JP2002343815A5 - - Google Patents

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Publication number
JP2002343815A5
JP2002343815A5 JP2001145397A JP2001145397A JP2002343815A5 JP 2002343815 A5 JP2002343815 A5 JP 2002343815A5 JP 2001145397 A JP2001145397 A JP 2001145397A JP 2001145397 A JP2001145397 A JP 2001145397A JP 2002343815 A5 JP2002343815 A5 JP 2002343815A5
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JP
Japan
Prior art keywords
die
bonding
out position
slide table
take
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2001145397A
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English (en)
Japanese (ja)
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JP2002343815A (ja
JP4751528B2 (ja
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Application filed filed Critical
Priority to JP2001145397A priority Critical patent/JP4751528B2/ja
Priority claimed from JP2001145397A external-priority patent/JP4751528B2/ja
Publication of JP2002343815A publication Critical patent/JP2002343815A/ja
Publication of JP2002343815A5 publication Critical patent/JP2002343815A5/ja
Application granted granted Critical
Publication of JP4751528B2 publication Critical patent/JP4751528B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2001145397A 2001-05-15 2001-05-15 ダイボンディング装置 Expired - Lifetime JP4751528B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001145397A JP4751528B2 (ja) 2001-05-15 2001-05-15 ダイボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001145397A JP4751528B2 (ja) 2001-05-15 2001-05-15 ダイボンディング装置

Publications (3)

Publication Number Publication Date
JP2002343815A JP2002343815A (ja) 2002-11-29
JP2002343815A5 true JP2002343815A5 (enExample) 2008-07-24
JP4751528B2 JP4751528B2 (ja) 2011-08-17

Family

ID=18991216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001145397A Expired - Lifetime JP4751528B2 (ja) 2001-05-15 2001-05-15 ダイボンディング装置

Country Status (1)

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JP (1) JP4751528B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1480507B1 (de) * 2003-05-21 2006-07-19 Unaxis International Trading Ltd. Halbleiter-Montageeinrichtung
JP2014060234A (ja) * 2012-09-18 2014-04-03 Hitachi High-Tech Instruments Co Ltd ダイボンダ及びボンディング方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2823329B2 (ja) * 1990-07-02 1998-11-11 ローム株式会社 半導体チップの組立装置
JP3149782B2 (ja) * 1996-05-07 2001-03-26 松下電器産業株式会社 ダイボンディング装置およびダイボンディング方法
JPH11346093A (ja) * 1998-06-02 1999-12-14 Matsushita Electric Ind Co Ltd 部品実装機
JP4267749B2 (ja) * 1999-04-13 2009-05-27 パナソニック株式会社 部品実装方法
JP3792996B2 (ja) * 2000-06-08 2006-07-05 株式会社新川 ダイ及び小物部品の移送装置

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