TW200848693A - Photography apparatus and method thereof for chip bonding device - Google Patents

Photography apparatus and method thereof for chip bonding device Download PDF

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Publication number
TW200848693A
TW200848693A TW096139980A TW96139980A TW200848693A TW 200848693 A TW200848693 A TW 200848693A TW 096139980 A TW096139980 A TW 096139980A TW 96139980 A TW96139980 A TW 96139980A TW 200848693 A TW200848693 A TW 200848693A
Authority
TW
Taiwan
Prior art keywords
lens
photographic
optical system
lead frame
image
Prior art date
Application number
TW096139980A
Other languages
English (en)
Chinese (zh)
Other versions
TWI340231B (https=
Inventor
Shigeru Hayata
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200848693A publication Critical patent/TW200848693A/zh
Application granted granted Critical
Publication of TWI340231B publication Critical patent/TWI340231B/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/18—Arrangements with more than one light path, e.g. for comparing two specimens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07223—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H10W72/07523—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Microscoopes, Condenser (AREA)
  • Die Bonding (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW096139980A 2007-06-08 2007-10-25 Photography apparatus and method thereof for chip bonding device TW200848693A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007152641A JP4825171B2 (ja) 2007-06-08 2007-06-08 ボンディング装置用撮像装置及び撮像方法

Publications (2)

Publication Number Publication Date
TW200848693A true TW200848693A (en) 2008-12-16
TWI340231B TWI340231B (https=) 2011-04-11

Family

ID=40180674

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096139980A TW200848693A (en) 2007-06-08 2007-10-25 Photography apparatus and method thereof for chip bonding device

Country Status (5)

Country Link
US (1) US7848022B2 (https=)
JP (1) JP4825171B2 (https=)
KR (1) KR100955626B1 (https=)
CN (1) CN101320703B (https=)
TW (1) TW200848693A (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4825172B2 (ja) * 2007-06-08 2011-11-30 株式会社新川 ボンディング装置用撮像装置及び撮像方法
JP5452973B2 (ja) * 2009-04-28 2014-03-26 富士機械製造株式会社 撮像装置及びその撮像装置を備える切削機械
KR101245530B1 (ko) * 2011-05-26 2013-03-21 주식회사 탑 엔지니어링 광학검사장치 및 이를 구비하는 어레이 테스트 장치
JP5838757B2 (ja) * 2011-11-22 2016-01-06 セイコーエプソン株式会社 棒状ワーク撮像装置および棒状ワークの先端同心判定装置
CN104502360A (zh) * 2014-12-25 2015-04-08 中国科学院半导体研究所 一种芯片外观缺陷检测系统
DE102018211951A1 (de) * 2017-07-20 2019-01-24 Robert Bosch Gmbh Kameravorrichtung für ein Fahrzeug zur Fahrerbeobachtung
WO2019082558A1 (ja) * 2017-10-26 2019-05-02 株式会社新川 ボンディング装置
JP7112341B2 (ja) * 2019-01-23 2022-08-03 東レエンジニアリング株式会社 実装装置および実装方法
JP7114537B2 (ja) * 2019-09-13 2022-08-08 株式会社東芝 半導体検査装置及び半導体装置の検査方法
CN111505819B (zh) * 2020-05-21 2022-04-05 杨星瑶 显微仪器和利用数字序列图像进行重复定位与测量的方法
JPWO2022014451A1 (https=) * 2020-07-13 2022-01-20
CN114289886A (zh) * 2022-01-17 2022-04-08 苏州德龙激光股份有限公司 组合式振镜三维激光刻蚀设备及其方法
CN116931236B (zh) * 2023-09-14 2023-11-28 长春长光智欧科技有限公司 一种基于探针对准晶圆的双倍率光学系统

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02301148A (ja) 1989-05-16 1990-12-13 Nec Corp ワイヤーボンディング装置用カメラ
JPH04240740A (ja) * 1991-01-25 1992-08-28 Nec Corp ボンディング装置
JPH05332739A (ja) * 1992-05-28 1993-12-14 Fujitsu Ltd 外観検査装置
JPH0750329A (ja) * 1992-06-24 1995-02-21 Nippon Steel Corp 半導体用ボンディングワイヤの形状測定方法および装置
JPH07270716A (ja) * 1994-03-31 1995-10-20 Ntn Corp 光学装置
JPH08285539A (ja) * 1995-04-18 1996-11-01 Hitachi Ltd パターン計測方法及びその装置
JPH09155786A (ja) * 1995-12-11 1997-06-17 Copal Co Ltd 電子部品の撮像装置
JP3272640B2 (ja) 1997-07-11 2002-04-08 株式会社カイジョー ボンディング装置
JP3626141B2 (ja) * 2001-08-10 2005-03-02 株式会社ソキア 撮像装置を備えた自動視準測量機
JP3857934B2 (ja) 2002-03-08 2006-12-13 株式会社堀場製作所 半導体測定装置
JP2006134917A (ja) * 2004-11-02 2006-05-25 Apic Yamada Corp 樹脂封止方法

Also Published As

Publication number Publication date
JP2008306039A (ja) 2008-12-18
KR100955626B1 (ko) 2010-05-03
CN101320703B (zh) 2011-03-30
US7848022B2 (en) 2010-12-07
CN101320703A (zh) 2008-12-10
TWI340231B (https=) 2011-04-11
US20090124028A1 (en) 2009-05-14
JP4825171B2 (ja) 2011-11-30
KR20080107973A (ko) 2008-12-11

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MM4A Annulment or lapse of patent due to non-payment of fees