JP4765673B2 - 電子デバイスの製造方法および電子デバイス - Google Patents

電子デバイスの製造方法および電子デバイス Download PDF

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Publication number
JP4765673B2
JP4765673B2 JP2006056341A JP2006056341A JP4765673B2 JP 4765673 B2 JP4765673 B2 JP 4765673B2 JP 2006056341 A JP2006056341 A JP 2006056341A JP 2006056341 A JP2006056341 A JP 2006056341A JP 4765673 B2 JP4765673 B2 JP 4765673B2
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Japan
Prior art keywords
base
electronic component
side pad
component
wire
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Expired - Fee Related
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JP2006056341A
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Japanese (ja)
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JP2007234960A (ja
JP2007234960A5 (OSRAM
Inventor
和彦 下平
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Miyazaki Epson Corp
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Epson Toyocom Corp
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Priority to JP2006056341A priority Critical patent/JP4765673B2/ja
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Publication of JP2007234960A5 publication Critical patent/JP2007234960A5/ja
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    • H10W72/50—
    • H10W70/682—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/07551—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/5434—
    • H10W72/5522—
    • H10W72/59—
    • H10W74/00—

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  • Wire Bonding (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2006056341A 2006-03-02 2006-03-02 電子デバイスの製造方法および電子デバイス Expired - Fee Related JP4765673B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006056341A JP4765673B2 (ja) 2006-03-02 2006-03-02 電子デバイスの製造方法および電子デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006056341A JP4765673B2 (ja) 2006-03-02 2006-03-02 電子デバイスの製造方法および電子デバイス

Publications (3)

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JP2007234960A JP2007234960A (ja) 2007-09-13
JP2007234960A5 JP2007234960A5 (OSRAM) 2009-04-02
JP4765673B2 true JP4765673B2 (ja) 2011-09-07

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JP2006056341A Expired - Fee Related JP4765673B2 (ja) 2006-03-02 2006-03-02 電子デバイスの製造方法および電子デバイス

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JP (1) JP4765673B2 (OSRAM)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010283650A (ja) * 2009-06-05 2010-12-16 Daishinku Corp 圧電発振器
JP7458825B2 (ja) 2020-02-28 2024-04-01 キヤノン株式会社 パッケージおよび半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03183139A (ja) * 1989-12-12 1991-08-09 Nippon Steel Corp ワイヤボンディング方法
JP3154640B2 (ja) * 1995-04-21 2001-04-09 三菱電機株式会社 表面弾性波装置のパッケージ
JPH1022772A (ja) * 1996-06-28 1998-01-23 Kyocera Corp 発振部品
JPH10229100A (ja) * 1997-02-17 1998-08-25 Tokai Rika Co Ltd ワイヤボンディング方法及びプラスティックパッケージの製造方法
JP3972518B2 (ja) * 1999-06-14 2007-09-05 株式会社デンソー ボールボンディング方法および電子部品の接続方法
JP3620451B2 (ja) * 2001-02-06 2005-02-16 セイコーエプソン株式会社 圧電デバイスのパッケージ構造
JP3833136B2 (ja) * 2002-04-10 2006-10-11 株式会社カイジョー 半導体構造およびボンディング方法

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JP2007234960A (ja) 2007-09-13

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