JP4762959B2 - 半導体チップおよび半導体装置 - Google Patents

半導体チップおよび半導体装置 Download PDF

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Publication number
JP4762959B2
JP4762959B2 JP2007227579A JP2007227579A JP4762959B2 JP 4762959 B2 JP4762959 B2 JP 4762959B2 JP 2007227579 A JP2007227579 A JP 2007227579A JP 2007227579 A JP2007227579 A JP 2007227579A JP 4762959 B2 JP4762959 B2 JP 4762959B2
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Japan
Prior art keywords
protective film
film forming
forming layer
sheet
semiconductor chip
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Expired - Lifetime
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JP2007227579A
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English (en)
Japanese (ja)
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JP2008072108A5 (https=
JP2008072108A (ja
Inventor
秀男 妹尾
貴志 杉野
修 山崎
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Lintec Corp
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Lintec Corp
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Priority to JP2007227579A priority Critical patent/JP4762959B2/ja
Publication of JP2008072108A publication Critical patent/JP2008072108A/ja
Publication of JP2008072108A5 publication Critical patent/JP2008072108A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

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  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2007227579A 2007-09-03 2007-09-03 半導体チップおよび半導体装置 Expired - Lifetime JP4762959B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007227579A JP4762959B2 (ja) 2007-09-03 2007-09-03 半導体チップおよび半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007227579A JP4762959B2 (ja) 2007-09-03 2007-09-03 半導体チップおよび半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004054354A Division JP4271597B2 (ja) 2004-02-27 2004-02-27 チップ用保護膜形成用シート

Publications (3)

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JP2008072108A JP2008072108A (ja) 2008-03-27
JP2008072108A5 JP2008072108A5 (https=) 2008-05-15
JP4762959B2 true JP4762959B2 (ja) 2011-08-31

Family

ID=39293378

Family Applications (1)

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JP2007227579A Expired - Lifetime JP4762959B2 (ja) 2007-09-03 2007-09-03 半導体チップおよび半導体装置

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JP (1) JP4762959B2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160129757A (ko) 2015-04-30 2016-11-09 닛토덴코 가부시키가이샤 일체형 필름, 필름, 반도체 장치의 제조 방법 및 보호 칩의 제조 방법
KR20160129756A (ko) 2015-04-30 2016-11-09 닛토덴코 가부시키가이샤 이면 보호 필름, 필름, 반도체 장치의 제조 방법 및 보호 칩의 제조 방법

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5153597B2 (ja) * 2008-12-05 2013-02-27 リンテック株式会社 チップ用保護膜形成用シートおよび保護膜付半導体チップ
JP5893250B2 (ja) * 2011-01-31 2016-03-23 リンテック株式会社 チップ用保護膜形成用シート、半導体チップの製造方法および半導体装置
JP2014165200A (ja) * 2013-02-21 2014-09-08 Shin Etsu Chem Co Ltd 半導体チップの製造方法
WO2014155756A1 (ja) * 2013-03-26 2014-10-02 リンテック株式会社 粘着シートおよび保護膜形成用複合シートならびに保護膜付きチップの製造方法
JP6220644B2 (ja) * 2013-11-18 2017-10-25 リンテック株式会社 チップの製造方法
JP6085288B2 (ja) * 2014-12-24 2017-02-22 リンテック株式会社 保護膜形成用フィルムおよび半導体チップの製造方法
JP2016021768A (ja) * 2015-09-09 2016-02-04 日本電波工業株式会社 圧電デバイスとその製造方法
JP7071916B2 (ja) * 2016-04-28 2022-05-19 リンテック株式会社 保護膜付き半導体チップの製造方法及び半導体装置の製造方法
CN114144865B (zh) * 2019-08-02 2026-01-23 东京毅力科创株式会社 基板处理方法和基板处理装置
JP2024078062A (ja) * 2022-11-29 2024-06-10 株式会社レゾナック 接着剤フィルム、接着剤テープ、剥離フィルム付き接着剤テープ、半導体装置の製造方法及び半導体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3483161B2 (ja) * 1994-08-11 2004-01-06 リンテック株式会社 粘接着テープおよびその使用方法
JP3506519B2 (ja) * 1995-03-06 2004-03-15 リンテック株式会社 粘接着テープおよびその使用方法
JPH1187282A (ja) * 1997-09-02 1999-03-30 Hitachi Chem Co Ltd 半導体ウェハデバイス面保護用フィルム及びこれを用いた半導体ウェハ裏面研磨処理方法
JP3756689B2 (ja) * 1999-02-08 2006-03-15 沖電気工業株式会社 半導体装置及びその製造方法
JP3339472B2 (ja) * 1999-08-24 2002-10-28 セイコーエプソン株式会社 半導体装置及びその製造方法
JP3544362B2 (ja) * 2001-03-21 2004-07-21 リンテック株式会社 半導体チップの製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160129757A (ko) 2015-04-30 2016-11-09 닛토덴코 가부시키가이샤 일체형 필름, 필름, 반도체 장치의 제조 방법 및 보호 칩의 제조 방법
KR20160129756A (ko) 2015-04-30 2016-11-09 닛토덴코 가부시키가이샤 이면 보호 필름, 필름, 반도체 장치의 제조 방법 및 보호 칩의 제조 방법

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