JP4758818B2 - フレキシブルディスプレイ製造用フィルムトレイ - Google Patents
フレキシブルディスプレイ製造用フィルムトレイ Download PDFInfo
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- JP4758818B2 JP4758818B2 JP2006126660A JP2006126660A JP4758818B2 JP 4758818 B2 JP4758818 B2 JP 4758818B2 JP 2006126660 A JP2006126660 A JP 2006126660A JP 2006126660 A JP2006126660 A JP 2006126660A JP 4758818 B2 JP4758818 B2 JP 4758818B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 62
- 239000000758 substrate Substances 0.000 claims description 88
- 238000000034 method Methods 0.000 claims description 29
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 230000001154 acute effect Effects 0.000 claims 2
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000002990 reinforced plastic Substances 0.000 claims 1
- 239000004753 textile Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 225
- 239000010410 layer Substances 0.000 description 45
- 239000010409 thin film Substances 0.000 description 30
- 238000000151 deposition Methods 0.000 description 11
- 230000008021 deposition Effects 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000007665 sagging Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000013585 weight reducing agent Substances 0.000 description 6
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000005525 hole transport Effects 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000011358 absorbing material Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000000427 thin-film deposition Methods 0.000 description 2
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Packaging Frangible Articles (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
このように、フィルムトレイ100に固定されたフレキシブルフィルム210は、所定のテンションが維持されるように固定されているので、フレキシブルフィルム210上に薄膜を蒸着する工程が進行されたり移送がなされる際にも、その模様が変形されない。これによって、正確な位置に成膜してパターニングすることが可能であり、薄膜が同一の特性を持つように、全体の成膜領域内に薄膜を均一に形成することができる。また、フレキシブルフィルム210を容易に移送することができる。
この後、ドナーフィルム950をアクセプター基板910から引き離せば、転写層950cの中でレーザーを照射された部分が正孔輸送層940上に付き、ドナーフィルム950から分離する(図9c)。
ここで、図8bに図示されたフレキシブルディスプレイ用フィルムトレイを利用してドナーフィルム950を製造する場合、ベース基板950aがフレキシブルであっても、ベース基板950aを水平に維持した状態で光熱変換層950b及び転写層950cを形成することができる。これによって、ベース基板950a上の正確な位置に光熱変換層950bと転写層950cを均一に形成することができる。
110、410、510、810 支持板、
120、420、520、820 クランプ、
120a、520a、820a クランプの開閉部、
120b、520b、820b クランプの支持部、
210、560、830、1200 フレキシブルフィルム、
540 前面支持部、
835 ドナーフィルムのベース基板。
Claims (7)
- 中央部に開口部が形成された支持板と、
前記支持板の縁部にお互いに対称となるように設置されて、フレキシブル基板またはフレキシブルフィルムを固定するための少なくとも2つ以上のクランプを具備し、
前記クランプは、
前記フレキシブル基板またはフレキシブルフィルムを固定するために開閉可能に設置された開閉部と、
前記開閉部から所定の離隔空間を置いて設置されて、前記開閉部が閉鎖される場合に、前記フレキシブル基板またはフレキシブルフィルムを固定して前記支持板から所定高さで支持するための支持部と、
前記支持板の一側端部に形成された前記クランプの開閉部から、前記支持部上に伸長されるように形成されて、前記フレキシブル基板またはフレキシブルフィルムを前記支持部の上面に固定する前面支持部と、を具備し、
前記開閉部の前記フレキシブル基板またはフレキシブルフィルムと接する内側面には、前記フレキシブル基板またはフレキシブルフィルムを固定するための段差が、前記支持板との間に前記フレキシブル基板またはフレキシブルフィルムを挟みつつ前記支持部へ向かって突出して鋭角に形成されて、
前記支持部の前記フレキシブル基板またはフレキシブルフィルムと接する外側面は、前記開閉部の内側面に形成された段差と前記フレキシブル基板またはフレキシブルフィルムを介して嵌合可能な形状であることを特徴とするフレキシブルディスプレイ製造用フィルムトレイ。 - 前記支持板、前記クランプ及び前記前面支持部の中の少なくとも一つには、溝またはホールが形成されることを特徴とする請求項1に記載のフレキシブルディスプレイ製造用フィルムトレイ。
- 前記支持板は、10mmないし50mmの厚さを持つことを特徴とする請求項1または2に記載のフレキシブルディスプレイ製造用フィルムトレイ。
- 前記支持板及びクランプの中の少なくとも一つは、アルミニウムなどの軽金属と炭素纎維強化プラスチックなどの合成樹脂の中の少なくとも一つで形成されたことを特徴とする請求項1〜3のいずれか1項に記載のフレキシブルディスプレイ製造用フィルムトレイ。
- 前記支持板及びクランプの中の少なくとも一つは、アルミニウムとスチール系列を異種接合して形成されたことを特徴とする請求項1〜4のいずれか1項に記載のフレキシブルディスプレイ製造用フィルムトレイ。
- ドナーフィルムを利用したレーザー転写法によって発光層を形成する有機発光ダイオードの製造方法において、
請求項1〜5のいずれか1項に記載したフレキシブルディスプレイ製造用フィルムトレイを利用してドナーフィルムを製造し、または発光層を形成することを特徴とする有機発光ダイオードの製造方法。 - フレキシブル基板またはフレキシブルフィルムを固定するためのフィルムトレイに具備されるクランプであって、
前記フレキシブル基板またはフレキシブルフィルムを固定するために開閉可能に設置された開閉部と、
前記開閉部から所定の離隔空間を置いて設置されて、前記開閉部が閉鎖される場合に、前記フレキシブル基板またはフレキシブルフィルムを固定して前記クランプが設置される支持板から所定高さに支持するための支持部と、
前記クランプの開閉部から、前記支持部上に伸長されるように形成されて、前記フレキシブル基板またはフレキシブルフィルムを前記支持部の上面に固定する前面支持部と、を具備し、
前記開閉部の前記フレキシブル基板またはフレキシブルフィルムと接する内側面には、前記フレキシブル基板またはフレキシブルフィルムを固定するための段差が、前記クランプが設置されて中央部に開口部が形成された支持板との間に前記フレキシブル基板またはフレキシブルフィルムを挟みつつ前記支持部へ向かって突出して鋭角に形成されて、
前記支持部の前記フレキシブル基板またはフレキシブルフィルムと接する外側面は、前記開閉部の内側面に形成された段差と前記フレキシブル基板またはフレキシブルフィルムを介して嵌合可能な形状であることを特徴とするクランプ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050080995A KR100658267B1 (ko) | 2005-08-31 | 2005-08-31 | 플렉시블 디스플레이 제조용 필름 트레이 |
KR10-2005-0080995 | 2005-08-31 |
Publications (2)
Publication Number | Publication Date |
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JP2007067368A JP2007067368A (ja) | 2007-03-15 |
JP4758818B2 true JP4758818B2 (ja) | 2011-08-31 |
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JP2006126660A Expired - Fee Related JP4758818B2 (ja) | 2005-08-31 | 2006-04-28 | フレキシブルディスプレイ製造用フィルムトレイ |
Country Status (5)
Country | Link |
---|---|
US (1) | US7834451B2 (ja) |
JP (1) | JP4758818B2 (ja) |
KR (1) | KR100658267B1 (ja) |
CN (1) | CN100454514C (ja) |
TW (1) | TWI353648B (ja) |
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-
2005
- 2005-08-31 KR KR1020050080995A patent/KR100658267B1/ko active IP Right Grant
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2006
- 2006-04-28 JP JP2006126660A patent/JP4758818B2/ja not_active Expired - Fee Related
- 2006-08-28 TW TW095131556A patent/TWI353648B/zh not_active IP Right Cessation
- 2006-08-29 US US11/512,649 patent/US7834451B2/en not_active Expired - Fee Related
- 2006-08-31 CN CNB2006101123697A patent/CN100454514C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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CN100454514C (zh) | 2009-01-21 |
US7834451B2 (en) | 2010-11-16 |
CN1925127A (zh) | 2007-03-07 |
TWI353648B (en) | 2011-12-01 |
JP2007067368A (ja) | 2007-03-15 |
US20070049033A1 (en) | 2007-03-01 |
TW200723432A (en) | 2007-06-16 |
KR100658267B1 (ko) | 2006-12-14 |
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