JP4707725B2 - パッケージ型圧電振動子及びパッケージ型圧電振動子の製造方法 - Google Patents

パッケージ型圧電振動子及びパッケージ型圧電振動子の製造方法 Download PDF

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Publication number
JP4707725B2
JP4707725B2 JP2008039282A JP2008039282A JP4707725B2 JP 4707725 B2 JP4707725 B2 JP 4707725B2 JP 2008039282 A JP2008039282 A JP 2008039282A JP 2008039282 A JP2008039282 A JP 2008039282A JP 4707725 B2 JP4707725 B2 JP 4707725B2
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Japan
Prior art keywords
electrode
wafer
base body
hole
surface side
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Expired - Fee Related
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JP2008039282A
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English (en)
Japanese (ja)
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JP2008236741A (ja
JP2008236741A5 (enExample
Inventor
岳寛 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
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Nihon Dempa Kogyo Co Ltd
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Priority to JP2008039282A priority Critical patent/JP4707725B2/ja
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0595—Holders or supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2008039282A 2007-02-20 2008-02-20 パッケージ型圧電振動子及びパッケージ型圧電振動子の製造方法 Expired - Fee Related JP4707725B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008039282A JP4707725B2 (ja) 2007-02-20 2008-02-20 パッケージ型圧電振動子及びパッケージ型圧電振動子の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007039760 2007-02-20
JP2007039760 2007-02-20
JP2008039282A JP4707725B2 (ja) 2007-02-20 2008-02-20 パッケージ型圧電振動子及びパッケージ型圧電振動子の製造方法

Publications (3)

Publication Number Publication Date
JP2008236741A JP2008236741A (ja) 2008-10-02
JP2008236741A5 JP2008236741A5 (enExample) 2010-12-16
JP4707725B2 true JP4707725B2 (ja) 2011-06-22

Family

ID=39710170

Family Applications (1)

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JP2008039282A Expired - Fee Related JP4707725B2 (ja) 2007-02-20 2008-02-20 パッケージ型圧電振動子及びパッケージ型圧電振動子の製造方法

Country Status (3)

Country Link
US (1) US8179023B2 (enExample)
JP (1) JP4707725B2 (enExample)
WO (1) WO2008102900A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5277866B2 (ja) * 2008-10-29 2013-08-28 セイコーエプソン株式会社 圧電振動片、および圧電デバイス
JP5239784B2 (ja) * 2008-11-28 2013-07-17 株式会社大真空 圧電振動デバイス
CN102265514B (zh) * 2008-12-24 2014-03-12 株式会社大真空 压电振动设备、压电振动设备的制造方法以及构成压电振动设备的结构构件的蚀刻方法
JPWO2010079803A1 (ja) * 2009-01-07 2012-06-28 株式会社大真空 圧電振動デバイスの製造方法
JP2011071488A (ja) * 2009-08-31 2011-04-07 Taiheiyo Cement Corp 圧電アクチュエータユニットおよびその製造方法
JP2011160350A (ja) * 2010-02-03 2011-08-18 Seiko Instruments Inc 圧電振動片、圧電振動子、圧電振動子の製造方法、発振器、電子機器および電波時計
JP2011199672A (ja) * 2010-03-19 2011-10-06 Seiko Instruments Inc ガラス基板の接合方法、ガラス接合体、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計
JP5325151B2 (ja) * 2010-03-31 2013-10-23 日本電波工業株式会社 水晶デバイス、及びその製造方法
US9985198B1 (en) 2010-06-15 2018-05-29 Hrl Laboratories, Llc High Q quartz-based MEMS resonators and methods of fabricating same
US10141906B1 (en) * 2010-06-15 2018-11-27 Hrl Laboratories, Llc High Q quartz-based MEMS resonators and method of fabricating same
JP2012186709A (ja) * 2011-03-07 2012-09-27 Nippon Dempa Kogyo Co Ltd 圧電振動片及び圧電デバイス
JP5788728B2 (ja) * 2011-07-21 2015-10-07 日本電波工業株式会社 圧電振動片、圧電デバイス、及び圧電デバイスの製造方法
JP2013219540A (ja) * 2012-04-09 2013-10-24 Nippon Dempa Kogyo Co Ltd 圧電デバイス
JP6017189B2 (ja) * 2012-06-12 2016-10-26 日本電波工業株式会社 圧電振動片及び圧電デバイス
JP6167494B2 (ja) * 2012-09-26 2017-07-26 セイコーエプソン株式会社 電子デバイス用容器の製造方法、電子デバイスの製造方法、電子デバイス、電子機器及び移動体機器
US9083263B2 (en) * 2012-12-13 2015-07-14 Schlumberger Technology Corporation Apparatus to provide a time reference
JP6135296B2 (ja) * 2013-05-20 2017-05-31 富士通株式会社 パッケージ構造及びパッケージ構造を基板に接合する方法
KR102029501B1 (ko) 2014-11-24 2019-10-07 삼성전기주식회사 수정진동자 패키지
KR102105391B1 (ko) 2014-12-23 2020-04-28 삼성전기주식회사 수정진동자 패키지
JP6573462B2 (ja) * 2015-03-09 2019-09-11 リバーエレテック株式会社 水晶振動子
CN115296640A (zh) * 2022-10-08 2022-11-04 深圳新声半导体有限公司 一种微机电声波谐振器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4639631A (en) * 1985-07-01 1987-01-27 Motorola, Inc. Electrostatically sealed piezoelectric device
EP0651449B1 (en) * 1993-11-01 2002-02-13 Matsushita Electric Industrial Co., Ltd. Electronic component and method for producing the same
JPH08335839A (ja) 1995-06-07 1996-12-17 Matsushita Electric Ind Co Ltd 振動子の製造方法
DE19649332C1 (de) * 1996-11-28 1998-01-22 Tele Quarz Gmbh Resonator mit Kristall
JPH10209795A (ja) 1997-01-17 1998-08-07 Matsushita Electric Ind Co Ltd 振動子及びその製造方法
JPH10209799A (ja) 1997-01-24 1998-08-07 Matsushita Electric Ind Co Ltd 振動子
JP3390348B2 (ja) 1998-08-21 2003-03-24 セイコーインスツルメンツ株式会社 水晶振動子およびその製造方法
JP2006180168A (ja) 2004-12-22 2006-07-06 Kyocera Kinseki Corp 水晶振動子パッケージ

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Publication number Publication date
JP2008236741A (ja) 2008-10-02
US20100117489A1 (en) 2010-05-13
US8179023B2 (en) 2012-05-15
WO2008102900A1 (ja) 2008-08-28

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