JP4766579B2 - 電気化学堆積装置 - Google Patents

電気化学堆積装置 Download PDF

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Publication number
JP4766579B2
JP4766579B2 JP2000585464A JP2000585464A JP4766579B2 JP 4766579 B2 JP4766579 B2 JP 4766579B2 JP 2000585464 A JP2000585464 A JP 2000585464A JP 2000585464 A JP2000585464 A JP 2000585464A JP 4766579 B2 JP4766579 B2 JP 4766579B2
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JP
Japan
Prior art keywords
wafer
substrate
electrolyte
fluid
anode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000585464A
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English (en)
Japanese (ja)
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JP2003528214A (ja
JP2003528214A5 (enExample
Inventor
イェツディ ドーディ
ドナルド ジェイ オルガド
ラットソン モラド
ピーター ヘイ
マーク デノーム
マイケル シュガーマン
マーク ロイド
ジョー スティーヴンス
ダン マロール
ホー セオン シン
ユージーン ラヴィノヴィッチ
ロビン チェウン
アショック ケイ シンハ
アヴィ テプマン
ダン カール
ジョージ バークマイアー
ベン シェン
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Applied Materials Inc
Original Assignee
Applied Materials Inc
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Filing date
Publication date
Priority claimed from US09/263,649 external-priority patent/US6254760B1/en
Priority claimed from US09/289,074 external-priority patent/US6258220B1/en
Priority claimed from US09/350,210 external-priority patent/US6267853B1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2003528214A publication Critical patent/JP2003528214A/ja
Publication of JP2003528214A5 publication Critical patent/JP2003528214A5/ja
Application granted granted Critical
Publication of JP4766579B2 publication Critical patent/JP4766579B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Weting (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2000585464A 1998-11-30 1999-11-29 電気化学堆積装置 Expired - Fee Related JP4766579B2 (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US11020998P 1998-11-30 1998-11-30
US60/110,209 1998-11-30
US09/263,649 1999-03-05
US09/263,649 US6254760B1 (en) 1999-03-05 1999-03-05 Electro-chemical deposition system and method
US09/289,074 1999-04-08
US09/289,074 US6258220B1 (en) 1998-11-30 1999-04-08 Electro-chemical deposition system
US09/350,210 1999-07-09
US09/350,210 US6267853B1 (en) 1999-07-09 1999-07-09 Electro-chemical deposition system
PCT/US1999/028159 WO2000032835A2 (en) 1998-11-30 1999-11-29 Electro-chemical deposition system

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009214692A Division JP2009293134A (ja) 1998-11-30 2009-09-16 電気化学堆積装置

Publications (3)

Publication Number Publication Date
JP2003528214A JP2003528214A (ja) 2003-09-24
JP2003528214A5 JP2003528214A5 (enExample) 2007-01-25
JP4766579B2 true JP4766579B2 (ja) 2011-09-07

Family

ID=27493736

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2000585464A Expired - Fee Related JP4766579B2 (ja) 1998-11-30 1999-11-29 電気化学堆積装置
JP2009214692A Pending JP2009293134A (ja) 1998-11-30 2009-09-16 電気化学堆積装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2009214692A Pending JP2009293134A (ja) 1998-11-30 2009-09-16 電気化学堆積装置

Country Status (3)

Country Link
JP (2) JP4766579B2 (enExample)
TW (1) TW513751B (enExample)
WO (1) WO2000032835A2 (enExample)

Families Citing this family (64)

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WO2000061498A2 (en) 1999-04-13 2000-10-19 Semitool, Inc. System for electrochemically processing a workpiece
DE69840975D1 (de) 1997-09-02 2009-08-27 Ebara Corp Verfahren und Vorrichtung zum Aufbringen einer Schichten auf einen Körper
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
WO1999054527A2 (en) 1998-04-21 1999-10-28 Applied Materials, Inc. Electro-chemical deposition system and method of electroplating on substrates
US7048841B2 (en) 1998-12-07 2006-05-23 Semitool, Inc. Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
US6497801B1 (en) 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US6303010B1 (en) 1999-07-12 2001-10-16 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
US6773560B2 (en) 1998-07-10 2004-08-10 Semitool, Inc. Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces
WO2000003072A1 (en) 1998-07-10 2000-01-20 Semitool, Inc. Method and apparatus for copper plating using electroless plating and electroplating
US6258220B1 (en) 1998-11-30 2001-07-10 Applied Materials, Inc. Electro-chemical deposition system
US6309520B1 (en) 1998-12-07 2001-10-30 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
US6645356B1 (en) 1998-12-07 2003-11-11 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
WO2000040779A1 (en) 1998-12-31 2000-07-13 Semitool, Inc. Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece
EP1031647A3 (en) * 1999-02-19 2002-03-06 Solid State Equipment Corporation Apparatus and method for plating a wafer
US6837978B1 (en) 1999-04-08 2005-01-04 Applied Materials, Inc. Deposition uniformity control for electroplating apparatus, and associated method
US6582578B1 (en) * 1999-04-08 2003-06-24 Applied Materials, Inc. Method and associated apparatus for tilting a substrate upon entry for metal deposition
US6585876B2 (en) * 1999-04-08 2003-07-01 Applied Materials Inc. Flow diffuser to be used in electro-chemical plating system and method
US6551488B1 (en) * 1999-04-08 2003-04-22 Applied Materials, Inc. Segmenting of processing system into wet and dry areas
US6557237B1 (en) * 1999-04-08 2003-05-06 Applied Materials, Inc. Removable modular cell for electro-chemical plating and method
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7189318B2 (en) 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7160421B2 (en) 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US6558518B1 (en) * 1999-07-08 2003-05-06 Ebara Corporation Method and apparatus for plating substrate and plating facility
JP4149620B2 (ja) * 1999-08-25 2008-09-10 株式会社荏原製作所 基板銅めっき処理方法
US20030213772A9 (en) * 1999-07-09 2003-11-20 Mok Yeuk-Fai Edwin Integrated semiconductor substrate bevel cleaning apparatus and method
US7645366B2 (en) 1999-07-12 2010-01-12 Semitool, Inc. Microelectronic workpiece holders and contact assemblies for use therewith
US6673216B2 (en) 1999-08-31 2004-01-06 Semitool, Inc. Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing
EP1091388A3 (en) * 1999-10-06 2005-09-21 Ebara Corporation Method and apparatus for cleaning a substrate
US6454927B1 (en) * 2000-06-26 2002-09-24 Applied Materials, Inc. Apparatus and method for electro chemical deposition
KR100800531B1 (ko) 2000-06-30 2008-02-04 가부시키가이샤 에바라 세이사꾸쇼 구리 도금액, 도금 방법 및 도금 장치
US6576110B2 (en) 2000-07-07 2003-06-10 Applied Materials, Inc. Coated anode apparatus and associated method
AT412043B (de) * 2000-07-12 2004-08-26 Ind Tech Res Inst Verfahren zum reinigen eines auf der rückseite mit metall verschmutzten wafers
WO2002029137A2 (en) * 2000-10-03 2002-04-11 Applied Materials,Inc. Method and associated apparatus for tilting a substrate upon entry for metal deposition
JP2006339665A (ja) * 2000-10-12 2006-12-14 Ebara Corp 半導体基板製造装置
WO2002031227A2 (en) * 2000-10-12 2002-04-18 Applied Materials, Inc. Deposition uniformity control for electroplating apparatus, and associated method
US6569307B2 (en) * 2000-10-20 2003-05-27 The Boc Group, Inc. Object plating method and system
JP2002212786A (ja) * 2001-01-17 2002-07-31 Ebara Corp 基板処理装置
JP2002220692A (ja) * 2001-01-24 2002-08-09 Ebara Corp めっき装置及び方法
US7189647B2 (en) 2001-04-05 2007-03-13 Novellus Systems, Inc. Sequential station tool for wet processing of semiconductor wafers
WO2003007274A1 (en) * 2001-07-12 2003-01-23 James Hambleton Electro-chemical teaching unit
WO2003018874A2 (en) 2001-08-31 2003-03-06 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7118658B2 (en) 2002-05-21 2006-10-10 Semitool, Inc. Electroplating reactor
US7247222B2 (en) * 2002-07-24 2007-07-24 Applied Materials, Inc. Electrochemical processing cell
JP4303484B2 (ja) 2003-01-21 2009-07-29 大日本スクリーン製造株式会社 メッキ装置
KR100518788B1 (ko) * 2003-03-11 2005-10-05 삼성전자주식회사 감광액 도포 스핀 코팅 장치
JP4872199B2 (ja) * 2004-09-06 2012-02-08 ルネサスエレクトロニクス株式会社 半導体製造装置
KR100854373B1 (ko) 2006-12-29 2008-09-02 주식회사 포스코 산세조 내 염산액 샘플 채취장치
KR101590661B1 (ko) * 2010-09-13 2016-02-01 도쿄엘렉트론가부시키가이샤 액처리 장치, 액처리 방법 및 기억 매체
JP5321574B2 (ja) * 2010-12-17 2013-10-23 ルネサスエレクトロニクス株式会社 半導体製造装置の動作方法及び半導体装置の製造方法
CN105044370B (zh) * 2014-11-04 2017-03-08 长沙绿智电子科技有限公司 一种无人值守的重金属污水监测设备
KR102342006B1 (ko) * 2016-03-04 2021-12-22 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 도금 방법
JP6833557B2 (ja) * 2016-03-04 2021-02-24 株式会社荏原製作所 めっき装置及びめっき方法
GB201701166D0 (en) * 2017-01-24 2017-03-08 Picofluidics Ltd An apparatus for electrochemically processing semiconductor substrates
EP3647467B1 (en) 2017-06-30 2022-04-06 Showa Denko K.K. Anode mounting member of fluorine electrolytic cell, fluorine electrolytic cell, and method for producing fluorine gas
CN111801445B (zh) * 2018-03-13 2022-07-05 株式会社山本镀金试验器 镀层装置以及镀层系统
CN110355025B (zh) * 2019-08-01 2020-11-27 宿迁市创盈知识产权服务有限公司 一种汽车零配件材料纳米改性设备
US11686208B2 (en) 2020-02-06 2023-06-27 Rolls-Royce Corporation Abrasive coating for high-temperature mechanical systems
CN117020926A (zh) * 2023-08-09 2023-11-10 北京晶亦精微科技股份有限公司 一种碳化硅晶圆电化学机械抛光装置

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6410073A (en) * 1987-07-01 1989-01-13 Sanyo Electric Co Decompression device
JPH0222499A (ja) * 1988-07-12 1990-01-25 Yamaha Corp メッキ装置
JPH04293796A (ja) * 1991-03-20 1992-10-19 Electroplating Eng Of Japan Co 自動式ウエーハメッキ装置
JPH05195296A (ja) * 1992-01-22 1993-08-03 Nippon Hyomen Kagaku Kk 電解液の自動管理装置
JPH05214594A (ja) * 1992-01-09 1993-08-24 Nec Corp 金属メッキ装置
JPH06349952A (ja) * 1993-06-14 1994-12-22 Oki Electric Ind Co Ltd 配線形成方法
JPH08158094A (ja) * 1994-11-29 1996-06-18 Nec Corp 噴流式電解メッキ装置及びメッキ方法
WO1997012079A1 (en) * 1995-09-27 1997-04-03 Intel Corporation Flexible continuous cathode contact circuit for electrolytic plating of c4, tab microbumps, and ultra large scale interconnects
JPH10204690A (ja) * 1997-01-24 1998-08-04 Electroplating Eng Of Japan Co 自動ウェーハめっき装置
JPH10242082A (ja) * 1997-02-24 1998-09-11 Internatl Business Mach Corp <Ibm> スルーマスク電気めっきおよび選択的基材除去の方法および材料
WO2000003073A2 (en) * 1998-07-13 2000-01-20 Dj Parker Company, Inc. D/B/A Parker Systems Paced chemical replenishment system

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Publication number Priority date Publication date Assignee Title
JPS6410073U (enExample) * 1987-07-03 1989-01-19
JPH03193899A (ja) * 1989-12-22 1991-08-23 Ebara Yuujiraito Kk 電解液の自動管理方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6410073A (en) * 1987-07-01 1989-01-13 Sanyo Electric Co Decompression device
JPH0222499A (ja) * 1988-07-12 1990-01-25 Yamaha Corp メッキ装置
JPH04293796A (ja) * 1991-03-20 1992-10-19 Electroplating Eng Of Japan Co 自動式ウエーハメッキ装置
JPH05214594A (ja) * 1992-01-09 1993-08-24 Nec Corp 金属メッキ装置
JPH05195296A (ja) * 1992-01-22 1993-08-03 Nippon Hyomen Kagaku Kk 電解液の自動管理装置
JPH06349952A (ja) * 1993-06-14 1994-12-22 Oki Electric Ind Co Ltd 配線形成方法
JPH08158094A (ja) * 1994-11-29 1996-06-18 Nec Corp 噴流式電解メッキ装置及びメッキ方法
WO1997012079A1 (en) * 1995-09-27 1997-04-03 Intel Corporation Flexible continuous cathode contact circuit for electrolytic plating of c4, tab microbumps, and ultra large scale interconnects
JPH10204690A (ja) * 1997-01-24 1998-08-04 Electroplating Eng Of Japan Co 自動ウェーハめっき装置
JPH10242082A (ja) * 1997-02-24 1998-09-11 Internatl Business Mach Corp <Ibm> スルーマスク電気めっきおよび選択的基材除去の方法および材料
WO2000003073A2 (en) * 1998-07-13 2000-01-20 Dj Parker Company, Inc. D/B/A Parker Systems Paced chemical replenishment system

Also Published As

Publication number Publication date
WO2000032835A8 (en) 2000-08-17
TW513751B (en) 2002-12-11
WO2000032835A2 (en) 2000-06-08
JP2003528214A (ja) 2003-09-24
JP2009293134A (ja) 2009-12-17

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