JP4770319B2 - 蛍光体及び発光装置 - Google Patents
蛍光体及び発光装置 Download PDFInfo
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- JP4770319B2 JP4770319B2 JP2005226055A JP2005226055A JP4770319B2 JP 4770319 B2 JP4770319 B2 JP 4770319B2 JP 2005226055 A JP2005226055 A JP 2005226055A JP 2005226055 A JP2005226055 A JP 2005226055A JP 4770319 B2 JP4770319 B2 JP 4770319B2
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- JP
- Japan
- Prior art keywords
- phosphor
- light
- silicate
- phosphors
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims description 51
- 229910052791 calcium Inorganic materials 0.000 claims description 11
- 229910052712 strontium Inorganic materials 0.000 claims description 11
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 37
- 239000000203 mixture Substances 0.000 description 11
- 238000007789 sealing Methods 0.000 description 11
- -1 oxides Chemical class 0.000 description 10
- 229910052693 Europium Inorganic materials 0.000 description 7
- 239000012298 atmosphere Substances 0.000 description 6
- 239000003086 colorant Substances 0.000 description 6
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 5
- 230000005284 excitation Effects 0.000 description 5
- 229910052761 rare earth metal Inorganic materials 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 229910052788 barium Inorganic materials 0.000 description 4
- 238000000295 emission spectrum Methods 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 229910052747 lanthanoid Inorganic materials 0.000 description 4
- 150000002602 lanthanoids Chemical class 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 229910016036 BaF 2 Inorganic materials 0.000 description 3
- 150000001342 alkaline earth metals Chemical class 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 235000019646 color tone Nutrition 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 229910052748 manganese Inorganic materials 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910052688 Gadolinium Inorganic materials 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- 229910052586 apatite Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000695 excitation spectrum Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VSIIXMUUUJUKCM-UHFFFAOYSA-D pentacalcium;fluoride;triphosphate Chemical compound [F-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O VSIIXMUUUJUKCM-UHFFFAOYSA-D 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910052723 transition metal Inorganic materials 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- PHXNQAYVSHPINV-UHFFFAOYSA-N P.OB(O)O Chemical compound P.OB(O)O PHXNQAYVSHPINV-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical class O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910003668 SrAl Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 150000002601 lanthanoid compounds Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Landscapes
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Description
本発明は、360nmから485nmの領域に発光ピーク波長を有する発光素子と、前記発光素子からの光を吸収して波長変換され、495nmから584nmの領域に発光ピーク波長を有する一般式、Ba5−x−yEuxMySimO5+2m(式中、MはCa及びSrの少なくともいずれか1種である。x、y、mは、0.0001≦x≦0.3、0≦y≦0.8、x+y<5、2.5<m<3.5である)で表される蛍光体と、を有する発光装置に関する。これにより緑色から黄色の輝度を高めた、種々の発光色を実現できる発光装置を提供することができる。特に、黄色や赤色等に発光するものと組み合わせることにより白色に発光する発光装置を提供することができる。
以下、実施の形態に係るシリケート系蛍光体について説明する。
次に、本発明に係るシリケート系蛍光体、Ba3.5Sr1.3Eu0.2Si3O11の製造方法を説明するが、本製造方法に限定されない。
以下、実施の形態に係る発光装置について説明する。図1は、実施の形態に係る発光装置を示す概略断面図である。
実施例1のシリケート系蛍光体は、BaEu0.2Sr3.8Si3O11である。実施例2乃至4のシリケート系蛍光体の組成は表に示す通りである。実施例1乃至4のシリケート系蛍光体はx=0.2、m=3として、yを変更したものである。
これにより緑色から黄色に発光する高輝度のシリケート系蛍光体を得ることができた。
実施例5乃至7のシリケート系蛍光体も実施例1乃至4と同様にx=0.2、m=3として、yを変更したものである。
BaCO3 138.1g
SrCO3 38.4g
SiO2 36.1g
Eu2O3 7.04g
BaF2 0.77g
上記原料を秤量し混合機により乾式で十分に混合する。この混合原料を坩堝に詰め、水素−窒素の還元雰囲気下にて300℃/hrで1200℃まで昇温し、高温部1200℃で3時間焼成する。得られた焼成品を粉砕、分散、篩過することにより目的の蛍光体粉末が得られた。実施例1乃至22も実施例6とほぼ同様の方法で形成されたものである。
実施例8乃至10のシリケート系蛍光体は、実施例2乃至4のシリケート系蛍光体と同様に製造する。
実施例11乃至22のシリケート系蛍光体は、5−x−y=2.5、m=3として、x、yを変更したものである。実施例17のシリケート系蛍光体の組成はBa2.5Eu0.15Sr2.35Si3O11である。
2 蛍光体
3 封止部材
4 リードフレーム
5 モールド封止部材
10 発光装置
Claims (2)
- 一般式
Ba5−x−yEuxMySimO5+2m
(式中、MはCa及びSrの少なくともいずれか1種である。x、y、mは、0.0001≦x≦0.3、0≦y≦0.8、x+y<5、2.5<m<3.5である)
で表されることを特徴とする蛍光体。 - 360nmから485nmの領域に発光ピーク波長を有する発光素子と、前記発光素子からの光を吸収して波長変換され、495nmから584nmの領域に発光ピーク波長を有する一般式、
Ba5−x−yEuxMySimO5+2m
(式中、MはCa及びSrの少なくともいずれか1種である。x、y、mは、0.0001≦x≦0.3、0≦y≦0.8、x+y<5、2.5<m<3.5である)
で表される蛍光体と、を有することを特徴とする発光装置。
Priority Applications (1)
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JP2005226055A JP4770319B2 (ja) | 2005-08-04 | 2005-08-04 | 蛍光体及び発光装置 |
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JP2005226055A JP4770319B2 (ja) | 2005-08-04 | 2005-08-04 | 蛍光体及び発光装置 |
Publications (2)
Publication Number | Publication Date |
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JP2007039571A JP2007039571A (ja) | 2007-02-15 |
JP4770319B2 true JP4770319B2 (ja) | 2011-09-14 |
Family
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JP2005226055A Expired - Fee Related JP4770319B2 (ja) | 2005-08-04 | 2005-08-04 | 蛍光体及び発光装置 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5183128B2 (ja) * | 2007-08-30 | 2013-04-17 | 凸版印刷株式会社 | 液晶表示装置 |
JP5122268B2 (ja) * | 2007-08-30 | 2013-01-16 | 凸版印刷株式会社 | 液晶表示装置およびそれに用いるカラーフィルタ |
JP5079487B2 (ja) * | 2007-12-21 | 2012-11-21 | 凸版印刷株式会社 | 液晶表示装置およびそれに用いるカラーフィルタ |
US8567973B2 (en) | 2008-03-07 | 2013-10-29 | Intematix Corporation | Multiple-chip excitation systems for white light emitting diodes (LEDs) |
JP5557828B2 (ja) * | 2011-12-07 | 2014-07-23 | 三菱電機株式会社 | 発光装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US7462086B2 (en) * | 2004-04-21 | 2008-12-09 | Philips Lumileds Lighting Company, Llc | Phosphor for phosphor-converted semiconductor light emitting device |
WO2006087661A1 (en) * | 2005-02-21 | 2006-08-24 | Philips Intellectual Property & Standards Gmbh | Illumination system comprising a radiation source and a luminescent material |
US7927512B2 (en) * | 2005-08-04 | 2011-04-19 | Nichia Corporation | Phosphor and light emitting device |
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2005
- 2005-08-04 JP JP2005226055A patent/JP4770319B2/ja not_active Expired - Fee Related
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JP2007039571A (ja) | 2007-02-15 |
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