JP4796577B2 - 反射性ボンディングパッドを有する発光デバイスおよび反射性ボンディングパッドを有する発光デバイスを作製する方法 - Google Patents
反射性ボンディングパッドを有する発光デバイスおよび反射性ボンディングパッドを有する発光デバイスを作製する方法 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/42—Transparent materials
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/405—Reflective materials
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
Description
Claims (22)
- 半導体材料の活性領域と、
前記活性領域上の第1のコンタクトであって、前記活性領域により放出される光子が前記第1のコンタクトを通過するように構成された第1のコンタクトと、
前記第1のコンタクトの上の、光子を吸収するワイヤボンディングパッドであって、前記第1のコンタクトの面積よりも小さい面積を有するワイヤボンディングパッドと、
前記第1のコンタクトと前記ワイヤボンディングパッドとの間に配置され、前記第1のコンタクトの面積よりも小さい面積を有する反射性構造と、
前記第1のコンタクトに対して前記活性領域と反対側の第2のコンタクトと
を備え、
前記反射性構造は、前記第1のコンタクトの粗化された区域を備え、前記ワイヤボンディングパッドは、前記第1のコンタクトの上に直接あることを特徴とする発光デバイス。 - 前記第1のコンタクトと前記活性領域との間に配置されたp型半導体材料をさらに備えることを特徴とする請求項1に記載の発光デバイス。
- 前記第1のコンタクトと前記活性領域との間のn型半導体材料をさらに備えることを特徴とする請求項1に記載の発光デバイス。
- 前記活性領域は、III族窒化物ベースの活性領域を備えることを特徴とする請求項1に記載の発光デバイス。
- 前記反射性構造は、反射性金属の層を備えることを特徴とする請求項1に記載の発光デバイス。
- 前記反射性構造は、前記ワイヤボンディングパッドと自己位置合わせされていることを特徴とする請求項1に記載の発光デバイス。
- 前記粗化された区域は、前記ワイヤボンディングパッドと自己位置合わせされていることを特徴とする請求項1に記載の発光デバイス。
- 前記反射性構造は、
前記第1のコンタクトの粗化された区域と、
前記第1のコンタクトの前記粗化された区域の上の反射性金属層と
を備えることを特徴とする請求項1に記載の発光デバイス。 - 前記反射性構造は、前記ワイヤボンディングパッドを越えて延在しないことを特徴とする請求項1に記載の発光デバイス。
- 前記反射性構造は、前記ワイヤボンディングパッドと実質的に同じ面積を有することを特徴とする請求項1に記載の発光デバイス。
- 前記反射性構造は、前記ワイヤボンディングパッドと実質的に一致していることを特徴とする請求項1に記載の発光デバイス。
- 半導体材料の活性領域を形成するステップと、
前記活性領域上の第1のコンタクトを形成するステップであって、前記第1のコンタクトは、前記活性領域により放出される光子が前記第1のコンタクトを通過するように構成されるステップと、
前記第1のコンタクトの上の、前記第1のコンタクトの面積より小さい面積を有する反射性構造を形成するステップと、
前記反射性構造の上の、光子を吸収するワイヤボンディングパッドを形成するステップであって、前記ワイヤボンディングパッドは、前記第1のコンタクトの面積よりも小さい面積を有するステップと、
前記第1のコンタクトに対して前記活性領域の反対側に第2のコンタクトを形成するステップと
を含み、
反射性構造を形成するステップは、前記第1のコンタクトの区域を粗化するステップを含み、ワイヤボンディングパッドを形成するステップは、前記第1のコンタクトの上に直接ワイヤボンディングパッドを形成するステップを含むことを特徴とする発光デバイスを作製する方法。 - 前記第1のコンタクトと前記活性領域との間に配置されたp型半導体材料を形成するステップをさらに含むことを特徴とする請求項12に記載の方法。
- 前記第1のコンタクトと前記活性領域との間にn型半導体材料を形成するステップをさらに含むことを特徴とする請求項12に記載の方法。
- 活性領域を形成するステップは、III族窒化物ベースの活性領域を形成するステップを含むことを特徴とする請求項12に記載の方法。
- 反射性構造を形成するステップは、反射性金属の層を形成するステップを含むことを特徴とする請求項12に記載の方法。
- 反射性構造を形成するステップと、ワイヤボンディングパッドを形成するステップは、
前記第1のコンタクトの上にマスク層を形成するステップであって、前記マスク層は、前記第1のコンタクトの上の前記ワイヤボンディングパッドの位置に対応する前記第1のコンタクトの一部を露光する開口を有するステップと、
前記マスク層の前記開口内に反射性金属層を堆積するステップと、
前記マスク層の前記開口内の前記反射性金属層の上に、前記ワイヤボンディングパッドを形成するステップと
を含むことを特徴とする請求項12に記載の方法。 - 前記第1のコンタクトの区域を粗化するステップと、ワイヤボンディングパッドを形成するステップは、
前記第1のコンタクトの上にマスク層を形成するステップであって、前記マスク層は、前記第1のコンタクトの上の前記ワイヤボンディングパッドの位置に対応する前記第1のコンタクトの一部を露光する開口を有するステップと、
前記マスク層の前記開口により露光された前記第1のコンタクトの前記一部を粗化するステップと、
前記マスク層の前記開口内に、前記第1のコンタクトの前記粗化された一部の上に、前記ワイヤボンディングパッドを形成するステップと
を含むことを特徴とする請求項12に記載の方法。 - 反射性構造を形成するステップは、
前記第1のコンタクトの粗化された区域を形成するステップと、
前記第1のコンタクトの前記粗化された区域の上に反射性金属層を形成するステップと
を含むことを特徴とする請求項12に記載の方法。 - 前記反射性構造は、前記ワイヤボンディングパッドを越えて延在しないことを特徴とする請求項12に記載の方法。
- 前記反射性構造は、前記ワイヤボンディングパッドと実質的に同じ面積を有することを特徴とする請求項12に記載の方法。
- 前記反射性構造は、前記ワイヤボンディングパッドと実質的に一致することを特徴とする請求項12に記載の方法。
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US10/899,793 | 2004-07-27 | ||
US10/899,793 US7557380B2 (en) | 2004-07-27 | 2004-07-27 | Light emitting devices having a reflective bond pad and methods of fabricating light emitting devices having reflective bond pads |
PCT/US2005/010873 WO2006022873A2 (en) | 2004-07-27 | 2005-03-30 | Light emitting devices having a reflective bond pad and methods of fabricating light emitting devices having reflective bond pads |
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JP2008508714A JP2008508714A (ja) | 2008-03-21 |
JP4796577B2 true JP4796577B2 (ja) | 2011-10-19 |
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EP (2) | EP2450972B1 (ja) |
JP (1) | JP4796577B2 (ja) |
KR (3) | KR101197385B1 (ja) |
CN (2) | CN101103467B (ja) |
CA (1) | CA2572247A1 (ja) |
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Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6958497B2 (en) * | 2001-05-30 | 2005-10-25 | Cree, Inc. | Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures |
KR100735488B1 (ko) * | 2006-02-03 | 2007-07-04 | 삼성전기주식회사 | 질화갈륨계 발광다이오드 소자의 제조방법 |
US8174025B2 (en) * | 2006-06-09 | 2012-05-08 | Philips Lumileds Lighting Company, Llc | Semiconductor light emitting device including porous layer |
TW200832725A (en) * | 2007-01-18 | 2008-08-01 | Univ Nat Central | Method of improving current distribution by non-uniform conductive layer |
US8212262B2 (en) * | 2007-02-09 | 2012-07-03 | Cree, Inc. | Transparent LED chip |
EP2040316B1 (de) * | 2007-09-20 | 2014-08-06 | OSRAM Opto Semiconductors GmbH | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
US20090272975A1 (en) * | 2008-05-05 | 2009-11-05 | Ding-Yuan Chen | Poly-Crystalline Layer Structure for Light-Emitting Diodes |
USPP22761P2 (en) | 2010-04-23 | 2012-05-29 | Spring Meadow Nursery, Inc. | Potentilla plant named ‘White Lady’ |
KR100986518B1 (ko) | 2008-06-16 | 2010-10-07 | 엘지이노텍 주식회사 | 반도체 발광소자 |
US20100327300A1 (en) * | 2009-06-25 | 2010-12-30 | Koninklijke Philips Electronics N.V. | Contact for a semiconductor light emitting device |
US9362459B2 (en) | 2009-09-02 | 2016-06-07 | United States Department Of Energy | High reflectivity mirrors and method for making same |
KR101081166B1 (ko) | 2009-09-23 | 2011-11-07 | 엘지이노텍 주식회사 | 발광소자, 발광소자의 제조방법 및 발광소자 패키지 |
US9435493B2 (en) | 2009-10-27 | 2016-09-06 | Cree, Inc. | Hybrid reflector system for lighting device |
KR101103892B1 (ko) | 2009-12-08 | 2012-01-12 | 엘지이노텍 주식회사 | 발광소자 및 발광소자 패키지 |
US8604461B2 (en) * | 2009-12-16 | 2013-12-10 | Cree, Inc. | Semiconductor device structures with modulated doping and related methods |
US8536615B1 (en) | 2009-12-16 | 2013-09-17 | Cree, Inc. | Semiconductor device structures with modulated and delta doping and related methods |
US8575592B2 (en) * | 2010-02-03 | 2013-11-05 | Cree, Inc. | Group III nitride based light emitting diode structures with multiple quantum well structures having varying well thicknesses |
KR101259482B1 (ko) * | 2010-09-24 | 2013-05-06 | 서울옵토디바이스주식회사 | 고효율 발광다이오드 |
US9728676B2 (en) | 2011-06-24 | 2017-08-08 | Cree, Inc. | High voltage monolithic LED chip |
US10243121B2 (en) | 2011-06-24 | 2019-03-26 | Cree, Inc. | High voltage monolithic LED chip with improved reliability |
US8686429B2 (en) * | 2011-06-24 | 2014-04-01 | Cree, Inc. | LED structure with enhanced mirror reflectivity |
US9437783B2 (en) | 2012-05-08 | 2016-09-06 | Cree, Inc. | Light emitting diode (LED) contact structures and process for fabricating the same |
JP6189043B2 (ja) | 2013-02-12 | 2017-08-30 | セイコーエプソン株式会社 | 左心房圧計測装置の作動方法および左心房圧計測装置 |
KR102181381B1 (ko) * | 2013-08-05 | 2020-11-20 | 엘지이노텍 주식회사 | 발광소자 |
US10658546B2 (en) | 2015-01-21 | 2020-05-19 | Cree, Inc. | High efficiency LEDs and methods of manufacturing |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004349301A (ja) * | 2003-05-20 | 2004-12-09 | Sharp Corp | 発光ダイオード素子の電極及び発光ダイオード素子 |
Family Cites Families (82)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4918497A (en) | 1988-12-14 | 1990-04-17 | Cree Research, Inc. | Blue light emitting diode formed in silicon carbide |
US5027168A (en) | 1988-12-14 | 1991-06-25 | Cree Research, Inc. | Blue light emitting diode formed in silicon carbide |
US4966862A (en) | 1989-08-28 | 1990-10-30 | Cree Research, Inc. | Method of production of light emitting diodes |
US5210051A (en) | 1990-03-27 | 1993-05-11 | Cree Research, Inc. | High efficiency light emitting diodes from bipolar gallium nitride |
JPH04264781A (ja) | 1991-02-20 | 1992-09-21 | Eastman Kodak Japan Kk | 発光ダイオードアレイ |
JP2798545B2 (ja) | 1992-03-03 | 1998-09-17 | シャープ株式会社 | 半導体発光素子及びその製造方法 |
GB2270199B (en) | 1992-08-25 | 1995-05-10 | Mitsubishi Cable Ind Ltd | Semiconductor light emitting element |
DE4305296C3 (de) | 1993-02-20 | 1999-07-15 | Vishay Semiconductor Gmbh | Verfahren zum Herstellen einer strahlungsemittierenden Diode |
US5416342A (en) | 1993-06-23 | 1995-05-16 | Cree Research, Inc. | Blue light-emitting diode with high external quantum efficiency |
US5338944A (en) | 1993-09-22 | 1994-08-16 | Cree Research, Inc. | Blue light-emitting diode with degenerate junction structure |
JP3316062B2 (ja) * | 1993-12-09 | 2002-08-19 | 株式会社東芝 | 半導体発光素子 |
US5393993A (en) | 1993-12-13 | 1995-02-28 | Cree Research, Inc. | Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices |
US5604135A (en) | 1994-08-12 | 1997-02-18 | Cree Research, Inc. | Method of forming green light emitting diode in silicon carbide |
US5523589A (en) | 1994-09-20 | 1996-06-04 | Cree Research, Inc. | Vertical geometry light emitting diode with group III nitride active layer and extended lifetime |
US5631190A (en) | 1994-10-07 | 1997-05-20 | Cree Research, Inc. | Method for producing high efficiency light-emitting diodes and resulting diode structures |
US5814839A (en) | 1995-02-16 | 1998-09-29 | Sharp Kabushiki Kaisha | Semiconductor light-emitting device having a current adjusting layer and a uneven shape light emitting region, and method for producing same |
US5739554A (en) | 1995-05-08 | 1998-04-14 | Cree Research, Inc. | Double heterojunction light emitting diode with gallium nitride active layer |
DE19629920B4 (de) | 1995-08-10 | 2006-02-02 | LumiLeds Lighting, U.S., LLC, San Jose | Licht-emittierende Diode mit einem nicht-absorbierenden verteilten Braggreflektor |
US5779924A (en) * | 1996-03-22 | 1998-07-14 | Hewlett-Packard Company | Ordered interface texturing for a light emitting device |
US6291840B1 (en) * | 1996-11-29 | 2001-09-18 | Toyoda Gosei Co., Ltd. | GaN related compound semiconductor light-emitting device |
JPH10294531A (ja) | 1997-02-21 | 1998-11-04 | Toshiba Corp | 窒化物化合物半導体発光素子 |
US6057562A (en) | 1997-04-18 | 2000-05-02 | Epistar Corp. | High efficiency light emitting diode with distributed Bragg reflector |
US6420735B2 (en) | 1997-05-07 | 2002-07-16 | Samsung Electronics Co., Ltd. | Surface-emitting light-emitting diode |
US6201262B1 (en) | 1997-10-07 | 2001-03-13 | Cree, Inc. | Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlay structure |
JPH11135834A (ja) | 1997-10-27 | 1999-05-21 | Matsushita Electric Ind Co Ltd | 発光ダイオード装置及びその製造方法 |
EP0926744B8 (en) | 1997-12-15 | 2008-05-21 | Philips Lumileds Lighting Company, LLC. | Light emitting device |
JP3625377B2 (ja) * | 1998-05-25 | 2005-03-02 | ローム株式会社 | 半導体発光素子 |
US6291839B1 (en) | 1998-09-11 | 2001-09-18 | Lulileds Lighting, U.S. Llc | Light emitting device having a finely-patterned reflective contact |
US6177688B1 (en) | 1998-11-24 | 2001-01-23 | North Carolina State University | Pendeoepitaxial gallium nitride semiconductor layers on silcon carbide substrates |
JP3469484B2 (ja) | 1998-12-24 | 2003-11-25 | 株式会社東芝 | 半導体発光素子およびその製造方法 |
JP2000294837A (ja) * | 1999-04-05 | 2000-10-20 | Stanley Electric Co Ltd | 窒化ガリウム系化合物半導体発光素子 |
TW437104B (en) | 1999-05-25 | 2001-05-28 | Wang Tien Yang | Semiconductor light-emitting device and method for manufacturing the same |
US6287947B1 (en) * | 1999-06-08 | 2001-09-11 | Lumileds Lighting, U.S. Llc | Method of forming transparent contacts to a p-type GaN layer |
US6133589A (en) | 1999-06-08 | 2000-10-17 | Lumileds Lighting, U.S., Llc | AlGaInN-based LED having thick epitaxial layer for improved light extraction |
US6534798B1 (en) | 1999-09-08 | 2003-03-18 | California Institute Of Technology | Surface plasmon enhanced light emitting diode and method of operation for the same |
US6812502B1 (en) | 1999-11-04 | 2004-11-02 | Uni Light Technology Incorporation | Flip-chip light-emitting device |
US6492661B1 (en) | 1999-11-04 | 2002-12-10 | Fen-Ren Chien | Light emitting semiconductor device having reflection layer structure |
US6992334B1 (en) | 1999-12-22 | 2006-01-31 | Lumileds Lighting U.S., Llc | Multi-layer highly reflective ohmic contacts for semiconductor devices |
US6514782B1 (en) | 1999-12-22 | 2003-02-04 | Lumileds Lighting, U.S., Llc | Method of making a III-nitride light-emitting device with increased light generating capability |
US6486499B1 (en) | 1999-12-22 | 2002-11-26 | Lumileds Lighting U.S., Llc | III-nitride light-emitting device with increased light generating capability |
JP2001250414A (ja) * | 1999-12-28 | 2001-09-14 | Fujitsu Kasei Kk | 照明装置 |
TW465123B (en) * | 2000-02-02 | 2001-11-21 | Ind Tech Res Inst | High power white light LED |
TW472400B (en) | 2000-06-23 | 2002-01-11 | United Epitaxy Co Ltd | Method for roughing semiconductor device surface to increase the external quantum efficiency |
JP4024994B2 (ja) * | 2000-06-30 | 2007-12-19 | 株式会社東芝 | 半導体発光素子 |
US6429460B1 (en) * | 2000-09-28 | 2002-08-06 | United Epitaxy Company, Ltd. | Highly luminous light emitting device |
US6534797B1 (en) * | 2000-11-03 | 2003-03-18 | Cree, Inc. | Group III nitride light emitting devices with gallium-free layers |
US6791119B2 (en) | 2001-02-01 | 2004-09-14 | Cree, Inc. | Light emitting diodes including modifications for light extraction |
US6794684B2 (en) | 2001-02-01 | 2004-09-21 | Cree, Inc. | Reflective ohmic contacts for silicon carbide including a layer consisting essentially of nickel, methods of fabricating same, and light emitting devices including the same |
JP2002313749A (ja) * | 2001-04-10 | 2002-10-25 | Showa Denko Kk | 発光素子用n型電極及びその製造方法並びにそれを用いたIII族窒化物半導体発光素子 |
US7692182B2 (en) | 2001-05-30 | 2010-04-06 | Cree, Inc. | Group III nitride based quantum well light emitting device structures with an indium containing capping structure |
US6958497B2 (en) | 2001-05-30 | 2005-10-25 | Cree, Inc. | Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures |
JP3812366B2 (ja) * | 2001-06-04 | 2006-08-23 | 豊田合成株式会社 | Iii族窒化物系化合物半導体素子の製造方法 |
TW564584B (en) * | 2001-06-25 | 2003-12-01 | Toshiba Corp | Semiconductor light emitting device |
US7501023B2 (en) | 2001-07-06 | 2009-03-10 | Technologies And Devices, International, Inc. | Method and apparatus for fabricating crack-free Group III nitride semiconductor materials |
US6740906B2 (en) * | 2001-07-23 | 2004-05-25 | Cree, Inc. | Light emitting diodes including modifications for submount bonding |
JP4055503B2 (ja) | 2001-07-24 | 2008-03-05 | 日亜化学工業株式会社 | 半導体発光素子 |
JP2003078162A (ja) * | 2001-08-31 | 2003-03-14 | Shin Etsu Handotai Co Ltd | GaP系半導体発光素子 |
US6744075B2 (en) * | 2001-09-17 | 2004-06-01 | Sanyo Electric Co., Ltd. | Nitride-based semiconductor light-emitting device and method of forming the same |
JP2003168823A (ja) | 2001-09-18 | 2003-06-13 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子 |
US7148520B2 (en) | 2001-10-26 | 2006-12-12 | Lg Electronics Inc. | Diode having vertical structure and method of manufacturing the same |
TW513821B (en) * | 2002-02-01 | 2002-12-11 | Hsiu-Hen Chang | Electrode structure of LED and manufacturing the same |
US8294172B2 (en) * | 2002-04-09 | 2012-10-23 | Lg Electronics Inc. | Method of fabricating vertical devices using a metal support film |
JP4233268B2 (ja) * | 2002-04-23 | 2009-03-04 | シャープ株式会社 | 窒化物系半導体発光素子およびその製造方法 |
US6919585B2 (en) | 2002-05-17 | 2005-07-19 | Lumei Optoelectronics, Inc. | Light-emitting diode with silicon carbide substrate |
US6828596B2 (en) | 2002-06-13 | 2004-12-07 | Lumileds Lighting U.S., Llc | Contacting scheme for large and small area semiconductor light emitting flip chip devices |
US7002180B2 (en) * | 2002-06-28 | 2006-02-21 | Kopin Corporation | Bonding pad for gallium nitride-based light-emitting device |
AU2003276867A1 (en) | 2002-09-19 | 2004-04-08 | Cree, Inc. | Phosphor-coated light emitting diodes including tapered sidewalls, and fabrication methods therefor |
US7141828B2 (en) * | 2003-03-19 | 2006-11-28 | Gelcore, Llc | Flip-chip light emitting diode with a thermally stable multiple layer reflective p-type contact |
US6831302B2 (en) | 2003-04-15 | 2004-12-14 | Luminus Devices, Inc. | Light emitting devices with improved extraction efficiency |
US7122841B2 (en) * | 2003-06-04 | 2006-10-17 | Kopin Corporation | Bonding pad for gallium nitride-based light-emitting devices |
JP2005026395A (ja) * | 2003-07-01 | 2005-01-27 | Toshiba Corp | 半導体発光素子及び半導体発光装置 |
US7009213B2 (en) * | 2003-07-31 | 2006-03-07 | Lumileds Lighting U.S., Llc | Light emitting devices with improved light extraction efficiency |
KR100506741B1 (ko) * | 2003-12-24 | 2005-08-08 | 삼성전기주식회사 | 플립칩용 질화물 반도체 발광소자 및 그 제조방법 |
KR100586943B1 (ko) * | 2003-12-26 | 2006-06-07 | 삼성전기주식회사 | 질화갈륨계 반도체 발광소자의 제조방법 |
US20050236636A1 (en) * | 2004-04-23 | 2005-10-27 | Supernova Optoelectronics Corp. | GaN-based light-emitting diode structure |
US7791061B2 (en) * | 2004-05-18 | 2010-09-07 | Cree, Inc. | External extraction light emitting diode based upon crystallographic faceted surfaces |
WO2005117150A1 (en) * | 2004-05-26 | 2005-12-08 | Showa Denko K.K. | Gallium nitride-based compound semiconductor light emitting device |
US7166483B2 (en) * | 2004-06-17 | 2007-01-23 | Tekcore Co., Ltd. | High brightness light-emitting device and manufacturing process of the light-emitting device |
CN100550441C (zh) * | 2004-06-24 | 2009-10-14 | 昭和电工株式会社 | 反射性正电极和使用其的氮化镓基化合物半导体发光器件 |
KR100533645B1 (ko) | 2004-09-13 | 2005-12-06 | 삼성전기주식회사 | 발광 효율을 개선한 발광 다이오드 |
KR100691177B1 (ko) | 2005-05-31 | 2007-03-09 | 삼성전기주식회사 | 백색 발광소자 |
US9484499B2 (en) * | 2007-04-20 | 2016-11-01 | Cree, Inc. | Transparent ohmic contacts on light emitting diodes with carrier substrates |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2004349301A (ja) * | 2003-05-20 | 2004-12-09 | Sharp Corp | 発光ダイオード素子の電極及び発光ダイオード素子 |
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TW200605401A (en) | 2006-02-01 |
CA2572247A1 (en) | 2006-03-02 |
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US7557380B2 (en) | 2009-07-07 |
EP1771889B1 (en) | 2012-10-24 |
CN101103467B (zh) | 2010-12-08 |
KR101208871B1 (ko) | 2012-12-05 |
US20060022209A1 (en) | 2006-02-02 |
WO2006022873A3 (en) | 2006-06-22 |
US8471269B2 (en) | 2013-06-25 |
JP2008508714A (ja) | 2008-03-21 |
KR20110106475A (ko) | 2011-09-28 |
TWI390757B (zh) | 2013-03-21 |
WO2006022873A2 (en) | 2006-03-02 |
US8669563B2 (en) | 2014-03-11 |
EP2450972B1 (en) | 2014-12-03 |
CN101103467A (zh) | 2008-01-09 |
KR20070043982A (ko) | 2007-04-26 |
US20090250716A1 (en) | 2009-10-08 |
EP2450972A1 (en) | 2012-05-09 |
KR20120009508A (ko) | 2012-01-31 |
US7557379B2 (en) | 2009-07-07 |
US20120080709A1 (en) | 2012-04-05 |
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