JP4808149B2 - 静電チャック - Google Patents

静電チャック Download PDF

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Publication number
JP4808149B2
JP4808149B2 JP2006341355A JP2006341355A JP4808149B2 JP 4808149 B2 JP4808149 B2 JP 4808149B2 JP 2006341355 A JP2006341355 A JP 2006341355A JP 2006341355 A JP2006341355 A JP 2006341355A JP 4808149 B2 JP4808149 B2 JP 4808149B2
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JP
Japan
Prior art keywords
electrostatic chuck
dielectric layer
elastic layer
adsorption
adsorbed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006341355A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007294852A5 (enExample
JP2007294852A (ja
Inventor
忠義 吉川
直人 林
寛 米倉
美喜 齋藤
晃樹 玉川
等 金子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2006341355A priority Critical patent/JP4808149B2/ja
Priority to KR1020070029275A priority patent/KR20070098566A/ko
Priority to TW096110483A priority patent/TW200800478A/zh
Publication of JP2007294852A publication Critical patent/JP2007294852A/ja
Publication of JP2007294852A5 publication Critical patent/JP2007294852A5/ja
Application granted granted Critical
Publication of JP4808149B2 publication Critical patent/JP4808149B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2006341355A 2006-03-29 2006-12-19 静電チャック Active JP4808149B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006341355A JP4808149B2 (ja) 2006-03-29 2006-12-19 静電チャック
KR1020070029275A KR20070098566A (ko) 2006-03-29 2007-03-26 정전 척
TW096110483A TW200800478A (en) 2006-03-29 2007-03-27 Electrostatic chuck

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006090717 2006-03-29
JP2006090717 2006-03-29
JP2006341355A JP4808149B2 (ja) 2006-03-29 2006-12-19 静電チャック

Publications (3)

Publication Number Publication Date
JP2007294852A JP2007294852A (ja) 2007-11-08
JP2007294852A5 JP2007294852A5 (enExample) 2009-11-05
JP4808149B2 true JP4808149B2 (ja) 2011-11-02

Family

ID=38765131

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006341355A Active JP4808149B2 (ja) 2006-03-29 2006-12-19 静電チャック

Country Status (3)

Country Link
JP (1) JP4808149B2 (enExample)
KR (1) KR20070098566A (enExample)
TW (1) TW200800478A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010182866A (ja) * 2009-02-05 2010-08-19 Nikon Corp 静電吸着保持装置、露光装置、露光方法及びデバイスの製造方法
JP5846186B2 (ja) * 2010-01-29 2016-01-20 住友大阪セメント株式会社 静電チャック装置および静電チャック装置の製造方法
TWI560803B (en) * 2014-06-13 2016-12-01 Mobile electrostatic chuck and manufacturing method of the same
DE102015210736B3 (de) 2015-06-11 2016-10-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung mit folie zum elektrostatischen koppeln eines substrats mit einem substratträger
JP6642170B2 (ja) * 2016-03-23 2020-02-05 住友大阪セメント株式会社 静電チャック装置及びその製造方法
JP6808979B2 (ja) * 2016-06-01 2021-01-06 株式会社リコー 入力素子及び入力装置
US10899605B2 (en) * 2018-03-05 2021-01-26 Sharp Kabushiki Kaisha MEMS device and manipulation method for micro-objects
KR102093991B1 (ko) * 2018-08-31 2020-04-23 이지스코 주식회사 고무 탄성체 다이아프램 타입 정전척 및 그 제조방법
KR102292501B1 (ko) * 2019-01-24 2021-08-23 김순훈 정전척
JP7128534B2 (ja) * 2020-05-26 2022-08-31 Ａｉメカテック株式会社 基板組立装置及び基板組立方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0422153A (ja) * 1990-05-17 1992-01-27 Tokyo Electron Ltd 静電吸着装置
JP3805134B2 (ja) * 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
JP3599634B2 (ja) * 2000-04-10 2004-12-08 信越化学工業株式会社 イオン注入機用静電チャック
JP4684222B2 (ja) * 2004-03-19 2011-05-18 株式会社クリエイティブ テクノロジー 双極型静電チャック

Also Published As

Publication number Publication date
TW200800478A (en) 2008-01-01
KR20070098566A (ko) 2007-10-05
JP2007294852A (ja) 2007-11-08

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