JP4782596B2 - プラズマ処理方法 - Google Patents
プラズマ処理方法 Download PDFInfo
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- JP4782596B2 JP4782596B2 JP2006080846A JP2006080846A JP4782596B2 JP 4782596 B2 JP4782596 B2 JP 4782596B2 JP 2006080846 A JP2006080846 A JP 2006080846A JP 2006080846 A JP2006080846 A JP 2006080846A JP 4782596 B2 JP4782596 B2 JP 4782596B2
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- etching
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006080846A JP4782596B2 (ja) | 2006-03-23 | 2006-03-23 | プラズマ処理方法 |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006080846A JP4782596B2 (ja) | 2006-03-23 | 2006-03-23 | プラズマ処理方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010287570A Division JP5259691B2 (ja) | 2010-12-24 | 2010-12-24 | プラズマ処理方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007258440A JP2007258440A (ja) | 2007-10-04 |
| JP2007258440A5 JP2007258440A5 (enExample) | 2009-02-26 |
| JP4782596B2 true JP4782596B2 (ja) | 2011-09-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006080846A Active JP4782596B2 (ja) | 2006-03-23 | 2006-03-23 | プラズマ処理方法 |
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| JP (1) | JP4782596B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008060541A (ja) * | 2006-08-29 | 2008-03-13 | Korea Electronics Telecommun | Gstカルコゲニドパターンを備える相変化メモリ素子の製造方法 |
| JP2010287615A (ja) | 2009-06-09 | 2010-12-24 | Tokyo Electron Ltd | Ge−Sb−Te膜の成膜方法および記憶媒体 |
| JP2015183260A (ja) * | 2014-03-25 | 2015-10-22 | 株式会社日立国際電気 | クリーニング方法、基板処理装置およびプログラム |
| JP5913463B2 (ja) * | 2014-07-16 | 2016-04-27 | 東京エレクトロン株式会社 | Ge−Sb−Te膜の成膜方法 |
| US11355703B2 (en) * | 2020-06-16 | 2022-06-07 | International Business Machines Corporation | Phase change device with interfacing first and second semiconductor layers |
| CN115498105A (zh) * | 2022-10-17 | 2022-12-20 | 北京北方华创微电子装备有限公司 | 阻变存储器的制造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3052321B2 (ja) * | 1989-02-23 | 2000-06-12 | セイコーエプソン株式会社 | 化合物半導体のエッチング方法 |
| JPH02299227A (ja) * | 1989-05-15 | 1990-12-11 | Seiko Epson Corp | 化合物半導体のエッチング方法 |
| JPH0336725A (ja) * | 1989-07-04 | 1991-02-18 | Seiko Epson Corp | 化合物半導体のエッチング方法 |
| JP2004146500A (ja) * | 2002-10-23 | 2004-05-20 | Matsushita Electric Ind Co Ltd | 薄膜の加工方法 |
| US20050040136A1 (en) * | 2003-07-21 | 2005-02-24 | Yao-Sheng Lee | Method for making memory elements |
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- 2006-03-23 JP JP2006080846A patent/JP4782596B2/ja active Active
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| Publication number | Publication date |
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| JP2007258440A (ja) | 2007-10-04 |
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