JP4801131B2 - ソケットエレメント、ソケット構成体、および別のソケット構成体の製造方法 - Google Patents
ソケットエレメント、ソケット構成体、および別のソケット構成体の製造方法 Download PDFInfo
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- JP4801131B2 JP4801131B2 JP2008289699A JP2008289699A JP4801131B2 JP 4801131 B2 JP4801131 B2 JP 4801131B2 JP 2008289699 A JP2008289699 A JP 2008289699A JP 2008289699 A JP2008289699 A JP 2008289699A JP 4801131 B2 JP4801131 B2 JP 4801131B2
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- module casing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10484—Obliquely mounted
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4998—Combined manufacture including applying or shaping of fluent material
Description
2 担体エレメント
3 モジュールケーシング
4′ 第1の面4の第1の面法線
5′ 第2の面5の第2の面法線
Claims (7)
- 第1の面(4)および第2の面(5)を有するソケットエレメント(1)であって、
該第1の面(4)は、モジュールケーシング(3)が取り付けられるように形成され、該第2の面(5)は担体エレメント(2)に取り付けられるように形成されているソケットエレメント(1)において、
はんだ付け工程または接着工程により前記第1の面(4)と前記モジュールケーシング(3)との間に導電性かつ機械的な接続部が形成されることにより、該第1の面(4)に該モジュールケーシング(3)が取り付けられるように構成されており、
該第1の面(4)の第1の面法線(4′)と該第2の面(5)の第2の面法線(5′)との間に、0〜90°の間の角度(10)が設けられており、
前記モジュールケーシング(3)および前記担体エレメント(2)は、第3の面法線(6′)および第4の面法線(7′)を有する第1の主延在面(6)および第2の主延在面(7)を有し、
該第3の面法線(6′)は前記第1の面法線(4′)に対して実質的に平行であり、該第4の面法線(7′)は前記第2の面法線(5′)に対して実質的に平行であり、
前記担体エレメント(2)はプリント基板またはボードまたは1つの導体路または複数の導体路を有し、
前記モジュールケーシング(3)はマイクロメカニカル回転速度センサおよび/またはマイクロメカニカル加速度センサを有し、
当該ソケットエレメント(1)は、
・前記第2の面(5)を含む部分と、
・一端で前記第2の面(5)を含む部分の上側に結合され他端でばね運動するばねエレメント(20)として形成された、前記第1の面(4)を含む別の部分と
を含み、
前記ばねエレメント(20)は、前記第1の面法線(4′)および/または前記第2の面法線(5′)に対して平行にばね運動をするように形成されており、
前記ばねエレメント(20)は、前記モジュールケーシング(3)が前記第1の面(4)から滑り出るのを阻止するための前固定エッジ(40)を有する
ことを特徴とする、ソケットエレメント。 - 当該ソケットエレメントは、前記第2の面(5)と反対側の面に、前記第1の面(4)に接している第3の面(12)を有し、
前記第3の面(12)は、前記第2の面法線(5′)に対して実質的に平行な第5の面法線(12′)を有する、請求項1記載のソケットエレメント。 - 前記第1の面(4)は前記モジュールケーシング(3)に対する電気的な第1の端子面を有し、かつ/または前記第2の面(5)は前記担体エレメント(2)に対する電気的な第2の端子面を有する、請求項1または2記載のソケットエレメント。
- 前記第1の端子面は前記第2の端子面に等しくない、請求項2記載のソケットエレメント。
- 前記モジュールケーシング(3)と前記担体エレメント(2)との間に少なくとも1つの導電性の接続部(11)を有する、請求項1から4までのいずれか1項記載のソケットエレメント。
- 前記第1の端子面と前記第2の端子面との間に少なくとも1つの導電性の接続部(11)を有する、請求項3または4記載のソケットエレメント。
- 請求項1から6までのいずれか1項記載のソケットエレメント(1)とモジュールケーシング(3)とを有するソケット構成体において、
はんだ付け工程または接着工程により前記第1の面(4)と前記モジュールケーシング(3)との間に導電性かつ機械的な接続部が形成されることにより、該モジュールケーシング(3)は前記第1の面(4)に機械的に固定されることを特徴とする、ソケット構成体。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007053808.3 | 2007-11-12 | ||
DE102007053808.3A DE102007053808B4 (de) | 2007-11-12 | 2007-11-12 | Sockelelement, Sockelanordnung und Verfahren zur Herstellung einer weiteren Sockelanordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009124147A JP2009124147A (ja) | 2009-06-04 |
JP4801131B2 true JP4801131B2 (ja) | 2011-10-26 |
Family
ID=40530623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008289699A Active JP4801131B2 (ja) | 2007-11-12 | 2008-11-12 | ソケットエレメント、ソケット構成体、および別のソケット構成体の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US8116098B2 (ja) |
JP (1) | JP4801131B2 (ja) |
DE (1) | DE102007053808B4 (ja) |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02147864A (ja) | 1988-11-29 | 1990-06-06 | Nippon Arefu:Kk | 加速度センサー |
JPH02285663A (ja) * | 1989-04-27 | 1990-11-22 | Fujitsu Ltd | テープキャリアを用いたデバイス |
US5503016A (en) | 1994-02-01 | 1996-04-02 | Ic Sensors, Inc. | Vertically mounted accelerometer chip |
JPH07249657A (ja) * | 1994-03-10 | 1995-09-26 | Hitachi Ltd | 半導体集積回路装置 |
JP3009104B2 (ja) | 1998-01-30 | 2000-02-14 | 富士電機株式会社 | 半導体センサおよび半導体センサ用パッケージ |
US6332359B1 (en) * | 1997-04-24 | 2001-12-25 | Fuji Electric Co., Ltd. | Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor |
US6115261A (en) | 1999-06-14 | 2000-09-05 | Honeywell Inc. | Wedge mount for integrated circuit sensors |
JP3555550B2 (ja) | 1999-06-18 | 2004-08-18 | アンデン株式会社 | 電気回路装置 |
US6798609B1 (en) * | 1999-07-28 | 2004-09-28 | Seagate Technology, Inc. | Magnetic microactuator with capacitive position sensor |
US7253079B2 (en) | 2002-05-09 | 2007-08-07 | The Charles Stark Draper Laboratory, Inc. | Coplanar mounting member for a MEM sensor |
JP3815559B2 (ja) * | 2002-10-04 | 2006-08-30 | ヤマハ株式会社 | 電子装置 |
US20040161871A1 (en) * | 2002-11-27 | 2004-08-19 | Seiko Epson Corporation | Semiconductor device, method of manufacturing the same, circuit substrate and electronic equipment |
DE10345632B4 (de) | 2003-09-29 | 2006-01-05 | Siemens Ag | Anordnung mit einem Sensor |
DE102004060977B3 (de) | 2004-12-17 | 2006-07-13 | Siemens Ag | Navigationscomputer mit einem Gyro-Sensor |
ITTO20040899A1 (it) * | 2004-12-23 | 2005-03-23 | St Microelectronics Srl | Apparecchio portatile dotato di un dispositivo accelerometrico per il rilevamento di caduta libera |
US7557470B2 (en) * | 2005-01-18 | 2009-07-07 | Massachusetts Institute Of Technology | 6-axis electromagnetically-actuated meso-scale nanopositioner |
DE102006015676A1 (de) | 2006-04-04 | 2007-06-14 | Siemens Ag | Elektronisches Bauteil und elektronisches Steuergerät, insbesondere zur Verwendung in Kraftfahrzeugen |
JP5622347B2 (ja) * | 2006-08-09 | 2014-11-12 | セイコーエプソン株式会社 | 慣性センサ装置 |
-
2007
- 2007-11-12 DE DE102007053808.3A patent/DE102007053808B4/de active Active
-
2008
- 2008-11-12 JP JP2008289699A patent/JP4801131B2/ja active Active
- 2008-11-12 US US12/269,481 patent/US8116098B2/en active Active
-
2012
- 2012-01-11 US US13/348,461 patent/US20120174376A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
DE102007053808A1 (de) | 2009-05-14 |
US20090122503A1 (en) | 2009-05-14 |
US8116098B2 (en) | 2012-02-14 |
US20120174376A1 (en) | 2012-07-12 |
DE102007053808B4 (de) | 2023-07-06 |
JP2009124147A (ja) | 2009-06-04 |
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