JP4753888B2 - 基板保持機構及びプラズマ処理装置 - Google Patents

基板保持機構及びプラズマ処理装置 Download PDF

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Publication number
JP4753888B2
JP4753888B2 JP2007006321A JP2007006321A JP4753888B2 JP 4753888 B2 JP4753888 B2 JP 4753888B2 JP 2007006321 A JP2007006321 A JP 2007006321A JP 2007006321 A JP2007006321 A JP 2007006321A JP 4753888 B2 JP4753888 B2 JP 4753888B2
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JP
Japan
Prior art keywords
substrate
processed
gas
substrate holding
mounting table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007006321A
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English (en)
Japanese (ja)
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JP2008172170A (ja
Inventor
寛 石田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2007006321A priority Critical patent/JP4753888B2/ja
Priority to KR1020080004033A priority patent/KR100929448B1/ko
Priority to TW097101385A priority patent/TWI421970B/zh
Priority to CN2008100034479A priority patent/CN101226894B/zh
Publication of JP2008172170A publication Critical patent/JP2008172170A/ja
Application granted granted Critical
Publication of JP4753888B2 publication Critical patent/JP4753888B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
JP2007006321A 2007-01-15 2007-01-15 基板保持機構及びプラズマ処理装置 Expired - Fee Related JP4753888B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007006321A JP4753888B2 (ja) 2007-01-15 2007-01-15 基板保持機構及びプラズマ処理装置
KR1020080004033A KR100929448B1 (ko) 2007-01-15 2008-01-14 기판 유지 기구 및 플라즈마 처리 장치
TW097101385A TWI421970B (zh) 2007-01-15 2008-01-14 A substrate holding mechanism and a plasma processing device
CN2008100034479A CN101226894B (zh) 2007-01-15 2008-01-15 基板保持机构和等离子体处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007006321A JP4753888B2 (ja) 2007-01-15 2007-01-15 基板保持機構及びプラズマ処理装置

Publications (2)

Publication Number Publication Date
JP2008172170A JP2008172170A (ja) 2008-07-24
JP4753888B2 true JP4753888B2 (ja) 2011-08-24

Family

ID=39699956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007006321A Expired - Fee Related JP4753888B2 (ja) 2007-01-15 2007-01-15 基板保持機構及びプラズマ処理装置

Country Status (4)

Country Link
JP (1) JP4753888B2 (zh)
KR (1) KR100929448B1 (zh)
CN (1) CN101226894B (zh)
TW (1) TWI421970B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010045071A (ja) * 2008-08-08 2010-02-25 Nikon Corp 検知装置、基板保持部材、搬送装置および接合装置
JP5871453B2 (ja) * 2010-05-20 2016-03-01 東京エレクトロン株式会社 プラズマ処理装置，基板保持機構，基板位置ずれ検出方法
JP5689283B2 (ja) * 2010-11-02 2015-03-25 東京エレクトロン株式会社 基板処理方法及びその方法を実行するプログラムを記憶する記憶媒体
CN104538334B (zh) * 2014-12-17 2017-08-08 中国地质大学（北京） 一种多功能等离子体腔室处理系统
KR101632606B1 (ko) * 2014-12-30 2016-06-23 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR101694754B1 (ko) * 2016-09-08 2017-01-11 (주)브이앤아이솔루션 정전척 및 그 제조방법
US9922857B1 (en) * 2016-11-03 2018-03-20 Lam Research Corporation Electrostatically clamped edge ring
KR102397545B1 (ko) 2017-05-02 2022-05-12 삼성전자주식회사 척 스테이지 이물질 감지 장치
KR102056855B1 (ko) * 2018-05-29 2019-12-17 세메스 주식회사 기판 처리 방법 및 장치
JP7203585B2 (ja) * 2018-12-06 2023-01-13 東京エレクトロン株式会社 基板支持器、基板処理装置、基板処理システム、及び基板支持器における接着剤の浸食を検出する方法
JP7058239B2 (ja) * 2019-03-14 2022-04-21 株式会社Kokusai Electric 半導体装置の製造方法、基板処理装置およびプログラム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10144771A (ja) * 1996-11-06 1998-05-29 Sony Corp 半導体製造装置
JP4030030B2 (ja) * 1998-04-24 2008-01-09 キヤノンアネルバ株式会社 静電吸着ホルダの吸着力検出方法と装置
JP2001189374A (ja) * 1999-12-28 2001-07-10 Nikon Corp 基板処理装置及び荷電粒子線露光装置
JP4126286B2 (ja) * 2001-02-08 2008-07-30 東京エレクトロン株式会社 処理装置
TWI226303B (en) * 2002-04-18 2005-01-11 Olympus Corp Substrate carrying device
JP2005116645A (ja) * 2003-10-03 2005-04-28 Matsushita Electric Ind Co Ltd プラズマ処理装置及び半導体装置の製造方法
JP4421874B2 (ja) * 2003-10-31 2010-02-24 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP2006232477A (ja) * 2005-02-24 2006-09-07 Fuji Photo Film Co Ltd シート体位置決め治具及びそれを用いた描画装置

Also Published As

Publication number Publication date
JP2008172170A (ja) 2008-07-24
TW200839931A (en) 2008-10-01
KR20080067305A (ko) 2008-07-18
KR100929448B1 (ko) 2009-12-02
CN101226894A (zh) 2008-07-23
TWI421970B (zh) 2014-01-01
CN101226894B (zh) 2012-07-04

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