JP4698178B2 - 被研磨物保持用キャリア - Google Patents

被研磨物保持用キャリア Download PDF

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Publication number
JP4698178B2
JP4698178B2 JP2004205737A JP2004205737A JP4698178B2 JP 4698178 B2 JP4698178 B2 JP 4698178B2 JP 2004205737 A JP2004205737 A JP 2004205737A JP 2004205737 A JP2004205737 A JP 2004205737A JP 4698178 B2 JP4698178 B2 JP 4698178B2
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JP
Japan
Prior art keywords
carrier
silicon wafer
thickness
holding
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004205737A
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English (en)
Japanese (ja)
Other versions
JP2006026760A (ja
JP2006026760A5 (enExample
Inventor
仁志 長山
弘明 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Priority to JP2004205737A priority Critical patent/JP4698178B2/ja
Publication of JP2006026760A publication Critical patent/JP2006026760A/ja
Publication of JP2006026760A5 publication Critical patent/JP2006026760A5/ja
Application granted granted Critical
Publication of JP4698178B2 publication Critical patent/JP4698178B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2004205737A 2004-07-13 2004-07-13 被研磨物保持用キャリア Expired - Fee Related JP4698178B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004205737A JP4698178B2 (ja) 2004-07-13 2004-07-13 被研磨物保持用キャリア

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004205737A JP4698178B2 (ja) 2004-07-13 2004-07-13 被研磨物保持用キャリア

Publications (3)

Publication Number Publication Date
JP2006026760A JP2006026760A (ja) 2006-02-02
JP2006026760A5 JP2006026760A5 (enExample) 2007-08-30
JP4698178B2 true JP4698178B2 (ja) 2011-06-08

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ID=35893703

Family Applications (1)

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JP2004205737A Expired - Fee Related JP4698178B2 (ja) 2004-07-13 2004-07-13 被研磨物保持用キャリア

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JP (1) JP4698178B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006090661A1 (ja) * 2005-02-25 2006-08-31 Shin-Etsu Handotai Co., Ltd. 両面研磨装置用キャリアおよびこれを用いた両面研磨装置、両面研磨方法
JP4904960B2 (ja) * 2006-07-18 2012-03-28 信越半導体株式会社 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法
JP5452984B2 (ja) * 2009-06-03 2014-03-26 不二越機械工業株式会社 ウェーハの両面研磨方法
JP4605564B1 (ja) * 2009-09-28 2011-01-05 株式会社白崎製作所 脆性薄板研磨装置用ホルダ、およびその製造方法
JP5807648B2 (ja) 2013-01-29 2015-11-10 信越半導体株式会社 両面研磨装置用キャリア及びウェーハの両面研磨方法
JP7435436B2 (ja) 2020-12-24 2024-02-21 株式会社Sumco キャリアプレートの研磨方法
JP7613413B2 (ja) * 2022-04-19 2025-01-15 株式会社Sumco 両面研磨用キャリア及びこれを用いたシリコンウェーハの両面研磨方法及び装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0426117A (ja) * 1990-05-22 1992-01-29 Kawasaki Steel Corp 半導体素子ウエハのラッピング装置
JPH0671556A (ja) * 1992-08-24 1994-03-15 Murata Mfg Co Ltd ラッピング装置
JPH0941199A (ja) * 1995-08-02 1997-02-10 Sumitomo Metal Mining Co Ltd 表面被覆膜の剥離方法
JPH10330123A (ja) * 1997-05-27 1998-12-15 Asahi Glass Co Ltd ガラス成形用金型及びガラス成形方法
JPH1190817A (ja) * 1997-09-18 1999-04-06 Oputonikusu Seimitsu:Kk ラッピングキャリアおよびその製造方法
JP3909619B2 (ja) * 1998-05-19 2007-04-25 独立行政法人理化学研究所 磁気ディスク基板の鏡面加工装置及び方法
JP2000015565A (ja) * 1998-06-30 2000-01-18 Toshiba Ceramics Co Ltd キャリア
JP2001105303A (ja) * 1999-10-04 2001-04-17 U T K Syst:Kk 両面研磨用キャリア
DE10023002B4 (de) * 2000-05-11 2006-10-26 Siltronic Ag Satz von Läuferscheiben sowie dessen Verwendung
JP2002018707A (ja) * 2000-07-03 2002-01-22 Puroshiido:Kk ディスク研磨機のワークキャリア
US20070184662A1 (en) * 2004-06-23 2007-08-09 Komatsu Denshi Kinzoku Kabushiki Kaisha Double-side polishing carrier and fabrication method thereof

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Publication number Publication date
JP2006026760A (ja) 2006-02-02

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