TW200730056A - Method for attacement of solder powder to electronic circuit board and solder-attached electronic circuit board - Google Patents

Method for attacement of solder powder to electronic circuit board and solder-attached electronic circuit board

Info

Publication number
TW200730056A
TW200730056A TW095125270A TW95125270A TW200730056A TW 200730056 A TW200730056 A TW 200730056A TW 095125270 A TW095125270 A TW 095125270A TW 95125270 A TW95125270 A TW 95125270A TW 200730056 A TW200730056 A TW 200730056A
Authority
TW
Taiwan
Prior art keywords
circuit board
electronic circuit
solder
solder powder
attacement
Prior art date
Application number
TW095125270A
Other languages
Chinese (zh)
Other versions
TWI328415B (en
Inventor
Takashi Shoji
Takekazu Sakai
Tetsuo Kubota
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Publication of TW200730056A publication Critical patent/TW200730056A/en
Application granted granted Critical
Publication of TWI328415B publication Critical patent/TWI328415B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness thereto to form a tackified part, attaching solder powder by a dry or wet process to the tackified part, and then removing excessively adhering solder powder in a liquid that is water, deoxidized water or deoxidized water added with an antirust.
TW095125270A 2005-07-11 2006-07-11 Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board TWI328415B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005201567A JP4819422B2 (en) 2005-07-11 2005-07-11 Method for attaching solder powder to electronic circuit board and electronic wiring board with solder

Publications (2)

Publication Number Publication Date
TW200730056A true TW200730056A (en) 2007-08-01
TWI328415B TWI328415B (en) 2010-08-01

Family

ID=37756253

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125270A TWI328415B (en) 2005-07-11 2006-07-11 Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board

Country Status (4)

Country Link
JP (1) JP4819422B2 (en)
KR (1) KR100985057B1 (en)
CN (1) CN101263753B (en)
TW (1) TWI328415B (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0548258A (en) * 1991-08-20 1993-02-26 Murata Mfg Co Ltd Soldering method for electronic component
JP2592757B2 (en) * 1992-10-30 1997-03-19 昭和電工株式会社 Solder circuit board and method for forming the same
TW379392B (en) * 1996-10-30 2000-01-11 Du Pont Product and method for placing particles on contact pads of electronic devices
JP2933065B2 (en) * 1997-06-18 1999-08-09 日本電気株式会社 Arrangement method of small metal balls
JPH11240612A (en) * 1998-02-26 1999-09-07 Nichiden Mach Ltd Minute ball alignment method and device

Also Published As

Publication number Publication date
KR20080019725A (en) 2008-03-04
JP4819422B2 (en) 2011-11-24
CN101263753B (en) 2010-09-29
TWI328415B (en) 2010-08-01
JP2007019389A (en) 2007-01-25
CN101263753A (en) 2008-09-10
KR100985057B1 (en) 2010-10-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees