JP4731911B2 - 特にレーザ焼結の際に使用するための円形粒子状プラスチック粉末、このような粉末の製造方法およびこのような粉末を使用するレーザ焼結プロセス - Google Patents
特にレーザ焼結の際に使用するための円形粒子状プラスチック粉末、このような粉末の製造方法およびこのような粉末を使用するレーザ焼結プロセス Download PDFInfo
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- JP4731911B2 JP4731911B2 JP2004556082A JP2004556082A JP4731911B2 JP 4731911 B2 JP4731911 B2 JP 4731911B2 JP 2004556082 A JP2004556082 A JP 2004556082A JP 2004556082 A JP2004556082 A JP 2004556082A JP 4731911 B2 JP4731911 B2 JP 4731911B2
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- 239000000843 powder Substances 0.000 title claims abstract description 117
- 238000000149 argon plasma sintering Methods 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims description 27
- 229920003023 plastic Polymers 0.000 title description 15
- 239000004033 plastic Substances 0.000 title description 15
- 239000002245 particle Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 21
- 229920000642 polymer Polymers 0.000 claims description 18
- 238000001556 precipitation Methods 0.000 claims description 8
- 238000000227 grinding Methods 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 2
- 239000004482 other powder Substances 0.000 claims 4
- 230000000996 additive effect Effects 0.000 claims 2
- 238000009826 distribution Methods 0.000 description 11
- 239000008187 granular material Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000004952 Polyamide Substances 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 238000009700 powder processing Methods 0.000 description 4
- 238000001878 scanning electron micrograph Methods 0.000 description 4
- 239000002537 cosmetic Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 239000002648 laminated material Substances 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 229920006017 homo-polyamide Polymers 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
- C08J3/14—Powdering or granulating by precipitation from solutions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J2377/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Description
・対応するモノマーの重合中に直接(例えば、懸濁重合の際に)、
・各プラスチックおよび必要な粉砕の程度に適しているミルで機械的に粉砕することにより、
・高圧下で溶液/融解物が押し出される適当なノズルによりプラスチックの溶液および融解物をスプレーすることにより、
・適当な溶媒内にプラスチックを溶解し、温度を下げるか、および/または溶液内のポリマー濃度を増大させて沈殿させることにより作られる。
・静電粉末コーティング;
・コイル・コーティング・ワニスへの追加。
その後で、基礎粉末を、特許文献3に記載されている方法により、Nara社の市販の粉末処理機械NHS−1で処理した。処理時間は1分であり、回転数は8000rpmであった。
基礎粉末を例1のように処理したが、処理時間は1分ではなく3分であった。
その後で、基礎粉末を、市販のミキサによりシヤー・ミキシングして処理した。この場合、アジテータの回転数は、10分以内に140℃に加熱する粉末に従って調整した。次に、もう5分間の間140℃の一定の温度に維持するために回転数を下げた。
基礎粉末を例3のように処理したが、保持時間は10分であった。
2 上縁部
3 物体
4 キャリア
5 キャリア面
6 動作面
7 レーザ
8 光ビーム
8′ 偏光ビーム
9 偏光デバイス
11 粉末材料
Claims (6)
- レーザ焼結のためのポリマー粉末を製造する方法であって、前記ポリマー粉末は、出発の基礎材料として、沈殿または粉砕により得たPA12粉末を使用したものであり、前記ポリマー粉末を、更に、BET面積が4m 2 /gより小さいかまたは等しい値を有し且つ同時に粒径の上限が100μm未満で、D 0.9 値が90μm未満で、D 0. 1 値が32μm未満で、D 0.5 値が60μm未満であり、前記ポリマー粉末の粒子が基本的に球形をしているように、少なくとも一分間機械的または機械的熱的に混合することを特徴とするポリマー粉末の製造方法。
- 請求項1に記載のポリマー粉末の製造方法において、前記基礎材料が少なくとも1つの他の粉末成分を含むことを特徴とするポリマー粉末の製造方法。
- 請求項2に記載のポリマー粉末の製造方法において、前記粉末の他の粉末成分がポリマー粉末または添加物であることを特徴とするポリマー粉末の製造方法。
- レーザ焼結により三次元物体を製造するための方法であって、前記物体に対応する位置に、凝固可能な粉末材料を供給して凝固することを繰り返すことで、凝固した前記粉末材料が積み重ねられた積層から前記物体が形成され、PA12粉末を粉末材料として使用し、前記粉末材料は、沈殿または粉砕により製造され、且つBET面積が4m 2 /gより小さいかまたは等しい値を有し、同時に粒径の上限が100μm未満で、D 0.9 値が90μm未満で、D 0. 1 値が32μm未満で、D 0.5 値が60μm未満であり、前記粉末の粒子が基本的に球形をしていることを特徴とする三次元物体の製造方法。
- 請求項4に記載の三次元物体の製造方法において、前記粉末基礎材料が、少なくとも1つの他の粉末成分を含むことを特徴とする三次元物体の製造方法。
- 請求項5に記載の三次元物体の製造方法において、他の粉末成分がポリマー粉末または添加物であることを特徴とする三次元物体の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10256097A DE10256097A1 (de) | 2002-12-02 | 2002-12-02 | Kunststoffpulver für das Lasersintern |
DE10256097.8 | 2002-12-02 | ||
PCT/EP2003/011032 WO2004050746A1 (de) | 2002-12-02 | 2003-10-06 | Verrundetes kunststoffpulver, insbesondere zur verwendung beim lasersintern, verfahren zur herstellung eines solchen pulvers und lasersinterverfahren, das ein solches pulver verwendet |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006508217A JP2006508217A (ja) | 2006-03-09 |
JP4731911B2 true JP4731911B2 (ja) | 2011-07-27 |
Family
ID=32318873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004556082A Expired - Fee Related JP4731911B2 (ja) | 2002-12-02 | 2003-10-06 | 特にレーザ焼結の際に使用するための円形粒子状プラスチック粉末、このような粉末の製造方法およびこのような粉末を使用するレーザ焼結プロセス |
Country Status (6)
Country | Link |
---|---|
US (3) | US7601422B2 (ja) |
EP (1) | EP1537170B1 (ja) |
JP (1) | JP4731911B2 (ja) |
AT (1) | ATE386066T1 (ja) |
DE (2) | DE10256097A1 (ja) |
WO (1) | WO2004050746A1 (ja) |
Families Citing this family (37)
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DE10256097A1 (de) * | 2002-12-02 | 2004-06-17 | Eos Gmbh Electro Optical Systems | Kunststoffpulver für das Lasersintern |
DE102004024440B4 (de) * | 2004-05-14 | 2020-06-25 | Evonik Operations Gmbh | Polymerpulver mit Polyamid, Verwendung in einem formgebenden Verfahren und Formkörper, hergestellt aus diesem Polymerpulver |
DE102005033379A1 (de) * | 2005-07-16 | 2007-01-18 | Degussa Ag | Verwendung von cyclischen Oligomeren in einem formgebenden Verfahren und Formkörper, hergestellt nach diesem Verfahren |
DE102006015791A1 (de) | 2006-04-01 | 2007-10-04 | Degussa Gmbh | Polymerpulver, Verfahren zur Herstellung und Verwendung eines solchen Pulvers und Formkörper daraus |
DE102006023484A1 (de) * | 2006-05-18 | 2007-11-22 | Eos Gmbh Electro Optical Systems | Vorrichtung und Verfahren zum schichtweisen Herstellen eines dreidimensionalen Objekts aus einem pulverförmigen Aufbaumaterial |
DE102007016656B4 (de) | 2007-04-05 | 2018-10-11 | Eos Gmbh Electro Optical Systems | PAEK-Pulver, insbesondere zur Verwendung in einem Verfahren zum schichtweisen Herstellen eines dreidimensionalen Objektes, sowie Verfahren zu dessen Herstellung |
DE102008000755B4 (de) | 2008-03-19 | 2019-12-12 | Evonik Degussa Gmbh | Copolyamidpulver und dessen Herstellung, Verwendung von Copolyamidpulver in einem formgebenden Verfahren und Formkörper, hergestellt aus diesem Copolyamidpulver |
DE102008022946B4 (de) | 2008-05-09 | 2014-02-13 | Fit Fruth Innovative Technologien Gmbh | Vorrichtung und Verfahren zum Aufbringen von Pulvern oder Pasten |
FR2939075B1 (fr) | 2008-12-01 | 2010-12-17 | Rhodia Operations | Realisation d'article par fusion selective de couches de poudre de polymere |
EP2368696B2 (de) * | 2010-03-25 | 2018-07-18 | EOS GmbH Electro Optical Systems | Auffrischoptimiertes PA 12-Pulver zur Verwendung in einem generativen Schichtbauverfahren |
DE102010046468B4 (de) * | 2010-09-24 | 2016-04-07 | MTU Aero Engines AG | Generatives Herstellverfahren und Pulver hierzu |
EP3957664A1 (en) | 2010-09-27 | 2022-02-23 | Arkema Inc. | Heat treated polymer powders |
DE102011007067A1 (de) | 2011-04-08 | 2012-10-11 | Siemens Aktiengesellschaft | Verfahren zum selektiven Laserschmelzen und Anlage zur Durchführung diesen Verfahrens |
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JP6450862B2 (ja) | 2015-12-22 | 2019-01-09 | ストラクチャード ポリマーズ, インコーポレイテッドStructured Polymers, Inc. | 消耗性粉末を製造するためのシステム及び方法 |
JP6402810B1 (ja) | 2016-07-22 | 2018-10-10 | 株式会社リコー | 立体造形用樹脂粉末、立体造形物の製造装置、及び立体造形物の製造方法 |
JP7043865B2 (ja) | 2017-03-14 | 2022-03-30 | 株式会社リコー | 立体造形用樹脂粉末、及び立体造形物の製造装置 |
EP3375608B1 (en) | 2017-03-17 | 2021-05-05 | Ricoh Company, Ltd. | Resin powder for solid freeform fabrication and device for solid freeform fabrication object |
EP3376413A1 (en) | 2017-03-17 | 2018-09-19 | Siemens Aktiengesellschaft | Automatical generation of escape holes in a cad model for powder removal during additive manufacturing |
JP7081350B2 (ja) | 2017-11-09 | 2022-06-07 | 株式会社リコー | 立体造形用樹脂粉末、立体造形物の製造装置、立体造形物の製造方法、及び立体造形用樹脂粉末の製造方法 |
EP3482900B1 (en) | 2017-11-09 | 2021-06-09 | Ricoh Company, Ltd. | Particle for solid freeform fabrication |
CN108084463B (zh) * | 2017-12-06 | 2020-08-28 | 浙江华正新材料股份有限公司 | 一种尼龙6微粉的制备方法及其应用 |
JP6547014B1 (ja) | 2018-01-23 | 2019-07-17 | ダイキン工業株式会社 | 造形用粉末 |
DE102018206236A1 (de) | 2018-04-23 | 2019-10-24 | Eos Gmbh Electro Optical Systems | Verfahren zum Herstellen eines mindestens ein Polymer umfassenden Pulvers sowie derartiges Pulver |
CN112384359A (zh) | 2018-06-29 | 2021-02-19 | 3M创新有限公司 | 加层制造方法和制品 |
JP7338316B2 (ja) | 2018-08-31 | 2023-09-05 | 株式会社リコー | 樹脂粉末、及び立体造形物の製造方法 |
EP3620283B1 (en) | 2018-09-07 | 2022-03-30 | Ricoh Company, Ltd. | Resin powder, as well as method of and device for manufacturing a solid freeform object using said powder |
DE102020200574A1 (de) | 2020-01-20 | 2021-07-22 | Volkswagen Aktiengesellschaft | Verfahren und System zur Nachbehandlung von mittels additiven Fertigungsverfahren hergestellten Objekten |
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-
2002
- 2002-12-02 DE DE10256097A patent/DE10256097A1/de not_active Ceased
-
2003
- 2003-10-06 DE DE50309169T patent/DE50309169D1/de not_active Expired - Lifetime
- 2003-10-06 JP JP2004556082A patent/JP4731911B2/ja not_active Expired - Fee Related
- 2003-10-06 EP EP03769351A patent/EP1537170B1/de not_active Revoked
- 2003-10-06 US US10/537,415 patent/US7601422B2/en not_active Expired - Lifetime
- 2003-10-06 WO PCT/EP2003/011032 patent/WO2004050746A1/de active IP Right Grant
- 2003-10-06 AT AT03769351T patent/ATE386066T1/de not_active IP Right Cessation
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2009
- 2009-06-26 US US12/493,017 patent/US20090321998A1/en not_active Abandoned
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2011
- 2011-11-23 US US13/303,796 patent/US20120070666A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH05222208A (ja) * | 1992-02-10 | 1993-08-31 | Nisshinbo Ind Inc | 高分子真球状粒子及び製造方法 |
JPH05220375A (ja) * | 1992-02-12 | 1993-08-31 | Nara Kikai Seisakusho:Kk | 固体粒子の表面改質方法と装置 |
JP2000504642A (ja) * | 1996-02-07 | 2000-04-18 | ディーティーエム・コーポレーション | 所定の粒径分布を持つポリマー粉体 |
JPH10292052A (ja) * | 1997-03-05 | 1998-11-04 | Huels Ag | 狭い粒度分布および低い多孔度を有するポリアミドの沈殿粉末の製造方法および該沈殿粉末の使用 |
Also Published As
Publication number | Publication date |
---|---|
DE10256097A1 (de) | 2004-06-17 |
WO2004050746A8 (de) | 2004-10-07 |
EP1537170A1 (de) | 2005-06-08 |
DE50309169D1 (de) | 2008-03-27 |
WO2004050746A1 (de) | 2004-06-17 |
US20060246287A1 (en) | 2006-11-02 |
JP2006508217A (ja) | 2006-03-09 |
EP1537170B1 (de) | 2008-02-13 |
US20120070666A1 (en) | 2012-03-22 |
US20090321998A1 (en) | 2009-12-31 |
ATE386066T1 (de) | 2008-03-15 |
US7601422B2 (en) | 2009-10-13 |
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