JP4733519B2 - 半導体装置の製造方法及びこの方法で得られた半導体装置 - Google Patents
半導体装置の製造方法及びこの方法で得られた半導体装置 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 20
- 239000004065 semiconductor Substances 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000011109 contamination Methods 0.000 claims description 23
- 238000000151 deposition Methods 0.000 claims description 20
- 239000002019 doping agent Substances 0.000 claims description 17
- 230000008021 deposition Effects 0.000 claims description 15
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 12
- 239000007789 gas Substances 0.000 claims description 12
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 7
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 229910021529 ammonia Inorganic materials 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 238000005137 deposition process Methods 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 18
- 229910052796 boron Inorganic materials 0.000 description 18
- 239000000758 substrate Substances 0.000 description 9
- 238000011282 treatment Methods 0.000 description 7
- 125000004429 atom Chemical group 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 239000011574 phosphorus Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000012495 reaction gas Substances 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- WXRGABKACDFXMG-UHFFFAOYSA-N trimethylborane Chemical compound CB(C)C WXRGABKACDFXMG-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000013024 dilution buffer Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004573 interface analysis Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
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Description
−pドープ層は、余剰量の正電荷キャリアを有し、
−nドープ層は、余剰量の負電荷キャリアを有し、及び
−i層は真性である。
−真空回路11に接続されている真空室10、
−該真空室10の内側に配されている熱壁内部室12、
−該内部室12の内側に配されている無線周波数の電源に接続された電極13、及び
−該電極13内に組み入れられると共に複数の異なるガス供給路に接続され、適切な反応物を導入するシャワー頭部14
を有している。
−p層を形成するためのシラン、メタン、及び水素、並びに
−該層を硼素でドープするためのトリメチル硼素(TMB)
である。
Claims (8)
- ドープ剤でドープされた少なくとも1つの層と該ドープされた層上に堆積される他の型の層とを有する半導体装置を単一の反応室内で製造する方法であって、前記ドープされた層の堆積工程と前記他の型の層の堆積工程との間に、前記ドープ剤による前記他の層の汚染を避けるための操作が挿入され、
前記操作が、前記ドープ剤と反応可能な化合物を前記反応室に、0.05〜100 mbar、100〜350℃で10分未満の条件で、添加することを含み、
前記化合物が、水、メタノール、イソプロパノール、アンモニア、ヒドラジン、及び揮発性有機アミンからなる群より選択される1種の蒸気又は気体であることを特徴とする方法。 - 前記請求項1に記載の方法で製造されて成る半導体装置であって、
ドープ剤でドープされた少なくとも1つの層と該ドープされた層上に堆積される他の型の層とを有し、前記ドープ剤によって前記他の型の層が汚染されるのを避けるための前記操作の結果として、前記ドープされた層と他の型の層との間の接合部が1019原子個数・cm-3よりも多い酸素を含有することを特徴とする半導体装置。 - 前記請求項1に記載の方法で製造されて成る半導体装置であって、
ドープ剤でドープされた少なくとも1つの層と該ドープされた層上に堆積される他の型の層とを有し、前記ドープ剤によって前記他の型の層が汚染されるのを避けるための前記操作の結果として、前記ドープされた層と他の型の層との間の接合部が1019原子個数・cm-3よりも多い窒素を含有することを特徴とする半導体装置。 - 前記ドープされた層がpドープ層であることを特徴とする、請求項1に記載の方法。
- 前記ドープされた層がnドープ層であることを特徴とする、請求項1に記載の方法。
- 前記操作の後にpドープ層への緩衝層の堆積が行われることを特徴とする、請求項4に記載の方法。
- 前記反応室は、無線周波数電極を有するプラズマ強化化学蒸着システムが構築されており、前記ドープされた層の堆積工程と前記他の型の層の堆積工程とでは、前記無線周波数電極がオンになっており、
前記操作中は前記無線周波数電極がオフになっていることを特徴とする、請求項1、4〜6のいずれか一項に記載の方法。 - 前記操作の結果として、安定なドープ剤の化合物が形成されることを特徴とする請求項1、4〜7のいずれか一項に記載の方法。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42117102P | 2002-10-25 | 2002-10-25 | |
US60/421,171 | 2002-10-25 | ||
US43976403P | 2003-01-13 | 2003-01-13 | |
US60/439,764 | 2003-01-13 | ||
US47667003P | 2003-06-06 | 2003-06-06 | |
US60/476,670 | 2003-06-06 | ||
PCT/CH2003/000685 WO2004038774A2 (en) | 2002-10-25 | 2003-10-22 | Method for producing semi-conducting devices and devices obtained with this method |
Publications (2)
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JP2006504283A JP2006504283A (ja) | 2006-02-02 |
JP4733519B2 true JP4733519B2 (ja) | 2011-07-27 |
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JP2005501493A Expired - Fee Related JP4733519B2 (ja) | 2002-10-25 | 2003-10-22 | 半導体装置の製造方法及びこの方法で得られた半導体装置 |
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Country | Link |
---|---|
US (3) | US7344909B2 (ja) |
EP (1) | EP1554413B1 (ja) |
JP (1) | JP4733519B2 (ja) |
KR (1) | KR101015161B1 (ja) |
AU (1) | AU2003269667A1 (ja) |
WO (1) | WO2004038774A2 (ja) |
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DE102004003761A1 (de) * | 2004-01-23 | 2005-08-25 | Forschungszentrum Jülich GmbH | Herstellungsverfahren für Siliziumsolarzellen umfassend µc-Siliziumschichten |
TWI375083B (en) * | 2006-09-12 | 2012-10-21 | Mutual Tek Ind Co Ltd | Light emitting apparatus and method for the same |
KR101046520B1 (ko) | 2007-09-07 | 2011-07-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 내부 챔버 상의 부산물 막 증착을 제어하기 위한 pecvd 시스템에서의 소스 가스 흐름 경로 제어 |
WO2010020544A1 (en) * | 2008-08-19 | 2010-02-25 | Oerlikon Solar Ip Ag, Truebbach | Improvement of electrical and optical properties of silicon solar cells |
US8652871B2 (en) * | 2008-08-29 | 2014-02-18 | Tel Solar Ag | Method for depositing an amorphous silicon film for photovoltaic devices with reduced light-induced degradation for improved stabilized performance |
DE102009051347A1 (de) * | 2009-10-30 | 2011-05-12 | Sunfilm Ag | Verfahren zur Herstellung von Halbleiterschichten |
EP2517267A2 (en) | 2009-12-22 | 2012-10-31 | Oerlikon Solar AG, Trübbach | Thin-film silicon tandem solar cell and method for manufacturing the same |
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- 2003-10-22 EP EP03750232.5A patent/EP1554413B1/en not_active Expired - Lifetime
- 2003-10-22 AU AU2003269667A patent/AU2003269667A1/en not_active Abandoned
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AU2003269667A8 (en) | 2004-05-13 |
US7344909B2 (en) | 2008-03-18 |
WO2004038774A3 (en) | 2004-09-10 |
AU2003269667A1 (en) | 2004-05-13 |
KR20050060097A (ko) | 2005-06-21 |
US20040135221A1 (en) | 2004-07-15 |
WO2004038774A2 (en) | 2004-05-06 |
US7504279B2 (en) | 2009-03-17 |
JP2006504283A (ja) | 2006-02-02 |
KR101015161B1 (ko) | 2011-02-16 |
EP1554413B1 (en) | 2013-07-24 |
US20090127673A1 (en) | 2009-05-21 |
EP1554413A2 (en) | 2005-07-20 |
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