側に磁力を印加する磁力印加部と、
前記接合材を加熱して硬化させる加熱部と、
を備える装置。 - 熱硬化性樹脂および磁性体粉末を含み、電子部品とプリント回路基板との間および前記電子部品の周囲に充填された接合材に対し、電磁石からの磁力を印加するとともに前記磁力を部分的に遮蔽することで、前記接合材内の前記磁性体粉末を前記電子部品の周辺領域側に移動させる装置。
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JP2009225028A Division JP4686629B2 (ja) | 2009-09-29 | 2009-09-29 | 電子部品の実装方法 |
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US20140050805A1 (en) | 2011-04-15 | 2014-02-20 | Lion Corporation | Composition, glucose metabolism-improving agent, and method for improving glucose metabolism |
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JP3343317B2 (ja) * | 1995-12-04 | 2002-11-11 | 松下電器産業株式会社 | 半導体ユニット及びその半導体素子の実装方法 |
JP2930186B2 (ja) * | 1996-03-28 | 1999-08-03 | 松下電器産業株式会社 | 半導体装置の実装方法および半導体装置の実装体 |
JP2848357B2 (ja) * | 1996-10-02 | 1999-01-20 | 日本電気株式会社 | 半導体装置の実装方法およびその実装構造 |
JPH10112477A (ja) * | 1996-10-04 | 1998-04-28 | Fuji Xerox Co Ltd | 半導体装置の製造方法及び半導体装置 |
JPH11102945A (ja) * | 1997-09-26 | 1999-04-13 | Fujitsu Ltd | 電子回路装置の製造方法およびその製造装置 |
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JP4790587B2 (ja) * | 2006-12-20 | 2011-10-12 | 日本メクトロン株式会社 | ノーフローアンダーフィルによるフリップチップ実装方法 |
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