JP4825171B2 - ボンディング装置用撮像装置及び撮像方法 - Google Patents

ボンディング装置用撮像装置及び撮像方法 Download PDF

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Publication number
JP4825171B2
JP4825171B2 JP2007152641A JP2007152641A JP4825171B2 JP 4825171 B2 JP4825171 B2 JP 4825171B2 JP 2007152641 A JP2007152641 A JP 2007152641A JP 2007152641 A JP2007152641 A JP 2007152641A JP 4825171 B2 JP4825171 B2 JP 4825171B2
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Japan
Prior art keywords
imaging
lens
optical system
image
lead frame
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Expired - Fee Related
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JP2007152641A
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English (en)
Japanese (ja)
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JP2008306039A (ja
Inventor
滋 早田
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Shinkawa Ltd
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Shinkawa Ltd
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Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2007152641A priority Critical patent/JP4825171B2/ja
Priority to TW096139980A priority patent/TW200848693A/zh
Priority to KR1020070128130A priority patent/KR100955626B1/ko
Priority to CN2008101089695A priority patent/CN101320703B/zh
Priority to US12/157,025 priority patent/US7848022B2/en
Publication of JP2008306039A publication Critical patent/JP2008306039A/ja
Application granted granted Critical
Publication of JP4825171B2 publication Critical patent/JP4825171B2/ja
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/18—Arrangements with more than one light path, e.g. for comparing two specimens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07223—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H10W72/07523—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Microscoopes, Condenser (AREA)
  • Die Bonding (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2007152641A 2007-06-08 2007-06-08 ボンディング装置用撮像装置及び撮像方法 Expired - Fee Related JP4825171B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007152641A JP4825171B2 (ja) 2007-06-08 2007-06-08 ボンディング装置用撮像装置及び撮像方法
TW096139980A TW200848693A (en) 2007-06-08 2007-10-25 Photography apparatus and method thereof for chip bonding device
KR1020070128130A KR100955626B1 (ko) 2007-06-08 2007-12-11 본딩 장치용 촬상 장치 및 촬상 방법
CN2008101089695A CN101320703B (zh) 2007-06-08 2008-06-05 焊接装置用摄像装置及摄像方法
US12/157,025 US7848022B2 (en) 2007-06-08 2008-06-06 Imaging device and method for a bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007152641A JP4825171B2 (ja) 2007-06-08 2007-06-08 ボンディング装置用撮像装置及び撮像方法

Publications (2)

Publication Number Publication Date
JP2008306039A JP2008306039A (ja) 2008-12-18
JP4825171B2 true JP4825171B2 (ja) 2011-11-30

Family

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JP2007152641A Expired - Fee Related JP4825171B2 (ja) 2007-06-08 2007-06-08 ボンディング装置用撮像装置及び撮像方法

Country Status (5)

Country Link
US (1) US7848022B2 (https=)
JP (1) JP4825171B2 (https=)
KR (1) KR100955626B1 (https=)
CN (1) CN101320703B (https=)
TW (1) TW200848693A (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4825172B2 (ja) * 2007-06-08 2011-11-30 株式会社新川 ボンディング装置用撮像装置及び撮像方法
JP5452973B2 (ja) * 2009-04-28 2014-03-26 富士機械製造株式会社 撮像装置及びその撮像装置を備える切削機械
KR101245530B1 (ko) * 2011-05-26 2013-03-21 주식회사 탑 엔지니어링 광학검사장치 및 이를 구비하는 어레이 테스트 장치
JP5838757B2 (ja) * 2011-11-22 2016-01-06 セイコーエプソン株式会社 棒状ワーク撮像装置および棒状ワークの先端同心判定装置
CN104502360A (zh) * 2014-12-25 2015-04-08 中国科学院半导体研究所 一种芯片外观缺陷检测系统
DE102018211951A1 (de) * 2017-07-20 2019-01-24 Robert Bosch Gmbh Kameravorrichtung für ein Fahrzeug zur Fahrerbeobachtung
WO2019082558A1 (ja) * 2017-10-26 2019-05-02 株式会社新川 ボンディング装置
JP7112341B2 (ja) * 2019-01-23 2022-08-03 東レエンジニアリング株式会社 実装装置および実装方法
JP7114537B2 (ja) * 2019-09-13 2022-08-08 株式会社東芝 半導体検査装置及び半導体装置の検査方法
CN111505819B (zh) * 2020-05-21 2022-04-05 杨星瑶 显微仪器和利用数字序列图像进行重复定位与测量的方法
JPWO2022014451A1 (https=) * 2020-07-13 2022-01-20
CN114289886A (zh) * 2022-01-17 2022-04-08 苏州德龙激光股份有限公司 组合式振镜三维激光刻蚀设备及其方法
CN116931236B (zh) * 2023-09-14 2023-11-28 长春长光智欧科技有限公司 一种基于探针对准晶圆的双倍率光学系统

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02301148A (ja) 1989-05-16 1990-12-13 Nec Corp ワイヤーボンディング装置用カメラ
JPH04240740A (ja) * 1991-01-25 1992-08-28 Nec Corp ボンディング装置
JPH05332739A (ja) * 1992-05-28 1993-12-14 Fujitsu Ltd 外観検査装置
JPH0750329A (ja) * 1992-06-24 1995-02-21 Nippon Steel Corp 半導体用ボンディングワイヤの形状測定方法および装置
JPH07270716A (ja) * 1994-03-31 1995-10-20 Ntn Corp 光学装置
JPH08285539A (ja) * 1995-04-18 1996-11-01 Hitachi Ltd パターン計測方法及びその装置
JPH09155786A (ja) * 1995-12-11 1997-06-17 Copal Co Ltd 電子部品の撮像装置
JP3272640B2 (ja) 1997-07-11 2002-04-08 株式会社カイジョー ボンディング装置
JP3626141B2 (ja) * 2001-08-10 2005-03-02 株式会社ソキア 撮像装置を備えた自動視準測量機
JP3857934B2 (ja) 2002-03-08 2006-12-13 株式会社堀場製作所 半導体測定装置
JP2006134917A (ja) * 2004-11-02 2006-05-25 Apic Yamada Corp 樹脂封止方法

Also Published As

Publication number Publication date
JP2008306039A (ja) 2008-12-18
KR100955626B1 (ko) 2010-05-03
TW200848693A (en) 2008-12-16
CN101320703B (zh) 2011-03-30
US7848022B2 (en) 2010-12-07
CN101320703A (zh) 2008-12-10
TWI340231B (https=) 2011-04-11
US20090124028A1 (en) 2009-05-14
KR20080107973A (ko) 2008-12-11

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