JP4760222B2 - 弾性表面波デバイス - Google Patents

弾性表面波デバイス Download PDF

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Publication number
JP4760222B2
JP4760222B2 JP2005245357A JP2005245357A JP4760222B2 JP 4760222 B2 JP4760222 B2 JP 4760222B2 JP 2005245357 A JP2005245357 A JP 2005245357A JP 2005245357 A JP2005245357 A JP 2005245357A JP 4760222 B2 JP4760222 B2 JP 4760222B2
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JP
Japan
Prior art keywords
acoustic wave
surface acoustic
thin film
film surface
electrode
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Expired - Fee Related
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JP2005245357A
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English (en)
Japanese (ja)
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JP2007060465A (ja
JP2007060465A5 (enExample
Inventor
誠 古畑
有継 矢島
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2005245357A priority Critical patent/JP4760222B2/ja
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Publication of JP2007060465A5 publication Critical patent/JP2007060465A5/ja
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Publication of JP4760222B2 publication Critical patent/JP4760222B2/ja
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  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2005245357A 2005-08-26 2005-08-26 弾性表面波デバイス Expired - Fee Related JP4760222B2 (ja)

Priority Applications (1)

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JP2005245357A JP4760222B2 (ja) 2005-08-26 2005-08-26 弾性表面波デバイス

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JP2005245357A JP4760222B2 (ja) 2005-08-26 2005-08-26 弾性表面波デバイス

Publications (3)

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JP2007060465A JP2007060465A (ja) 2007-03-08
JP2007060465A5 JP2007060465A5 (enExample) 2008-10-09
JP4760222B2 true JP4760222B2 (ja) 2011-08-31

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JP2005245357A Expired - Fee Related JP4760222B2 (ja) 2005-08-26 2005-08-26 弾性表面波デバイス

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JP (1) JP4760222B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12290000B2 (en) 2020-10-29 2025-04-29 Taiyo Yuden Co., Ltd. Acoustic wave device and communication module

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008016613B4 (de) * 2008-04-01 2010-04-15 Epcos Ag Verfahren zur Herstellung eines elektrischen Bauelements mit mindestens einer dielektrischen Schicht und ein elektrisches Bauelement mit mindestens einer dielektrischen Schicht
JP4638530B2 (ja) * 2008-08-19 2011-02-23 日本電波工業株式会社 圧電部品及びその製造方法
JP5327378B2 (ja) 2010-02-17 2013-10-30 株式会社村田製作所 弾性波デバイス
CN102111116A (zh) * 2010-11-24 2011-06-29 张�浩 整合的晶圆级别封装体
JP5472557B1 (ja) * 2012-07-26 2014-04-16 株式会社村田製作所 複合電子部品及びそれを備える電子装置
WO2014034326A1 (ja) * 2012-08-29 2014-03-06 株式会社村田製作所 弾性波装置
DE102013102206B4 (de) 2013-03-06 2016-04-07 Epcos Ag Bauelement mit gestapelten funktionalen Strukturen und Verfahren zur Herstellung
DE112014006039B4 (de) 2013-12-27 2022-08-25 Murata Manufacturing Co., Ltd. Vorrichtung für elastische Wellen und Herstellungsverfahren dafür
WO2016060072A1 (ja) 2014-10-17 2016-04-21 株式会社村田製作所 圧電デバイス、圧電デバイスの製造方法
DE102015102869B4 (de) * 2015-02-27 2017-05-11 Snaptrack, Inc. MEMS-Bauelement mit hoher Integrationsdichte und Verfahren zu seiner Herstellung
JP6534366B2 (ja) 2016-06-07 2019-06-26 太陽誘電株式会社 弾性波デバイス
CN110114975B (zh) 2016-12-26 2023-02-24 株式会社村田制作所 弹性波装置、高频前端模块以及通信装置
JP7231368B2 (ja) * 2018-09-26 2023-03-01 太陽誘電株式会社 弾性波デバイス
JP7373301B2 (ja) * 2019-05-08 2023-11-02 太陽誘電株式会社 弾性波デバイス、フィルタおよびマルチプレクサ
CN111082190B (zh) * 2019-11-15 2022-07-19 天津大学 一种双工器
CN115336174B (zh) 2020-03-30 2025-12-09 株式会社村田制作所 电子部件
CN111786647B (zh) * 2020-08-07 2021-06-15 展讯通信（上海）有限公司 晶圆级声表面波滤波器与封装方法
US12316304B2 (en) * 2022-12-21 2025-05-27 Rf360 Singapore Pte. Ltd. Vertically coupled SAW resonators

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58121421U (ja) * 1982-02-10 1983-08-18 昭和電線電纜株式会社 一方向性弾性表面波装置
JP4467154B2 (ja) * 2000-07-31 2010-05-26 京セラ株式会社 弾性表面波装置
JP2003063893A (ja) * 2001-06-15 2003-03-05 Murata Mfg Co Ltd ＺｎＯ／サファイア基板及びその製造方法
EP1804376B1 (en) * 2004-07-20 2009-04-01 Murata Manufacturing Co., Ltd. Piezoelectric filter

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12290000B2 (en) 2020-10-29 2025-04-29 Taiyo Yuden Co., Ltd. Acoustic wave device and communication module

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Publication number Publication date
JP2007060465A (ja) 2007-03-08

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