JP4789686B2 - マイクロプローブガイドを用いるマイクロプローブユニット及び千鳥配置型マイクロプローブユニット - Google Patents

マイクロプローブガイドを用いるマイクロプローブユニット及び千鳥配置型マイクロプローブユニット Download PDF

Info

Publication number
JP4789686B2
JP4789686B2 JP2006104444A JP2006104444A JP4789686B2 JP 4789686 B2 JP4789686 B2 JP 4789686B2 JP 2006104444 A JP2006104444 A JP 2006104444A JP 2006104444 A JP2006104444 A JP 2006104444A JP 4789686 B2 JP4789686 B2 JP 4789686B2
Authority
JP
Japan
Prior art keywords
microprobe
groove
guide
unit
shaft portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006104444A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007278799A (ja
Inventor
正毅 淵山
努 大貝
ビョン・スーリョン
リー・ジホン
Original Assignee
株式会社ユニオンアロー・テクノロジー
クラット インク
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ユニオンアロー・テクノロジー, クラット インク filed Critical 株式会社ユニオンアロー・テクノロジー
Priority to JP2006104444A priority Critical patent/JP4789686B2/ja
Priority to KR1020070031011A priority patent/KR20070100117A/ko
Priority to TW096111199A priority patent/TW200741211A/zh
Priority to CN2007100958275A priority patent/CN101051056B/zh
Publication of JP2007278799A publication Critical patent/JP2007278799A/ja
Application granted granted Critical
Publication of JP4789686B2 publication Critical patent/JP4789686B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2006104444A 2006-04-05 2006-04-05 マイクロプローブガイドを用いるマイクロプローブユニット及び千鳥配置型マイクロプローブユニット Expired - Fee Related JP4789686B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006104444A JP4789686B2 (ja) 2006-04-05 2006-04-05 マイクロプローブガイドを用いるマイクロプローブユニット及び千鳥配置型マイクロプローブユニット
KR1020070031011A KR20070100117A (ko) 2006-04-05 2007-03-29 마이크로프로브 가이드의 제조 방법, 마이크로프로브가이드를 이용하는 마이크로프로브 유닛 및 지그재그 형상배치형 마이크로프로브 유닛
TW096111199A TW200741211A (en) 2006-04-05 2007-03-30 Manufacturing method of micro probe guide, micro probe unit using micro probe guide and zigzaged arrangement type micro probe unit
CN2007100958275A CN101051056B (zh) 2006-04-05 2007-04-05 微型探针导向装置的制造方法以及微型探针单元

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006104444A JP4789686B2 (ja) 2006-04-05 2006-04-05 マイクロプローブガイドを用いるマイクロプローブユニット及び千鳥配置型マイクロプローブユニット

Publications (2)

Publication Number Publication Date
JP2007278799A JP2007278799A (ja) 2007-10-25
JP4789686B2 true JP4789686B2 (ja) 2011-10-12

Family

ID=38680393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006104444A Expired - Fee Related JP4789686B2 (ja) 2006-04-05 2006-04-05 マイクロプローブガイドを用いるマイクロプローブユニット及び千鳥配置型マイクロプローブユニット

Country Status (4)

Country Link
JP (1) JP4789686B2 (ko)
KR (1) KR20070100117A (ko)
CN (1) CN101051056B (ko)
TW (1) TW200741211A (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100883269B1 (ko) * 2008-02-14 2009-02-10 (주) 루켄테크놀러지스 저가형 엘시디 검사용 일체형 프로브 유니트
CN101526555B (zh) * 2008-03-04 2011-12-07 跃沄科技有限公司 一种制探针的方法
JP5373437B2 (ja) * 2009-03-04 2013-12-18 日本電子材料株式会社 ソケット式プローブカード
KR100972049B1 (ko) * 2009-03-10 2010-07-22 주식회사 프로이천 패널 테스트를 위한 프로브 유닛
JP5417265B2 (ja) * 2010-06-24 2014-02-12 株式会社日本マイクロニクス プローブ組立体
JP5588892B2 (ja) * 2010-12-03 2014-09-10 株式会社日本マイクロニクス プローブ組立体
KR101962644B1 (ko) * 2017-08-23 2019-03-28 리노공업주식회사 검사프로브 및 이를 사용한 검사장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05215814A (ja) * 1991-05-24 1993-08-27 Tokyo Electron Yamanashi Kk 半導体デバイスの検査装置
JPH087235B2 (ja) * 1992-12-01 1996-01-29 日本電子材料株式会社 狭小ピッチ対応型プローブカード
CN1036945C (zh) * 1994-03-15 1998-01-07 吉林大学 共面集成电路芯片微波探针
JP2000340924A (ja) * 1999-05-27 2000-12-08 Nhk Spring Co Ltd 半導体チップ搭載用基板の検査用プローブユニット
JP2003004769A (ja) * 2001-06-22 2003-01-08 Kobe Steel Ltd 接続装置
WO2004049429A1 (en) * 2002-11-22 2004-06-10 Phicom Corporation Probe for testing flat panel display and manufacturing method thereof

Also Published As

Publication number Publication date
KR20070100117A (ko) 2007-10-10
TW200741211A (en) 2007-11-01
JP2007278799A (ja) 2007-10-25
CN101051056A (zh) 2007-10-10
CN101051056B (zh) 2011-05-18

Similar Documents

Publication Publication Date Title
CN102832149B (zh) 使用导向板提升组件机构形成探头的方法
JP4789686B2 (ja) マイクロプローブガイドを用いるマイクロプローブユニット及び千鳥配置型マイクロプローブユニット
US7498827B2 (en) Probe card
JP4786679B2 (ja) プローブカード及びその製造方法
US8723546B2 (en) Vertical guided layered probe
US20100176831A1 (en) Probe Test Card with Flexible Interconnect Structure
TWI227781B (en) Semiconductor-device inspecting apparatus and a method for manufacturing the same
JP4974021B2 (ja) プローブ組立体
JP2002151557A (ja) コンタクタ、プローブカード及びコンタクタの製造方法
JP2007171139A (ja) プローブ保持構造およびバネ型プローブ
KR20020014677A (ko) 프로브 및 프로브 카드와 프로브의 제조 방법
JP2008513801A (ja) 垂直型電気的接触体の製造方法及びこれによる垂直型電気的接触体
KR100670999B1 (ko) 프로브 구조, 프로브 콘택 기판 및 그 제조 방법
WO2010095520A1 (ja) コンタクトプローブおよびプローブユニット
KR100523745B1 (ko) 전자소자 검사용 마이크로 프로브 및 그 제조 방법
JP4936275B2 (ja) 接触子組立体
KR20170085450A (ko) 프로브 가이드판, 그 제조 방법 및 프로브 장치
JP2007127488A (ja) プローブカード
US8115504B2 (en) Microspring array having reduced pitch contact elements
JP2002071719A (ja) プローブカード及びその製造方法
JP2007171138A (ja) プローブ、プローブカード、プローブの製造方法およびプローブ支持基板の製造方法
KR101066551B1 (ko) 프로브 카드 제조에 사용되는 핀 어레이 틀
KR100745108B1 (ko) 프로브 카드의 실리콘 기판
TWI844716B (zh) 用於電子裝置的探針頭及相應的探針卡
JP2005127961A (ja) テスト用基板及びそれを使用したテスト装置

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20080220

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20080220

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090216

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20091015

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20091015

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110228

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110308

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110520

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110628

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110719

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140729

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees