JP4829585B2 - 配線基板及び半導体装置 - Google Patents
配線基板及び半導体装置 Download PDFInfo
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- JP4829585B2 JP4829585B2 JP2005298186A JP2005298186A JP4829585B2 JP 4829585 B2 JP4829585 B2 JP 4829585B2 JP 2005298186 A JP2005298186 A JP 2005298186A JP 2005298186 A JP2005298186 A JP 2005298186A JP 4829585 B2 JP4829585 B2 JP 4829585B2
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
Description
また、本発明に係る半導体装置は、前記支持層が有機樹脂による絶縁層であることが好ましい。
101:第1LSI側接続バッド
102:第1LSI側接続バンプ
103:接続パッド
104:第1LSI
105:アンダーフィル樹脂
106:モールド樹脂
200:剥離層
201:第2LSI側接続バッド
202:第2LSI側接続バンプ
203:接続パッド
204:第2LSI
205:アンダーフィル樹脂
301:BGAランド
302:境界BGAランド
303:引き出し部
401:第2BGAランド
402:境界第2BGAランド
501:導体配線
502:導体ビア
503:導体スルーホール
504:BGAボール
601:絶縁樹脂
602:微細接続部
603:半導体パッケージ外周
604:剥離方向
605:モールドウエハ部
606:配線基板
700:半導体装置
Claims (9)
- 1又は複数個の絶縁層と、1又は複数個の配線層と、前記絶縁層に形成された1又は複数個のビアとを備えた配線基板において、前記配線基板の片面に外部接続端子を有し、前記外部接続端子が形成されるランド部のうち、半導体素子の搭載位置の境界に設置されたランドの外側と内側の夫々2列ずつのランドの少なくとも一部のランドの形状が、前記ランドと同一平面上に形成された配線層と接続した辺と、配線基板の片側方向に沿って前記辺とは異なる位置の屈曲した点とから設けられた凸形状であることを特徴とする配線基板。
- 1又は複数個の絶縁層と、1又は複数個の配線層と、前記絶縁層に形成された1又は複数個のビアとを備えた配線基板において、前記配線基板の片面に外部接続端子を有し、前記外部接続端子が形成されるランド部のうち、半導体素子の搭載位置の境界に設置されたランドの外側と内側の夫々2列ずつのランドの全てのランドの形状が、前記ランドと同一平面上に形成された配線層と接続した辺と、配線基板の片側方向に沿って前記辺とは異なる位置の屈曲した点とから設けられた凸形状であることを特徴とする配線基板。
- 1又は複数個の絶縁層と、1又は複数個の配線層と、前記絶縁層に形成された1又は複数個のビアとを備えた配線基板において、前記配線基板の片面に外部接続端子を有し、前記外部接続端子が形成されるランド部のうち、半導体素子の搭載位置の境界に設置されたランドの外側と内側の夫々2列ずつのランドの少なくとも一部のランドにおいて、前記ランドと同一平面上に形成された配線層との接続部が、配線基板の片側方向にのみテーパ形状を有することを特徴とする配線基板。
- 1又は複数個の絶縁層と、1又は複数個の配線層と、前記絶縁層に形成された1又は複数個のビアとを備えた配線基板において、前記配線基板の片面に外部接続端子を有し、前記外部接続端子が形成されるランド部のうち、半導体素子の搭載位置の境界に設置されたランドの外側と内側の夫々2列ずつのランドの全てのランドにおいて、前記ランドと同一平面上に形成された配線層との接続部が、配線基板の片側方向にのみテーパ形状を有することを特徴とする配線基板。
- 平板状の配線基板と、前記配線基板の一方の面に設けられた第1の半導体素子と、前記一方の面および前記第1の半導体素子の側面を被覆する封止樹脂と、前記配線基板の他方の面に設けられた第2の半導体素子と、を有し、前記配線基板は、配線層と、前記配線層を支持する支持層と、前記配線層および前記支持層を貫通する貫通電極と、を備え、前記配線基板を介して前記第1の半導体素子と前記第2の半導体素子とが電気的に接続されていることを特徴とする半導体装置において、外部接続端子を設けるランド部のうち、半導体素子の搭載位置の境界に設置されたランドの外側と内側の夫々2列ずつのランドの全てのランドの形状が、前記ランドと同一平面上に形成された配線基板と接続した辺と、配線基板の片側方向に沿って前記辺とは異なる位置の屈曲した点とから設けられた凸形状であることを特徴とする半導体装置。
- 平板状の配線基板と、前記配線基板の一方の面に設けられた第1の半導体素子と、前記一方の面および前記第1の半導体素子の側面を被覆する封止樹脂と、前記配線基板の他方の面に設けられた第2の半導体素子と、を有し、前記配線基板は、配線層と、前記配線層を支持する支持層と、前記配線層および前記支持層を貫通する貫通電極と、を備え、前記配線基板を介して前記第1の半導体素子と前記第2の半導体素子とが電気的に接続されていることを特徴とする半導体装置において、外部接続端子を設けるランド部のうち、半導体素子の搭載位置の境界に設置されたランドの外側と内側の夫々2列ずつのランドの少なくとも一部のランドにおいて、前記ランドと同一平面上に形成された配線基板との接続部が、配線基板の片側方向にのみテーパ形状を有することを特徴とする半導体装置。
- 平板状の配線基板と、前記配線基板の一方の面に設けられた第1の半導体素子と、前記一方の面および前記第1の半導体素子の側面を被覆する封止樹脂と、前記配線基板の他方の面に設けられた第2の半導体素子と、を有し、前記配線基板は、配線層と、前記配線層を支持する支持層と、前記配線層および前記支持層を貫通する貫通電極と、を備え、前記配線基板を介して前記第1の半導体素子と前記第2の半導体素子とが電気的に接続されていることを特徴とする半導体装置において、外部接続端子を設けるランド部のうち、半導体素子の搭載位置の境界に設置されたランドの外側と内側の夫々2列ずつのランドの全てのランドにおいて、前記ランドと同一平面上に形成された配線基板との接続部が、配線基板の片側方向にのみテーパ形状を有することを特徴とする半導体装置。
- 前記支持層が有機樹脂による絶縁層であることを特徴とする請求項1から4のいずれか1項に記載の配線基板。
- 前記支持層が有機樹脂による絶縁層であることを特徴とする請求項5から7のいずれか1項に記載の半導体装置。
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JP2005298186A JP4829585B2 (ja) | 2005-10-12 | 2005-10-12 | 配線基板及び半導体装置 |
US11/544,732 US7889514B2 (en) | 2005-10-12 | 2006-10-10 | Wiring board, semiconductor device, and method of manufacturing the same |
CNB2006101321626A CN100452382C (zh) | 2005-10-12 | 2006-10-12 | 配线板,半导体器件以及制造半导体器件的方法 |
US12/960,148 US8050050B2 (en) | 2005-10-12 | 2010-12-03 | Wiring board, semiconductor device, and method of manufacturing the same |
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US10051743B2 (en) * | 2008-04-04 | 2018-08-14 | Hitachi Chemical Company, Ltd. | Two-layered laminate having metal foil cladded on its one surface, method for production of the laminate, single-sided printed wiring board, and method for production of the wiring board |
JP5300558B2 (ja) * | 2009-03-27 | 2013-09-25 | 日東電工株式会社 | 半導体装置の製造方法 |
US8716873B2 (en) | 2010-07-01 | 2014-05-06 | United Test And Assembly Center Ltd. | Semiconductor packages and methods of packaging semiconductor devices |
JP2012129369A (ja) | 2010-12-15 | 2012-07-05 | Ngk Spark Plug Co Ltd | 配線基板 |
CN104051871B (zh) * | 2014-06-27 | 2016-07-06 | 江苏协昌电子科技有限公司 | 一种用于连接电机与控制器的接线装置 |
US9827740B2 (en) * | 2014-07-22 | 2017-11-28 | Brewer Science Inc. | Polyimides as laser release materials for 3-D IC applications |
US10861992B2 (en) | 2016-11-25 | 2020-12-08 | The Boeing Company | Perovskite solar cells for space |
US20180151301A1 (en) * | 2016-11-25 | 2018-05-31 | The Boeing Company | Epitaxial perovskite materials for optoelectronics |
CN112687629B (zh) * | 2020-12-25 | 2024-02-23 | 上海易卜半导体有限公司 | 半导体封装方法、半导体组件以及包含其的电子设备 |
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JP3961092B2 (ja) * | 1997-06-03 | 2007-08-15 | 株式会社東芝 | 複合配線基板、フレキシブル基板、半導体装置、および複合配線基板の製造方法 |
JP3053010B2 (ja) * | 1997-11-21 | 2000-06-19 | 日本電気株式会社 | 半導体装置 |
JP2001345418A (ja) | 2000-06-02 | 2001-12-14 | Matsushita Electric Ind Co Ltd | 両面実装構造体の製造方法及びその両面実装構造体 |
JP2003060126A (ja) * | 2001-08-17 | 2003-02-28 | Hitachi Ltd | 半導体装置の製造方法 |
US7474538B2 (en) * | 2002-05-27 | 2009-01-06 | Nec Corporation | Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package |
JP2004039867A (ja) * | 2002-07-03 | 2004-02-05 | Sony Corp | 多層配線回路モジュール及びその製造方法 |
JP4228677B2 (ja) * | 2002-12-06 | 2009-02-25 | パナソニック株式会社 | 回路基板 |
JP4260672B2 (ja) * | 2004-04-16 | 2009-04-30 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置の製造方法及び中継基板の製造方法 |
JP4108643B2 (ja) * | 2004-05-12 | 2008-06-25 | 日本電気株式会社 | 配線基板及びそれを用いた半導体パッケージ |
JP2005150771A (ja) * | 2005-01-24 | 2005-06-09 | Sharp Corp | 配線基板、半導体装置およびパッケージスタック半導体装置 |
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CN100452382C (zh) | 2009-01-14 |
US7889514B2 (en) | 2011-02-15 |
US20110075389A1 (en) | 2011-03-31 |
US20070079987A1 (en) | 2007-04-12 |
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CN1949499A (zh) | 2007-04-18 |
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