JP4747620B2 - プリント配線板の製造方法 - Google Patents

プリント配線板の製造方法 Download PDF

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Publication number
JP4747620B2
JP4747620B2 JP2005076813A JP2005076813A JP4747620B2 JP 4747620 B2 JP4747620 B2 JP 4747620B2 JP 2005076813 A JP2005076813 A JP 2005076813A JP 2005076813 A JP2005076813 A JP 2005076813A JP 4747620 B2 JP4747620 B2 JP 4747620B2
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JP
Japan
Prior art keywords
printed wiring
wiring board
conductive sheet
manufacturing
hot press
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2005076813A
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English (en)
Japanese (ja)
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JP2006261388A (ja
JP2006261388A5 (ko
Inventor
潤 江原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2005076813A priority Critical patent/JP4747620B2/ja
Publication of JP2006261388A publication Critical patent/JP2006261388A/ja
Publication of JP2006261388A5 publication Critical patent/JP2006261388A5/ja
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Publication of JP4747620B2 publication Critical patent/JP4747620B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2005076813A 2005-03-17 2005-03-17 プリント配線板の製造方法 Expired - Fee Related JP4747620B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005076813A JP4747620B2 (ja) 2005-03-17 2005-03-17 プリント配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005076813A JP4747620B2 (ja) 2005-03-17 2005-03-17 プリント配線板の製造方法

Related Child Applications (1)

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JP2011011646A Division JP2011082575A (ja) 2011-01-24 2011-01-24 プリント配線板の製造用シート

Publications (3)

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JP2006261388A JP2006261388A (ja) 2006-09-28
JP2006261388A5 JP2006261388A5 (ko) 2008-05-01
JP4747620B2 true JP4747620B2 (ja) 2011-08-17

Family

ID=37100291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005076813A Expired - Fee Related JP4747620B2 (ja) 2005-03-17 2005-03-17 プリント配線板の製造方法

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JP (1) JP4747620B2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101107589B1 (ko) * 2011-09-16 2012-01-25 안치욱 두께동 밀착력이 강화된 다층 인쇄회로기판 및 그 제조방법
CN107576686B (zh) * 2017-10-27 2024-06-18 拉梵尼(江苏)智能科技有限公司 一种导热介质材料导热能力测试装置及测试方法
CN114269078B (zh) * 2021-12-28 2024-04-26 深圳市大正科技有限公司 一种用于印刷电路板生产的压合机

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0929773A (ja) * 1995-07-17 1997-02-04 Matsushita Electric Works Ltd 積層板の製造方法
JP2002006662A (ja) * 2000-06-27 2002-01-11 Minolta Co Ltd 定着用加熱部材及び定着用加圧部材
JP2002094214A (ja) * 2000-09-13 2002-03-29 Sato Shoji Corp 基板製造方法及び基板製造装置並びにこの基板製造方法に用いる片面絶縁シート

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JP2006261388A (ja) 2006-09-28

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