JP4819422B2 - 電子回路基板へのハンダ粉末の付着方法およびハンダ付電子配線基板 - Google Patents

電子回路基板へのハンダ粉末の付着方法およびハンダ付電子配線基板 Download PDF

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Publication number
JP4819422B2
JP4819422B2 JP2005201567A JP2005201567A JP4819422B2 JP 4819422 B2 JP4819422 B2 JP 4819422B2 JP 2005201567 A JP2005201567 A JP 2005201567A JP 2005201567 A JP2005201567 A JP 2005201567A JP 4819422 B2 JP4819422 B2 JP 4819422B2
Authority
JP
Japan
Prior art keywords
solder powder
circuit board
electronic circuit
solder
derivatives
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005201567A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007019389A (ja
Inventor
孝志 荘司
丈和 堺
哲夫 久保田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko KK
Taisei Co Ltd
Original Assignee
Showa Denko KK
Taisei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK, Taisei Co Ltd filed Critical Showa Denko KK
Priority to JP2005201567A priority Critical patent/JP4819422B2/ja
Priority to CN2006800330575A priority patent/CN101263753B/zh
Priority to KR1020087002109A priority patent/KR100985057B1/ko
Priority to PCT/JP2006/314019 priority patent/WO2007007865A1/en
Priority to TW095125270A priority patent/TWI328415B/zh
Publication of JP2007019389A publication Critical patent/JP2007019389A/ja
Priority to US12/013,246 priority patent/US8109432B2/en
Application granted granted Critical
Publication of JP4819422B2 publication Critical patent/JP4819422B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2005201567A 2005-07-11 2005-07-11 電子回路基板へのハンダ粉末の付着方法およびハンダ付電子配線基板 Expired - Fee Related JP4819422B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2005201567A JP4819422B2 (ja) 2005-07-11 2005-07-11 電子回路基板へのハンダ粉末の付着方法およびハンダ付電子配線基板
CN2006800330575A CN101263753B (zh) 2005-07-11 2006-07-07 用于向电子线路板上附着焊料粉的方法和焊料粉附着的电子线路板
KR1020087002109A KR100985057B1 (ko) 2005-07-11 2006-07-07 전자 회로 기판으로의 땜납 분말의 부착방법 및 땜납 부착전자 회로 기판
PCT/JP2006/314019 WO2007007865A1 (en) 2005-07-11 2006-07-07 Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
TW095125270A TWI328415B (en) 2005-07-11 2006-07-11 Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
US12/013,246 US8109432B2 (en) 2005-07-11 2008-01-11 Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005201567A JP4819422B2 (ja) 2005-07-11 2005-07-11 電子回路基板へのハンダ粉末の付着方法およびハンダ付電子配線基板

Publications (2)

Publication Number Publication Date
JP2007019389A JP2007019389A (ja) 2007-01-25
JP4819422B2 true JP4819422B2 (ja) 2011-11-24

Family

ID=37756253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005201567A Expired - Fee Related JP4819422B2 (ja) 2005-07-11 2005-07-11 電子回路基板へのハンダ粉末の付着方法およびハンダ付電子配線基板

Country Status (4)

Country Link
JP (1) JP4819422B2 (zh)
KR (1) KR100985057B1 (zh)
CN (1) CN101263753B (zh)
TW (1) TWI328415B (zh)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0548258A (ja) * 1991-08-20 1993-02-26 Murata Mfg Co Ltd 電子部品の半田付け方法
JP2592757B2 (ja) * 1992-10-30 1997-03-19 昭和電工株式会社 はんだ回路基板及びその形成方法
TW379392B (en) * 1996-10-30 2000-01-11 Du Pont Product and method for placing particles on contact pads of electronic devices
JP2933065B2 (ja) * 1997-06-18 1999-08-09 日本電気株式会社 微小金属ボールの配列方法
JPH11240612A (ja) * 1998-02-26 1999-09-07 Nichiden Mach Ltd 微細ボールの整列方法及びその装置

Also Published As

Publication number Publication date
JP2007019389A (ja) 2007-01-25
CN101263753A (zh) 2008-09-10
TWI328415B (en) 2010-08-01
TW200730056A (en) 2007-08-01
KR100985057B1 (ko) 2010-10-04
CN101263753B (zh) 2010-09-29
KR20080019725A (ko) 2008-03-04

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