JP4739318B2 - 積層型チップキャパシタ - Google Patents

積層型チップキャパシタ Download PDF

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Publication number
JP4739318B2
JP4739318B2 JP2007333252A JP2007333252A JP4739318B2 JP 4739318 B2 JP4739318 B2 JP 4739318B2 JP 2007333252 A JP2007333252 A JP 2007333252A JP 2007333252 A JP2007333252 A JP 2007333252A JP 4739318 B2 JP4739318 B2 JP 4739318B2
Authority
JP
Japan
Prior art keywords
capacitor
external electrodes
multilayer chip
capacitor body
size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007333252A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008193062A (ja
Inventor
ファ リー、ビョン
クォン ウィ、サン
スーク チャン、ヘ
ソク パク、ドン
ス パク、サン
チョル パク、ミン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2008193062A publication Critical patent/JP2008193062A/ja
Application granted granted Critical
Publication of JP4739318B2 publication Critical patent/JP4739318B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
JP2007333252A 2007-01-31 2007-12-25 積層型チップキャパシタ Expired - Fee Related JP4739318B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2007-0009913 2007-01-31
KR1020070009913A KR100900673B1 (ko) 2007-01-31 2007-01-31 적층형 칩 커패시터

Publications (2)

Publication Number Publication Date
JP2008193062A JP2008193062A (ja) 2008-08-21
JP4739318B2 true JP4739318B2 (ja) 2011-08-03

Family

ID=39667699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007333252A Expired - Fee Related JP4739318B2 (ja) 2007-01-31 2007-12-25 積層型チップキャパシタ

Country Status (3)

Country Link
US (1) US7733628B2 (ko)
JP (1) JP4739318B2 (ko)
KR (1) KR100900673B1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5867421B2 (ja) * 2012-05-08 2016-02-24 株式会社村田製作所 セラミック電子部品及び電子装置
KR20140038872A (ko) * 2013-07-17 2014-03-31 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
CN117153563A (zh) * 2017-05-15 2023-12-01 京瓷Avx元器件公司 多层电容器和包括其的电路板
JP2022520615A (ja) 2019-02-13 2022-03-31 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション 導電性ビアを含む積層セラミックコンデンサ
JP2021136296A (ja) * 2020-02-26 2021-09-13 富士フイルムビジネスイノベーション株式会社 発光装置、光学装置及び計測装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06176961A (ja) * 1992-12-10 1994-06-24 Tdk Corp 貫通形積層セラミックコンデンサ
JP3340625B2 (ja) * 1996-07-04 2002-11-05 株式会社村田製作所 表面実装型セラミック電子部品
US5880925A (en) * 1997-06-27 1999-03-09 Avx Corporation Surface mount multilayer capacitor
JPH1167585A (ja) * 1997-08-11 1999-03-09 Murata Mfg Co Ltd 積層電子部品
US6266228B1 (en) * 1997-11-10 2001-07-24 Murata Manufacturing Co., Ltd Multilayer capacitor
JPH11176689A (ja) * 1997-12-12 1999-07-02 Matsushita Electric Ind Co Ltd コンデンサ及び製造方法
JP3336954B2 (ja) * 1998-05-21 2002-10-21 株式会社村田製作所 積層コンデンサ
JP4000701B2 (ja) * 1999-01-14 2007-10-31 株式会社村田製作所 積層コンデンサ
JP3476127B2 (ja) * 1999-05-10 2003-12-10 株式会社村田製作所 積層コンデンサ
JP2001155953A (ja) * 1999-11-26 2001-06-08 Tdk Corp 三次元搭載用多端子積層セラミックコンデンサ
TWI260657B (en) * 2002-04-15 2006-08-21 Avx Corp Plated terminations
JP3833145B2 (ja) * 2002-06-11 2006-10-11 Ｔｄｋ株式会社 積層貫通型コンデンサ
JP4120336B2 (ja) 2002-09-27 2008-07-16 株式会社村田製作所 チップ型電子部品及びその製造方法
JP2004342846A (ja) 2003-05-15 2004-12-02 Tdk Corp 積層セラミックコンデンサ
US7068490B2 (en) * 2004-04-16 2006-06-27 Kemet Electronics Corporation Thermal dissipating capacitor and electrical component comprising same
US7092236B2 (en) * 2005-01-20 2006-08-15 Samsung Electro-Mechanics Co., Ltd. Multilayer chip capacitor
JP4046296B2 (ja) * 2006-04-05 2008-02-13 Ｔｄｋ株式会社 積層型電子部品

Also Published As

Publication number Publication date
US20080180879A1 (en) 2008-07-31
US7733628B2 (en) 2010-06-08
JP2008193062A (ja) 2008-08-21
KR20080071701A (ko) 2008-08-05
KR100900673B1 (ko) 2009-06-01

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