JP4764351B2 - 熱伝導性熱可塑性樹脂組成物 - Google Patents

熱伝導性熱可塑性樹脂組成物 Download PDF

Info

Publication number
JP4764351B2
JP4764351B2 JP2006549538A JP2006549538A JP4764351B2 JP 4764351 B2 JP4764351 B2 JP 4764351B2 JP 2006549538 A JP2006549538 A JP 2006549538A JP 2006549538 A JP2006549538 A JP 2006549538A JP 4764351 B2 JP4764351 B2 JP 4764351B2
Authority
JP
Japan
Prior art keywords
composition
polymer
weight percent
thermoplastic
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006549538A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007517968A (ja
JP2007517968A5 (https=
Inventor
俊一 小林
フレドリクソン ベッキー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2007517968A publication Critical patent/JP2007517968A/ja
Publication of JP2007517968A5 publication Critical patent/JP2007517968A5/ja
Application granted granted Critical
Publication of JP4764351B2 publication Critical patent/JP4764351B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/25Arrangements for cooling characterised by their materials
    • H10W40/251Organics
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/16Halogen-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06Polyamides derived from polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/50Physical properties
    • C08G2261/51Charge transport
    • C08G2261/514Electron transport
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/10Metal compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/13Phenols; Phenolates
    • C08K5/134Phenols containing ester groups
    • C08K5/1345Carboxylic esters of phenolcarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • C08K9/06Ingredients treated with organic substances with silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/12Polymer mixtures characterised by other features containing additives being liquid crystalline or anisotropic in the melt
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04Homopolymers or copolymers of ethene
    • C08L23/08Copolymers of ethene
    • C08L23/0846Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
    • C08L23/0869Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen with unsaturated acids, e.g. [meth]acrylic acid; with unsaturated esters, e.g. [meth]acrylic acid esters
    • C08L23/0884Epoxide-containing esters

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2006549538A 2004-01-12 2005-01-11 熱伝導性熱可塑性樹脂組成物 Expired - Fee Related JP4764351B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US53592904P 2004-01-12 2004-01-12
US60/535,929 2004-01-12
PCT/US2005/000866 WO2005071001A1 (en) 2004-01-12 2005-01-11 Thermally conductive thermoplastic resin compositions

Publications (3)

Publication Number Publication Date
JP2007517968A JP2007517968A (ja) 2007-07-05
JP2007517968A5 JP2007517968A5 (https=) 2011-01-27
JP4764351B2 true JP4764351B2 (ja) 2011-08-31

Family

ID=34806972

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006549538A Expired - Fee Related JP4764351B2 (ja) 2004-01-12 2005-01-11 熱伝導性熱可塑性樹脂組成物

Country Status (5)

Country Link
US (1) US20050176835A1 (https=)
EP (1) EP1704179B1 (https=)
JP (1) JP4764351B2 (https=)
CA (1) CA2552080A1 (https=)
WO (1) WO2005071001A1 (https=)

Families Citing this family (107)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7163421B1 (en) * 2005-06-30 2007-01-16 Amphenol Corporation High speed high density electrical connector
US20090291593A1 (en) 2005-06-30 2009-11-26 Prescott Atkinson High frequency broadside-coupled electrical connector
JP2007070374A (ja) * 2005-09-02 2007-03-22 Omron Corp 高周波用部品
US8007885B2 (en) 2005-09-14 2011-08-30 Georgios Topoulos Light-emitting diode assembly housing comprising poly(cyclohexanedimethanol terephthalate) compositions
DE602006002247D1 (de) * 2006-03-22 2008-09-25 Premix Oy Elektrisch leitfähige Elastomermischung, Methode zu deren Herstellung und Verwendung der Mischung
US7794278B2 (en) * 2007-04-04 2010-09-14 Amphenol Corporation Electrical connector lead frame
US7794240B2 (en) * 2007-04-04 2010-09-14 Amphenol Corporation Electrical connector with complementary conductive elements
US7722401B2 (en) * 2007-04-04 2010-05-25 Amphenol Corporation Differential electrical connector with skew control
US20090152491A1 (en) * 2007-11-16 2009-06-18 E. I. Du Pont De Nemours And Company Thermally conductive resin compositions
US20090130471A1 (en) * 2007-11-16 2009-05-21 E.I. Du Pont De Nemours And Company Thermally conductive plastic resin composition
EP2240980A2 (en) 2008-01-17 2010-10-20 Amphenol Corporation Electrical connector assembly
US8293831B2 (en) * 2008-10-30 2012-10-23 E I Du Pont De Nemours And Company Thermoplastic composition including thermally conductive filler and hyperbranched polyesteramide
CN102356517B (zh) 2009-02-04 2014-08-13 安费诺有限公司 具有改进的偏斜控制的差分电气连接器
EP2456815B1 (en) * 2009-07-24 2014-07-16 Ticona LLC Thermally conductive polymer compositions and articles made therefrom
EP2456814A1 (en) 2009-07-24 2012-05-30 Ticona LLC Thermally conductive thermoplastic resin compositions and related applications
US8550861B2 (en) * 2009-09-09 2013-10-08 Amphenol TCS Compressive contact for high speed electrical connector
CN102714363B (zh) 2009-11-13 2015-11-25 安费诺有限公司 高性能小形状因数的连接器
CN102859805B (zh) 2010-02-24 2016-07-06 安费诺有限公司 高带宽连接器
SG183459A1 (en) * 2010-02-25 2012-09-27 Ticona Llc Thermally conductive and dimensionally stable liquid crystalline polymer composition
WO2011140438A2 (en) 2010-05-07 2011-11-10 Amphenol Corporation High performance cable connector
US8796371B2 (en) * 2010-08-09 2014-08-05 Kabushiki Kaisha Toyota Chuo Kenkyusho Resin composition and electrically insulating part obtained from the same
US20120080640A1 (en) 2010-09-30 2012-04-05 E.I. Du Pont De Nemours And Company Thermally conductive resin composition
US20120153217A1 (en) * 2010-12-20 2012-06-21 E.I.Du Pont De Nemours And Company Thermally conductive polymeric resin composition
US8491313B2 (en) 2011-02-02 2013-07-23 Amphenol Corporation Mezzanine connector
US8741998B2 (en) 2011-02-25 2014-06-03 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof
US8552101B2 (en) 2011-02-25 2013-10-08 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
EP2500577B1 (de) * 2011-03-12 2016-06-22 Grundfos Management a/s Heizungsumwälzpumpe
US9453119B2 (en) 2011-04-14 2016-09-27 Ticona Llc Polymer composition for producing articles with light reflective properties
US9284448B2 (en) 2011-04-14 2016-03-15 Ticona Llc Molded reflectors for light-emitting diode assemblies
US9062198B2 (en) 2011-04-14 2015-06-23 Ticona Llc Reflectors for light-emitting diode assemblies containing a white pigment
US8915617B2 (en) * 2011-10-14 2014-12-23 Ovation Polymer Technology And Engineered Materials, Inc. Thermally conductive thermoplastic for light emitting diode fixture assembly
WO2013059317A1 (en) 2011-10-17 2013-04-25 Amphenol Corporation Electrical connector with hybrid shield
US9187621B2 (en) 2011-12-30 2015-11-17 Ticona Llc Reflector for light-emitting devices
CN108336593B (zh) 2012-06-29 2019-12-17 安费诺有限公司 低成本高性能的射频连接器
CN104704682B (zh) 2012-08-22 2017-03-22 安费诺有限公司 高频电连接器
KR102246137B1 (ko) 2012-10-16 2021-04-28 티코나 엘엘씨 대전방지성 액체 결정질 중합체 조성물
US9355753B2 (en) 2012-12-05 2016-05-31 Ticona Llc Conductive liquid crystalline polymer composition
WO2014099745A1 (en) 2012-12-18 2014-06-26 Ticona Llc Molded reflectors for light-emitting diode assemblies
US9227347B2 (en) 2013-02-25 2016-01-05 Sabic Global Technologies B.V. Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly
WO2014143177A1 (en) 2013-03-13 2014-09-18 Ticona Llc Antistatic liquid crystalline polymer composition
CN105191003B (zh) 2013-03-13 2017-12-08 安费诺有限公司 用于高速电连接器的壳体
US9484674B2 (en) 2013-03-14 2016-11-01 Amphenol Corporation Differential electrical connector with improved skew control
JP6438271B2 (ja) * 2013-10-24 2018-12-12 三菱エンジニアリングプラスチックス株式会社 熱可塑性ポリエステル樹脂組成物
CN121367083A (zh) 2014-01-22 2026-01-20 安费诺有限公司 电连接器、子组件、模块、线缆组件、电气组件及电路板
KR102366736B1 (ko) 2014-04-09 2022-02-23 티코나 엘엘씨 카메라 모듈
WO2015157051A1 (en) 2014-04-09 2015-10-15 Ticona Llc Antistatic polymer composition
US9685736B2 (en) 2014-11-12 2017-06-20 Amphenol Corporation Very high speed, high density electrical interconnection system with impedance control in mating region
CN104497567B (zh) * 2014-12-05 2017-12-05 中国科学院化学研究所 长碳链尼龙/硅酸钙晶须复合材料及其制备方法和应用
FR3034775B1 (fr) 2015-04-13 2018-09-28 Hutchinson Materiau pour le stockage thermique
FR3034771B1 (fr) 2015-04-13 2019-04-19 Hutchinson Materiaux conducteurs thermiques et/ou electriques et leur procede de preparation
US10541482B2 (en) 2015-07-07 2020-01-21 Amphenol Fci Asia Pte. Ltd. Electrical connector with cavity between terminals
TWI793945B (zh) 2015-07-23 2023-02-21 美商安芬諾Tcs公司 連接器、製造連接器方法、用於連接器的擴充器模組以及電子系統
CN109565137A (zh) 2016-05-31 2019-04-02 安费诺有限公司 高性能线缆终端装置
US10651603B2 (en) 2016-06-01 2020-05-12 Amphenol Fci Connectors Singapore Pte. Ltd. High speed electrical connector
TWI790798B (zh) 2016-08-23 2023-01-21 美商安芬諾股份有限公司 可配置為高性能的連接器
CN115189162B (zh) 2016-10-19 2026-02-03 安费诺有限公司 用于安装接口的组件、电连接器、电子系统和印刷电路板
JP7222917B2 (ja) * 2017-05-05 2023-02-15 ティコナ・エルエルシー 耐化学薬品性であるポリオキシメチレンポリマー組成物
WO2019028373A1 (en) 2017-08-03 2019-02-07 Amphenol Corporation CABLE CONNECTOR FOR HIGH SPEED INTERCONNECTIONS
CN111512499B (zh) 2017-10-30 2022-03-08 安费诺富加宜(亚洲)私人有限公司 低串扰卡缘连接器
US10601181B2 (en) 2017-12-01 2020-03-24 Amphenol East Asia Ltd. Compact electrical connector
WO2019112847A1 (en) 2017-12-05 2019-06-13 Ticona Llc Aromatic polymer composition for use in a camera module
US10777921B2 (en) 2017-12-06 2020-09-15 Amphenol East Asia Ltd. High speed card edge connector
CN111741841B (zh) * 2018-02-20 2023-05-30 提克纳有限责任公司 导热聚合物组合物
US10665973B2 (en) 2018-03-22 2020-05-26 Amphenol Corporation High density electrical connector
WO2019195319A1 (en) 2018-04-02 2019-10-10 Ardent Concepts, Inc. Controlled-impedance compliant cable termination
CN208862209U (zh) 2018-09-26 2019-05-14 安费诺东亚电子科技(深圳)有限公司 一种连接器及其应用的pcb板
WO2020073460A1 (en) 2018-10-09 2020-04-16 Amphenol Commercial Products (Chengdu) Co. Ltd. High-density edge connector
TWM576774U (zh) 2018-11-15 2019-04-11 香港商安費諾(東亞)有限公司 具有防位移結構之金屬殼體及其連接器
US10931062B2 (en) 2018-11-21 2021-02-23 Amphenol Corporation High-frequency electrical connector
US11381015B2 (en) 2018-12-21 2022-07-05 Amphenol East Asia Ltd. Robust, miniaturized card edge connector
CN117175250A (zh) 2019-01-25 2023-12-05 富加宜(美国)有限责任公司 被配置用于线缆连接到中板的i/o连接器
WO2020154507A1 (en) 2019-01-25 2020-07-30 Fci Usa Llc I/o connector configured for cable connection to a midboard
JP2020125412A (ja) * 2019-02-05 2020-08-20 帝人株式会社 熱可塑性ポリエステル樹脂組成物およびその成形品
US11189971B2 (en) 2019-02-14 2021-11-30 Amphenol East Asia Ltd. Robust, high-frequency electrical connector
CN120767627A (zh) 2019-02-19 2025-10-10 安费诺有限公司 电连接器、用于电连接器的组件和电子系统
US11437762B2 (en) 2019-02-22 2022-09-06 Amphenol Corporation High performance cable connector assembly
WO2020190569A1 (en) 2019-03-20 2020-09-24 Ticona Llc Polymer composition for use in a camera module
JP7461959B2 (ja) 2019-03-20 2024-04-04 ティコナ・エルエルシー カメラモジュールのためのアクチュエータアセンブリ
TWM582251U (zh) 2019-04-22 2019-08-11 香港商安費諾(東亞)有限公司 Connector set with built-in locking mechanism and socket connector thereof
TWI855075B (zh) 2019-05-20 2024-09-11 美商安芬諾股份有限公司 連接器模組、連接器、電子組件、電連接器以及連接器模組的薄片
CN114788097A (zh) 2019-09-19 2022-07-22 安费诺有限公司 具有中间板线缆连接器的高速电子系统
US11588277B2 (en) 2019-11-06 2023-02-21 Amphenol East Asia Ltd. High-frequency electrical connector with lossy member
TWI895292B (zh) 2019-11-06 2025-09-01 香港商安費諾(東亞)有限公司 具有互鎖段之高頻率電連接器及製造其之方法
TW202534957A (zh) 2020-01-27 2025-09-01 美商Fci美國有限責任公司 高速及高密度之直接耦合垂直式連接器
TWI906252B (zh) 2020-01-27 2025-12-01 美商Fci美國有限責任公司 電連接器及其製造與操作方法、用於電連接器之子總成、包含電連接器的電子總成、纜線連接器、用於纜線連接器之子總成及連接器總成
CN113258325A (zh) 2020-01-28 2021-08-13 富加宜(美国)有限责任公司 高频中板连接器
EP4110885A4 (en) 2020-02-26 2024-04-24 Ticona LLC ELECTRONIC DEVICE
WO2021173412A1 (en) 2020-02-26 2021-09-02 Ticona Llc Circuit structure
EP4110610A4 (en) 2020-02-26 2024-03-27 Ticona LLC Polymer composition for an electronic device
WO2021173408A1 (en) 2020-02-26 2021-09-02 Ticona Llc Electronic device
US11637391B2 (en) 2020-03-13 2023-04-25 Amphenol Commercial Products (Chengdu) Co., Ltd. Card edge connector with strength member, and circuit board assembly
US11728585B2 (en) 2020-06-17 2023-08-15 Amphenol East Asia Ltd. Compact electrical connector with shell bounding spaces for receiving mating protrusions
TWI861425B (zh) 2020-07-28 2024-11-11 香港商安費諾(東亞)有限公司 電連接器及將插頭連接器與插座連接器配合之方法
US11728065B2 (en) 2020-07-28 2023-08-15 Ticona Llc Molded interconnect device
US11652307B2 (en) 2020-08-20 2023-05-16 Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd. High speed connector
CN212874843U (zh) 2020-08-31 2021-04-02 安费诺商用电子产品(成都)有限公司 电连接器
CN215816516U (zh) 2020-09-22 2022-02-11 安费诺商用电子产品(成都)有限公司 电连接器
CN213636403U (zh) 2020-09-25 2021-07-06 安费诺商用电子产品(成都)有限公司 电连接器
US11569613B2 (en) 2021-04-19 2023-01-31 Amphenol East Asia Ltd. Electrical connector having symmetrical docking holes
US12176650B2 (en) 2021-05-05 2024-12-24 Amphenol East Asia Limited (Hong Kong) Electrical connector with guiding structure and mating groove and method of connecting electrical connector
US12209163B2 (en) 2021-05-06 2025-01-28 Ticona Llc Polymer composition for use in a camera module
CN215266741U (zh) 2021-08-13 2021-12-21 安费诺商用电子产品(成都)有限公司 一种满足高带宽传输的高性能卡类连接器
USD1002553S1 (en) 2021-11-03 2023-10-24 Amphenol Corporation Gasket for connector
EP4441848A4 (en) 2021-12-01 2025-10-22 Ticona Llc ANTENNA MODULE
TW202340697A (zh) 2021-12-13 2023-10-16 美商堤康那責任有限公司 樣品之滾珠凹部性質之測試技術
USD1068685S1 (en) 2021-12-14 2025-04-01 Amphenol Corporation Electrical connector
USD1067191S1 (en) 2021-12-14 2025-03-18 Amphenol Corporation Electrical connector

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172056A (ja) * 1986-01-23 1987-07-29 Toray Ind Inc ポリフエニレンスルフイド組成物
JPH1053654A (ja) * 1996-08-09 1998-02-24 Polyplastics Co 射出成形体
JPH10279800A (ja) * 1997-03-31 1998-10-20 Toray Ind Inc ポリフェニレンスルフィド樹脂組成物
JP2002188007A (ja) * 2000-12-21 2002-07-05 Hitachi Metals Ltd 複合材料及び回路基板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PH15509A (en) * 1974-05-10 1983-02-03 Du Pont Improvements in an relating to synthetic polyesters
JPS61501270A (ja) * 1984-02-24 1986-06-26 イ−・アイ・デユポン・デ・ニモアス・アンド・カンパニ− 強化熱可塑性ポリエステル組成物
JP2871752B2 (ja) * 1989-10-27 1999-03-17 三井化学株式会社 転がり軸受用保持器
EP0944098B1 (en) * 1998-03-19 2005-06-01 Hitachi, Ltd. Thermally conductive electrical insulating composition
US6808804B2 (en) * 2000-08-18 2004-10-26 Teijin Chemicals, Ltd. Sheet-form layered structure with attractive appearance and utilization thereof
CA2414925A1 (en) * 2001-04-19 2003-01-10 Toray Industries, Inc. White laminated polyester film and thermal transfer recording receiving sheet using the same
JP2003040619A (ja) * 2001-07-27 2003-02-13 Hitachi Metals Ltd CaF2粉末の表面処理方法、樹脂複合材料及びそれを用いた構成部材
US6986864B2 (en) * 2002-04-30 2006-01-17 David Scott Porter Polyester compositions

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172056A (ja) * 1986-01-23 1987-07-29 Toray Ind Inc ポリフエニレンスルフイド組成物
JPH1053654A (ja) * 1996-08-09 1998-02-24 Polyplastics Co 射出成形体
JPH10279800A (ja) * 1997-03-31 1998-10-20 Toray Ind Inc ポリフェニレンスルフィド樹脂組成物
JP2002188007A (ja) * 2000-12-21 2002-07-05 Hitachi Metals Ltd 複合材料及び回路基板

Also Published As

Publication number Publication date
JP2007517968A (ja) 2007-07-05
WO2005071001A1 (en) 2005-08-04
CA2552080A1 (en) 2005-08-04
US20050176835A1 (en) 2005-08-11
EP1704179B1 (en) 2011-12-28
EP1704179A1 (en) 2006-09-27

Similar Documents

Publication Publication Date Title
JP4764351B2 (ja) 熱伝導性熱可塑性樹脂組成物
US9090751B2 (en) Thermally conductive thermoplastic resin compositions and related applications
JP5547644B2 (ja) 熱伝導性樹脂組成物
JP5264924B2 (ja) 熱伝導性プラスチック樹脂組成物
JP5085927B2 (ja) 難燃性樹脂組成物
CN102612540A (zh) 聚对苯二甲酸丁二醇酯树脂组合物
JP2009506191A (ja) 高流動性ポリエステル組成物
CN102482450B (zh) 导热性聚合物组合物和由其制得的制品
CN103492485A (zh) 嵌入成型品
CN1798807A (zh) 聚亚芳基硫醚树脂组合物和涂覆成型品
JPH0948876A (ja) 熱可塑性樹脂組成物
JP2013540183A (ja) 熱伝導性樹脂組成物
US20060142422A1 (en) Hydrolysis resistant polyester compositions and articles made therefrom
CN111961341B (zh) 一种复合材料及其制备方法、固定架及墙壁开关
JPH0627246B2 (ja) 難燃性芳香族ポリエステル樹脂組成物
EP3519501B1 (en) Polymer composition comprising poly(butylene terephthalate).
JPH09235454A (ja) ポリカーボネート系樹脂組成物
JPH07278417A (ja) ポリエステル樹脂組成物及びその製造法
JPH0737558B2 (ja) ポリエステル組成物
CN1173516A (zh) 聚酯树脂组合物

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071011

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071011

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100831

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100903

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20101201

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110128

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110411

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110603

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110610

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140617

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees