JP4751528B2 - ダイボンディング装置 - Google Patents

ダイボンディング装置 Download PDF

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Publication number
JP4751528B2
JP4751528B2 JP2001145397A JP2001145397A JP4751528B2 JP 4751528 B2 JP4751528 B2 JP 4751528B2 JP 2001145397 A JP2001145397 A JP 2001145397A JP 2001145397 A JP2001145397 A JP 2001145397A JP 4751528 B2 JP4751528 B2 JP 4751528B2
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Japan
Prior art keywords
die
bonding
take
slide table
out position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001145397A
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English (en)
Japanese (ja)
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JP2002343815A5 (enExample
JP2002343815A (ja
Inventor
誠 有江
泰雄 岩城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2001145397A priority Critical patent/JP4751528B2/ja
Publication of JP2002343815A publication Critical patent/JP2002343815A/ja
Publication of JP2002343815A5 publication Critical patent/JP2002343815A5/ja
Application granted granted Critical
Publication of JP4751528B2 publication Critical patent/JP4751528B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP2001145397A 2001-05-15 2001-05-15 ダイボンディング装置 Expired - Lifetime JP4751528B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001145397A JP4751528B2 (ja) 2001-05-15 2001-05-15 ダイボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001145397A JP4751528B2 (ja) 2001-05-15 2001-05-15 ダイボンディング装置

Publications (3)

Publication Number Publication Date
JP2002343815A JP2002343815A (ja) 2002-11-29
JP2002343815A5 JP2002343815A5 (enExample) 2008-07-24
JP4751528B2 true JP4751528B2 (ja) 2011-08-17

Family

ID=18991216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001145397A Expired - Lifetime JP4751528B2 (ja) 2001-05-15 2001-05-15 ダイボンディング装置

Country Status (1)

Country Link
JP (1) JP4751528B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1480507B1 (de) * 2003-05-21 2006-07-19 Unaxis International Trading Ltd. Halbleiter-Montageeinrichtung
JP2014060234A (ja) * 2012-09-18 2014-04-03 Hitachi High-Tech Instruments Co Ltd ダイボンダ及びボンディング方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2823329B2 (ja) * 1990-07-02 1998-11-11 ローム株式会社 半導体チップの組立装置
JP3149782B2 (ja) * 1996-05-07 2001-03-26 松下電器産業株式会社 ダイボンディング装置およびダイボンディング方法
JPH11346093A (ja) * 1998-06-02 1999-12-14 Matsushita Electric Ind Co Ltd 部品実装機
JP4267749B2 (ja) * 1999-04-13 2009-05-27 パナソニック株式会社 部品実装方法
JP3792996B2 (ja) * 2000-06-08 2006-07-05 株式会社新川 ダイ及び小物部品の移送装置

Also Published As

Publication number Publication date
JP2002343815A (ja) 2002-11-29

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