JP4783440B2 - プラズマ処理装置及びプラズマ処理方法 - Google Patents

プラズマ処理装置及びプラズマ処理方法 Download PDF

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Publication number
JP4783440B2
JP4783440B2 JP2009019867A JP2009019867A JP4783440B2 JP 4783440 B2 JP4783440 B2 JP 4783440B2 JP 2009019867 A JP2009019867 A JP 2009019867A JP 2009019867 A JP2009019867 A JP 2009019867A JP 4783440 B2 JP4783440 B2 JP 4783440B2
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Japan
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substrate
tray
support portion
outer peripheral
placement
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Expired - Lifetime
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JP2009019867A
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Japanese (ja)
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JP2009158963A (ja
JP2009158963A5 (enExample
Inventor
尚吾 置田
浩海 朝倉
彰三 渡邉
隆三 宝珍
宏之 鈴木
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2009019867A priority Critical patent/JP4783440B2/ja
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Publication of JP2009158963A5 publication Critical patent/JP2009158963A5/ja
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JP2009019867A 2009-01-30 2009-01-30 プラズマ処理装置及びプラズマ処理方法 Expired - Lifetime JP4783440B2 (ja)

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JP2009019867A JP4783440B2 (ja) 2009-01-30 2009-01-30 プラズマ処理装置及びプラズマ処理方法

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JP2009019867A JP4783440B2 (ja) 2009-01-30 2009-01-30 プラズマ処理装置及びプラズマ処理方法

Related Parent Applications (1)

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JP2005297378A Division JP4361045B2 (ja) 2005-10-12 2005-10-12 プラズマ処理装置及びプラズマ処理方法

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JP2009158963A JP2009158963A (ja) 2009-07-16
JP2009158963A5 JP2009158963A5 (enExample) 2009-08-27
JP4783440B2 true JP4783440B2 (ja) 2011-09-28

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JP2009019867A Expired - Lifetime JP4783440B2 (ja) 2009-01-30 2009-01-30 プラズマ処理装置及びプラズマ処理方法

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102625409B1 (ko) * 2016-05-19 2024-01-16 주성엔지니어링(주) 트레이 및 이를 사용한 기판처리장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335616A (ja) * 1994-06-06 1995-12-22 Hitachi Ltd ウエハ処理装置
JP2000049207A (ja) * 1998-07-28 2000-02-18 Matsushita Electric Ind Co Ltd プラズマ処理方法及び装置
JP3960929B2 (ja) * 2003-02-25 2007-08-15 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP3950806B2 (ja) * 2003-03-05 2007-08-01 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理方法

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JP2009158963A (ja) 2009-07-16

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